CN109702944B - 树脂成形品的制造装置及制造方法、以及树脂成形系统 - Google Patents

树脂成形品的制造装置及制造方法、以及树脂成形系统 Download PDF

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Publication number
CN109702944B
CN109702944B CN201811244494.2A CN201811244494A CN109702944B CN 109702944 B CN109702944 B CN 109702944B CN 201811244494 A CN201811244494 A CN 201811244494A CN 109702944 B CN109702944 B CN 109702944B
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CN
China
Prior art keywords
resin molded
platen
mold
molded product
producing
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Active
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CN201811244494.2A
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English (en)
Chinese (zh)
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CN109702944A (zh
Inventor
市桥秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
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Towa Corp
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Publication of CN109702944A publication Critical patent/CN109702944A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
CN201811244494.2A 2017-10-25 2018-10-24 树脂成形品的制造装置及制造方法、以及树脂成形系统 Active CN109702944B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017206004A JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法
JP2017-206004 2017-10-25

Publications (2)

Publication Number Publication Date
CN109702944A CN109702944A (zh) 2019-05-03
CN109702944B true CN109702944B (zh) 2021-05-04

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Country Status (5)

Country Link
JP (1) JP6845781B2 (https=)
KR (1) KR102209919B1 (https=)
CN (1) CN109702944B (https=)
SG (1) SG10201808664WA (https=)
TW (1) TWI736804B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785896B2 (ja) * 2019-01-28 2020-11-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2023176518A (ja) 2022-05-31 2023-12-13 アピックヤマダ株式会社 樹脂封止装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (https=) * 1988-09-02 1990-03-08
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
JP6066889B2 (ja) * 2013-11-25 2017-01-25 Ｔｏｗａ株式会社 圧縮成形装置および圧縮成形方法
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6012893B1 (ja) * 2016-01-27 2016-10-25 エムテックスマツムラ株式会社 樹脂成形装置

Also Published As

Publication number Publication date
JP6845781B2 (ja) 2021-03-24
CN109702944A (zh) 2019-05-03
JP2019077106A (ja) 2019-05-23
TW201916997A (zh) 2019-05-01
KR102209919B1 (ko) 2021-02-01
KR20190046661A (ko) 2019-05-07
SG10201808664WA (en) 2019-05-30
TWI736804B (zh) 2021-08-21

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