KR102175071B1 - 이미지 인식 기반 어블레이션 패턴 위치 소환 - Google Patents

이미지 인식 기반 어블레이션 패턴 위치 소환 Download PDF

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KR102175071B1
KR102175071B1 KR1020157029476A KR20157029476A KR102175071B1 KR 102175071 B1 KR102175071 B1 KR 102175071B1 KR 1020157029476 A KR1020157029476 A KR 1020157029476A KR 20157029476 A KR20157029476 A KR 20157029476A KR 102175071 B1 KR102175071 B1 KR 102175071B1
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South Korea
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laser
sample
intended
positioning
image
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Korean (ko)
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KR20150129853A (ko
Inventor
리프 크리스찬 섬머필드
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엘레멘탈 사이언티픽 레이저스 엘엘씨
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Priority to KR1020207031514A priority Critical patent/KR102294198B1/ko
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
    • G01N2001/045—Laser ablation; Microwave vaporisation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50057—Compensation error by probing test, machined piece, post or pre process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/02—Details
    • H01J49/04—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components
    • H01J49/0459—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components for solid samples
    • H01J49/0463—Desorption by laser or particle beam, followed by ionisation as a separate step

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Laser Beam Processing (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020157029476A 2013-03-15 2014-03-14 이미지 인식 기반 어블레이션 패턴 위치 소환 Active KR102175071B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020207031514A KR102294198B1 (ko) 2013-03-15 2014-03-14 이미지 인식 기반 어블레이션 패턴 위치 소환

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361792016P 2013-03-15 2013-03-15
US61/792,016 2013-03-15
PCT/US2014/028241 WO2014144012A1 (en) 2013-03-15 2014-03-14 Image recognition base ablation pattern position recall
US14/211,976 US10026195B2 (en) 2013-03-15 2014-03-14 Image recognition base ablation pattern position recall
US14/211,976 2014-03-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207031514A Division KR102294198B1 (ko) 2013-03-15 2014-03-14 이미지 인식 기반 어블레이션 패턴 위치 소환

Publications (2)

Publication Number Publication Date
KR20150129853A KR20150129853A (ko) 2015-11-20
KR102175071B1 true KR102175071B1 (ko) 2020-11-06

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KR1020207031514A Active KR102294198B1 (ko) 2013-03-15 2014-03-14 이미지 인식 기반 어블레이션 패턴 위치 소환
KR1020157029476A Active KR102175071B1 (ko) 2013-03-15 2014-03-14 이미지 인식 기반 어블레이션 패턴 위치 소환

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KR1020207031514A Active KR102294198B1 (ko) 2013-03-15 2014-03-14 이미지 인식 기반 어블레이션 패턴 위치 소환

Country Status (5)

Country Link
US (1) US10026195B2 (enExample)
JP (2) JP6290371B2 (enExample)
KR (2) KR102294198B1 (enExample)
CN (1) CN105229446B (enExample)
WO (1) WO2014144012A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042165A1 (en) * 2014-09-18 2016-03-24 Universiteit Gent Laser ablation probe
JP6955931B2 (ja) * 2017-08-22 2021-10-27 株式会社ディスコ 検査用ウエーハ及びエネルギー分布の検査方法
KR101976441B1 (ko) 2018-11-27 2019-08-28 주식회사 21세기 펨토초 레이저를 이용한 초정밀 블레이드 엣지 가공방법
KR102028864B1 (ko) * 2019-05-07 2019-11-04 연세대학교 산학협력단 광원 위치를 보정하기 위한 현미경 장치 및 그 방법
JP6997480B2 (ja) * 2020-05-12 2022-01-17 オーケーラボ有限会社 レーザー走査顕微鏡、レーザー走査顕微鏡システム及びレーザーアブレーションシステム
CN117388043B (zh) 2023-11-02 2024-03-29 中国地质科学院地质研究所 一种单颗粒榍石的溶解方法及单颗粒榍石的（铀-钍）/氦定年方法
CN118514871B (zh) * 2024-07-19 2024-09-24 江西飞行学院 一种激光烧蚀反制无人机试验方法

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JP2003270208A (ja) * 2002-03-14 2003-09-25 Tdk Corp 試料ホルダ、レーザアブレーション装置、レーザアブレーション方法、試料分析装置、試料分析方法及び試料ホルダ用保持台
KR20040016067A (ko) * 2002-08-14 2004-02-21 삼성전자주식회사 감광막 노광 방법 및 이를 이용한 노광 설비
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Also Published As

Publication number Publication date
KR20150129853A (ko) 2015-11-20
KR20200128448A (ko) 2020-11-12
CN105229446B (zh) 2017-10-10
JP6290371B2 (ja) 2018-03-07
US10026195B2 (en) 2018-07-17
CN105229446A (zh) 2016-01-06
US20140288693A1 (en) 2014-09-25
KR102294198B1 (ko) 2021-08-30
JP2018126788A (ja) 2018-08-16
JP6463526B2 (ja) 2019-02-06
WO2014144012A1 (en) 2014-09-18
JP2016519289A (ja) 2016-06-30

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