SG10201808664WA - Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method - Google Patents

Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method

Info

Publication number
SG10201808664WA
SG10201808664WA SG10201808664WA SG10201808664WA SG10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA
Authority
SG
Singapore
Prior art keywords
molded product
resin molded
product manufacturing
platen
resin
Prior art date
Application number
SG10201808664WA
Other languages
English (en)
Inventor
Ichihashi Hideo
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201808664WA publication Critical patent/SG10201808664WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG10201808664WA 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method SG10201808664WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017206004A JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
SG10201808664WA true SG10201808664WA (en) 2019-05-30

Family

ID=66254743

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201808664WA SG10201808664WA (en) 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method

Country Status (5)

Country Link
JP (1) JP6845781B2 (https=)
KR (1) KR102209919B1 (https=)
CN (1) CN109702944B (https=)
SG (1) SG10201808664WA (https=)
TW (1) TWI736804B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785896B2 (ja) * 2019-01-28 2020-11-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2023176518A (ja) 2022-05-31 2023-12-13 アピックヤマダ株式会社 樹脂封止装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (https=) * 1988-09-02 1990-03-08
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
JP6066889B2 (ja) * 2013-11-25 2017-01-25 Ｔｏｗａ株式会社 圧縮成形装置および圧縮成形方法
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6012893B1 (ja) * 2016-01-27 2016-10-25 エムテックスマツムラ株式会社 樹脂成形装置

Also Published As

Publication number Publication date
JP6845781B2 (ja) 2021-03-24
CN109702944A (zh) 2019-05-03
JP2019077106A (ja) 2019-05-23
TW201916997A (zh) 2019-05-01
KR102209919B1 (ko) 2021-02-01
KR20190046661A (ko) 2019-05-07
CN109702944B (zh) 2021-05-04
TWI736804B (zh) 2021-08-21

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