KR102209919B1 - 수지 성형품의 제조 장치, 수지 성형 시스템, 및 수지 성형품의 제조 방법 - Google Patents

수지 성형품의 제조 장치, 수지 성형 시스템, 및 수지 성형품의 제조 방법 Download PDF

Info

Publication number
KR102209919B1
KR102209919B1 KR1020180126477A KR20180126477A KR102209919B1 KR 102209919 B1 KR102209919 B1 KR 102209919B1 KR 1020180126477 A KR1020180126477 A KR 1020180126477A KR 20180126477 A KR20180126477 A KR 20180126477A KR 102209919 B1 KR102209919 B1 KR 102209919B1
Authority
KR
South Korea
Prior art keywords
platen
resin molded
molded article
manufacturing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180126477A
Other languages
English (en)
Korean (ko)
Other versions
KR20190046661A (ko
Inventor
히데오 이치하시
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190046661A publication Critical patent/KR20190046661A/ko
Application granted granted Critical
Publication of KR102209919B1 publication Critical patent/KR102209919B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • H01L21/565—
    • H01L21/67126—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020180126477A 2017-10-25 2018-10-23 수지 성형품의 제조 장치, 수지 성형 시스템, 및 수지 성형품의 제조 방법 Active KR102209919B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-206004 2017-10-25
JP2017206004A JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
KR20190046661A KR20190046661A (ko) 2019-05-07
KR102209919B1 true KR102209919B1 (ko) 2021-02-01

Family

ID=66254743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180126477A Active KR102209919B1 (ko) 2017-10-25 2018-10-23 수지 성형품의 제조 장치, 수지 성형 시스템, 및 수지 성형품의 제조 방법

Country Status (5)

Country Link
JP (1) JP6845781B2 (https=)
KR (1) KR102209919B1 (https=)
CN (1) CN109702944B (https=)
SG (1) SG10201808664WA (https=)
TW (1) TWI736804B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785896B2 (ja) * 2019-01-28 2020-11-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2023176518A (ja) 2022-05-31 2023-12-13 アピックヤマダ株式会社 樹脂封止装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017043035A (ja) 2015-08-28 2017-03-02 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (https=) * 1988-09-02 1990-03-08
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
JP6066889B2 (ja) * 2013-11-25 2017-01-25 Ｔｏｗａ株式会社 圧縮成形装置および圧縮成形方法
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6012893B1 (ja) * 2016-01-27 2016-10-25 エムテックスマツムラ株式会社 樹脂成形装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017043035A (ja) 2015-08-28 2017-03-02 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Also Published As

Publication number Publication date
JP6845781B2 (ja) 2021-03-24
CN109702944A (zh) 2019-05-03
JP2019077106A (ja) 2019-05-23
TW201916997A (zh) 2019-05-01
KR20190046661A (ko) 2019-05-07
SG10201808664WA (en) 2019-05-30
CN109702944B (zh) 2021-05-04
TWI736804B (zh) 2021-08-21

Similar Documents

Publication Publication Date Title
KR101832597B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
JP6440599B2 (ja) 樹脂成形装置及び樹脂成形方法
TWI728725B (zh) 樹脂成形裝置以及樹脂成形品的製造方法
TWI690404B (zh) 樹脂成形品的製造裝置與製造方法、樹脂成形系統
JP2019031051A (ja) 搬送機構、樹脂成形装置、成形対象物の成形型への受け渡し方法、及び樹脂成形品の製造方法
KR102266607B1 (ko) 수지 성형 장치 및 수지 성형품 제조 방법
KR20190085847A (ko) 수지 밀봉 장치 및 수지 밀봉 방법
KR102209919B1 (ko) 수지 성형품의 제조 장치, 수지 성형 시스템, 및 수지 성형품의 제조 방법
WO2023203935A1 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
JP5419070B2 (ja) 樹脂封止装置
CN108501281B (zh) 树脂成形装置，树脂成形方法，及用于制造树脂成形产品的方法
WO2018139631A1 (ja) 樹脂封止装置及び樹脂封止方法
TWI729318B (zh) 樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法
JP5694486B2 (ja) 樹脂封止装置
JP4945346B2 (ja) 樹脂封止装置
JP2020044705A (ja) 樹脂成形装置、成形型装置、及び樹脂成形品の製造方法
JP2011035342A (ja) リード成形用金型およびリード成形用金型を用いた半導体装置の製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000