KR102186384B1 - 다이 본딩 장치 및 반도체 장치의 제조 방법 - Google Patents

다이 본딩 장치 및 반도체 장치의 제조 방법 Download PDF

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KR102186384B1
KR102186384B1 KR1020190024613A KR20190024613A KR102186384B1 KR 102186384 B1 KR102186384 B1 KR 102186384B1 KR 1020190024613 A KR1020190024613 A KR 1020190024613A KR 20190024613 A KR20190024613 A KR 20190024613A KR 102186384 B1 KR102186384 B1 KR 102186384B1
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die
substrate
bonding
reference mark
stage
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KR1020190024613A
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English (en)
Korean (ko)
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KR20190110026A (ko
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가즈노부 사까이
가즈노리 히구찌
다이요 모로마찌
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파스포드 테크놀로지 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Wire Bonding (AREA)
KR1020190024613A 2018-03-19 2019-03-04 다이 본딩 장치 및 반도체 장치의 제조 방법 KR102186384B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-050761 2018-03-19
JP2018050761A JP7018338B2 (ja) 2018-03-19 2018-03-19 ダイボンディング装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20190110026A KR20190110026A (ko) 2019-09-27
KR102186384B1 true KR102186384B1 (ko) 2020-12-03

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Country Status (4)

Country Link
JP (1) JP7018338B2 (ja)
KR (1) KR102186384B1 (ja)
CN (2) CN110289227B (ja)
TW (2) TWI758990B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7454763B2 (ja) 2020-03-04 2024-03-25 パナソニックＩｐマネジメント株式会社 電子部品搭載装置および生産データ作成システム
JP7498630B2 (ja) * 2020-09-11 2024-06-12 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN114566445B (zh) * 2022-01-22 2023-09-08 苏州艾科瑞思智能装备股份有限公司 一种面向晶圆三维集成的高精度微组装设备

Citations (5)

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JP2003110208A (ja) 2001-09-28 2003-04-11 Shibaura Mechatronics Corp 基板、及び基板の重ね合わせ機構、並びに基板の重ね合わせ方法
KR100540934B1 (ko) * 2002-08-30 2006-01-11 가부시키가이샤 무라타 세이사쿠쇼 부품 장착 방법 및 부품 장착 장치
JP2008153638A (ja) 2006-11-24 2008-07-03 Semiconductor Energy Lab Co Ltd マーカー付き基板、マーカー付き基板の作製方法、レーザ照射装置、レーザ照射方法、露光装置及び半導体装置の作製方法
JP2012238775A (ja) 2011-05-13 2012-12-06 Bondtech Inc アライメント装置およびアライメント方法
JP2016058543A (ja) * 2014-09-09 2016-04-21 ボンドテック株式会社 チップアライメント方法、チップアライメント装置

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JP2003215527A (ja) * 2002-01-28 2003-07-30 Nec Kagoshima Ltd 表示パネル組立時のアライメント方法
JP3962906B2 (ja) * 2002-02-26 2007-08-22 ソニー株式会社 部品実装装置及び部品実装方法
KR101318439B1 (ko) * 2006-12-06 2013-10-16 엘지디스플레이 주식회사 액정 패널의 광학 특성 측정 장치
JP2009253018A (ja) * 2008-04-07 2009-10-29 Shinkawa Ltd ボンディング装置及びボンディング方法
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
KR101897825B1 (ko) * 2012-01-02 2018-09-12 세메스 주식회사 다이 본딩 장치
JP6043939B2 (ja) * 2012-08-24 2016-12-14 ボンドテック株式会社 基板上への対象物の位置決め方法及び装置
TWI490956B (zh) * 2013-03-12 2015-07-01 Shinkawa Kk 覆晶接合器以及覆晶接合方法
KR101614204B1 (ko) * 2014-04-29 2016-04-20 세메스 주식회사 다이 픽업 유닛, 이를 포함하는 다이 본딩 장치 및 방법
JP6387256B2 (ja) * 2014-07-07 2018-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
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JP2017139365A (ja) 2016-02-04 2017-08-10 パナソニックＩｐマネジメント株式会社 半導体パッケージの製造方法
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110208A (ja) 2001-09-28 2003-04-11 Shibaura Mechatronics Corp 基板、及び基板の重ね合わせ機構、並びに基板の重ね合わせ方法
KR100540934B1 (ko) * 2002-08-30 2006-01-11 가부시키가이샤 무라타 세이사쿠쇼 부품 장착 방법 및 부품 장착 장치
JP2008153638A (ja) 2006-11-24 2008-07-03 Semiconductor Energy Lab Co Ltd マーカー付き基板、マーカー付き基板の作製方法、レーザ照射装置、レーザ照射方法、露光装置及び半導体装置の作製方法
JP2012238775A (ja) 2011-05-13 2012-12-06 Bondtech Inc アライメント装置およびアライメント方法
JP2016058543A (ja) * 2014-09-09 2016-04-21 ボンドテック株式会社 チップアライメント方法、チップアライメント装置

Also Published As

Publication number Publication date
KR20190110026A (ko) 2019-09-27
TWI758990B (zh) 2022-03-21
CN110289227A (zh) 2019-09-27
JP7018338B2 (ja) 2022-02-10
CN116978830A (zh) 2023-10-31
JP2019165059A (ja) 2019-09-26
CN110289227B (zh) 2023-09-12
TW201946201A (zh) 2019-12-01
TWI741256B (zh) 2021-10-01
TW202114048A (zh) 2021-04-01

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