KR102161069B1 - 발광 장치 - Google Patents

발광 장치 Download PDF

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Publication number
KR102161069B1
KR102161069B1 KR1020140109369A KR20140109369A KR102161069B1 KR 102161069 B1 KR102161069 B1 KR 102161069B1 KR 1020140109369 A KR1020140109369 A KR 1020140109369A KR 20140109369 A KR20140109369 A KR 20140109369A KR 102161069 B1 KR102161069 B1 KR 102161069B1
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KR
South Korea
Prior art keywords
light
emitting device
emitting element
lead
light emitting
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KR1020140109369A
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English (en)
Korean (ko)
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KR20150026858A (ko
Inventor
츠요시 오카히사
Original Assignee
니치아 카가쿠 고교 가부시키가이샤
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Publication of KR20150026858A publication Critical patent/KR20150026858A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020140109369A 2013-08-29 2014-08-22 발광 장치 Active KR102161069B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-177773 2013-08-29
JP2013177773A JP6236999B2 (ja) 2013-08-29 2013-08-29 発光装置

Publications (2)

Publication Number Publication Date
KR20150026858A KR20150026858A (ko) 2015-03-11
KR102161069B1 true KR102161069B1 (ko) 2020-09-29

Family

ID=51417185

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140109369A Active KR102161069B1 (ko) 2013-08-29 2014-08-22 발광 장치

Country Status (6)

Country Link
US (2) US10109779B2 (enExample)
EP (1) EP2843718B1 (enExample)
JP (1) JP6236999B2 (enExample)
KR (1) KR102161069B1 (enExample)
CN (1) CN104425701B (enExample)
TW (1) TWI680592B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10374134B2 (en) * 2015-05-29 2019-08-06 Nichia Corporation Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
KR102674066B1 (ko) * 2016-11-11 2024-06-13 삼성전자주식회사 발광 소자 패키지
KR102406913B1 (ko) * 2017-03-27 2022-06-10 서울반도체 주식회사 발광 모듈
DE102017116279B4 (de) 2017-07-19 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Vielzahl von Konversionselementen und optoelektronisches Bauelement
CN112490224B (zh) * 2020-11-27 2025-04-08 广东晶科电子股份有限公司 一种发光装置及制作方法
TWI821731B (zh) * 2021-08-23 2023-11-11 啟端光電股份有限公司 底部發光型發光二極體顯示器

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2008187030A (ja) * 2007-01-30 2008-08-14 Stanley Electric Co Ltd 発光装置

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TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
DE102004021233A1 (de) 2004-04-30 2005-12-01 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
JP2006269448A (ja) * 2005-03-22 2006-10-05 Stanley Electric Co Ltd Ｌｅｄ
CN100486397C (zh) * 2005-04-19 2009-05-06 皇家飞利浦电子股份有限公司 包括红色发射陶瓷发光转换器的照明系统
TWI302041B (en) * 2006-01-19 2008-10-11 Everlight Electronics Co Ltd Light emitting diode packaging structure
JP4857791B2 (ja) * 2006-02-01 2012-01-18 日亜化学工業株式会社 半導体装置の製造方法
TWI331815B (en) * 2006-03-17 2010-10-11 Seoul Semiconductor Co Ltd Side-view light emitting diode package having a reflector
JP4952215B2 (ja) * 2006-08-17 2012-06-13 日亜化学工業株式会社 発光装置
JP5205773B2 (ja) 2006-11-07 2013-06-05 日亜化学工業株式会社 発光装置
JP5132961B2 (ja) * 2007-03-19 2013-01-30 ハリソン東芝ライティング株式会社 光半導体装置及びその製造方法
KR101374895B1 (ko) * 2007-03-31 2014-03-17 서울반도체 주식회사 측면 발광형 ｌｅｄ 패키지 및 그 제조방법
JP2009032746A (ja) * 2007-07-24 2009-02-12 Harison Toshiba Lighting Corp 発光装置及び発光ユニット
JP2009038184A (ja) * 2007-08-01 2009-02-19 Harison Toshiba Lighting Corp 半導体発光装置、光源装置及び面状発光装置
DE112008002540B4 (de) * 2007-09-28 2024-02-08 Seoul Semiconductor Co., Ltd. LED-Gehäuse und Hintergrundbeleuchtungseinheit unter Verwendung desselben
JP5277610B2 (ja) * 2007-10-29 2013-08-28 日亜化学工業株式会社 発光装置及び面発光装置並びに発光装置用パッケージ
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EP2246409B1 (en) * 2008-01-21 2014-04-16 Nichia Corporation Light emitting apparatus
JP2010003743A (ja) * 2008-06-18 2010-01-07 Toshiba Corp 発光装置
KR101537797B1 (ko) * 2008-06-26 2015-07-22 서울반도체 주식회사 발광장치
JP5294741B2 (ja) 2008-07-14 2013-09-18 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
TWI456784B (zh) 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
DE102008049399B4 (de) * 2008-09-29 2021-09-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, optoelektronische Vorrichtung und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP4808244B2 (ja) 2008-12-09 2011-11-02 スタンレー電気株式会社 半導体発光装置およびその製造方法
US8097894B2 (en) * 2009-07-23 2012-01-17 Koninklijke Philips Electronics N.V. LED with molded reflective sidewall coating
JP5496570B2 (ja) * 2009-08-05 2014-05-21 シャープ株式会社 発光装置
JP5251788B2 (ja) * 2009-08-25 2013-07-31 豊田合成株式会社 サイドビュータイプの発光装置及びその製造方法
JP5482098B2 (ja) * 2009-10-26 2014-04-23 日亜化学工業株式会社 発光装置
US8581287B2 (en) 2011-01-24 2013-11-12 Stanley Electric Co., Ltd. Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing
JP5744643B2 (ja) 2011-06-28 2015-07-08 シチズン電子株式会社 発光装置の製造方法
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JP2008187030A (ja) * 2007-01-30 2008-08-14 Stanley Electric Co Ltd 発光装置

Also Published As

Publication number Publication date
US10622529B2 (en) 2020-04-14
KR20150026858A (ko) 2015-03-11
US10109779B2 (en) 2018-10-23
EP2843718A1 (en) 2015-03-04
TW201513406A (zh) 2015-04-01
JP6236999B2 (ja) 2017-11-29
US20190027663A1 (en) 2019-01-24
CN104425701A (zh) 2015-03-18
US20150060921A1 (en) 2015-03-05
JP2015046534A (ja) 2015-03-12
TWI680592B (zh) 2019-12-21
CN104425701B (zh) 2019-06-18
EP2843718B1 (en) 2017-11-29

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