KR102181631B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

Info

Publication number
KR102181631B1
KR102181631B1 KR1020190022439A KR20190022439A KR102181631B1 KR 102181631 B1 KR102181631 B1 KR 102181631B1 KR 1020190022439 A KR1020190022439 A KR 1020190022439A KR 20190022439 A KR20190022439 A KR 20190022439A KR 102181631 B1 KR102181631 B1 KR 102181631B1
Authority
KR
South Korea
Prior art keywords
ceiling
heater
unit
heat treatment
ceiling surface
Prior art date
Application number
KR1020190022439A
Other languages
English (en)
Korean (ko)
Other versions
KR20190106705A (ko
Inventor
다쓰히사 쓰지
야스히로 후쿠모토
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20190106705A publication Critical patent/KR20190106705A/ko
Application granted granted Critical
Publication of KR102181631B1 publication Critical patent/KR102181631B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020190022439A 2018-03-06 2019-02-26 기판 처리 장치 KR102181631B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-039545 2018-03-06
JP2018039545A JP7092522B2 (ja) 2018-03-06 2018-03-06 基板処理装置

Publications (2)

Publication Number Publication Date
KR20190106705A KR20190106705A (ko) 2019-09-18
KR102181631B1 true KR102181631B1 (ko) 2020-11-23

Family

ID=67860325

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190022439A KR102181631B1 (ko) 2018-03-06 2019-02-26 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP7092522B2 (zh)
KR (1) KR102181631B1 (zh)
CN (1) CN110233119B (zh)
TW (1) TWI739066B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237157A (ja) 2000-02-22 2001-08-31 Tokyo Electron Ltd 加熱処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2619563B2 (ja) * 1990-10-02 1997-06-11 大日本スクリーン製造株式会社 基板熱処理装置
JPH09148422A (ja) * 1995-11-24 1997-06-06 Mitsubishi Materials Shilicon Corp ウェーハ収納容器の係止構造
KR0181908B1 (ko) * 1996-06-13 1999-04-15 김광호 반도체 제조용 베이크 장치
JP2000003843A (ja) 1998-06-12 2000-01-07 Dainippon Screen Mfg Co Ltd 基板熱処理装置
US20070034159A1 (en) * 2003-05-23 2007-02-15 Mitsuaki Komino Semiconductor manufacturing device and its heating unit
JP2005183638A (ja) * 2003-12-18 2005-07-07 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP4737083B2 (ja) * 2006-12-28 2011-07-27 東京エレクトロン株式会社 加熱装置及び塗布、現像装置並びに加熱方法
JP2008186934A (ja) * 2007-01-29 2008-08-14 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法
JP6855687B2 (ja) * 2015-07-29 2021-04-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理装置のメンテナンス方法及び記憶媒体
JP6846964B2 (ja) * 2017-03-16 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237157A (ja) 2000-02-22 2001-08-31 Tokyo Electron Ltd 加熱処理装置

Also Published As

Publication number Publication date
CN110233119A (zh) 2019-09-13
CN110233119B (zh) 2023-07-11
TW201939640A (zh) 2019-10-01
JP7092522B2 (ja) 2022-06-28
TWI739066B (zh) 2021-09-11
JP2019153739A (ja) 2019-09-12
KR20190106705A (ko) 2019-09-18

Similar Documents

Publication Publication Date Title
TWI402371B (zh) 用於前段產線製程之原位乾式清洗反應器
US7624772B2 (en) Load lock apparatus, processing system and substrate processing method
US20160035601A1 (en) Bake unit, substrate treating apparatus including the unit, and substrate treating method
KR101605721B1 (ko) 베이크 장치 및 기판 처리 장치
KR20170102008A (ko) 기판 이송 메커니즘들
JPWO2007018139A1 (ja) 半導体装置の製造方法および基板処理装置
KR102181631B1 (ko) 기판 처리 장치
KR102164765B1 (ko) 기판 처리 장치 및 기판 처리 시스템
KR102099116B1 (ko) 기판 처리 장치 및 방법
KR102190566B1 (ko) 기판 처리 장치
JP6990121B2 (ja) 基板処理装置
US20220075270A1 (en) Bake unit and apparatus for treating substrate
KR102194370B1 (ko) 기판 처리 장치
KR20170056224A (ko) 베이크 장치 및 베이크 방법
KR101776018B1 (ko) 기판 가열 방법 및 기판 처리 장치
JP2010093131A (ja) 基板処理装置
JP4167523B2 (ja) 基板処理装置
KR20160081010A (ko) 베이크 유닛, 이를 포함하는 기판 처리 장치 및 방법
JP2006093585A (ja) 基板処理装置
JP2023004984A (ja) 支持ユニット、これを含むベーク装置及び基板処理装置
JP2000021801A (ja) 枚葉式熱処理装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant