KR102148125B1 - 접착제 조성물 및 접착 필름 - Google Patents

접착제 조성물 및 접착 필름 Download PDF

Info

Publication number
KR102148125B1
KR102148125B1 KR1020130125726A KR20130125726A KR102148125B1 KR 102148125 B1 KR102148125 B1 KR 102148125B1 KR 1020130125726 A KR1020130125726 A KR 1020130125726A KR 20130125726 A KR20130125726 A KR 20130125726A KR 102148125 B1 KR102148125 B1 KR 102148125B1
Authority
KR
South Korea
Prior art keywords
weight
adhesive composition
styrene
elastomer
adhesive
Prior art date
Application number
KR1020130125726A
Other languages
English (en)
Korean (ko)
Other versions
KR20140052860A (ko
Inventor
히로후미 이마이
도시유키 오가타
아츠시 구보
다카히로 요시오카
다쿠야 노구치
야스오 스즈키
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR20140052860A publication Critical patent/KR20140052860A/ko
Application granted granted Critical
Publication of KR102148125B1 publication Critical patent/KR102148125B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020130125726A 2012-10-25 2013-10-22 접착제 조성물 및 접착 필름 KR102148125B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2012-236023 2012-10-25
JP2012236023 2012-10-25
JPJP-P-2013-117298 2013-06-03
JP2013117298 2013-06-03

Publications (2)

Publication Number Publication Date
KR20140052860A KR20140052860A (ko) 2014-05-07
KR102148125B1 true KR102148125B1 (ko) 2020-08-26

Family

ID=50885985

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130125726A KR102148125B1 (ko) 2012-10-25 2013-10-22 접착제 조성물 및 접착 필름

Country Status (3)

Country Link
JP (1) JP6216575B2 (zh)
KR (1) KR102148125B1 (zh)
TW (2) TWI643922B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732764B (zh) * 2015-06-01 2021-07-11 日商富士軟片股份有限公司 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組
JP6722001B2 (ja) * 2016-03-03 2020-07-15 東京応化工業株式会社 接着剤組成物、積層体、及び、積層体の製造方法
WO2019106846A1 (ja) * 2017-12-01 2019-06-06 日立化成株式会社 半導体装置の製造方法、仮固定材用樹脂組成物、及び仮固定材用積層フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292919A (ja) 2002-01-30 2003-10-15 Sanyo Chem Ind Ltd ホットメルト接着剤
JP2004099785A (ja) 2002-09-11 2004-04-02 Sanyo Chem Ind Ltd 床版の防水用ホットメルト接着剤
WO2012004951A1 (ja) 2010-07-09 2012-01-12 三井化学株式会社 ペリクル及びそれに用いるマスク接着剤

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518334A (ja) * 1974-07-10 1976-01-23 Nichireki Chem Ind Co Setsuchakuzaisoseibutsu
JPS5491539A (en) * 1977-12-29 1979-07-20 Asahi Chem Ind Co Ltd Adhesive
JPH0230351B2 (ja) * 1982-04-23 1990-07-05 Hoechst Gosei Kk Taisuiseinosuguretakyojugotaiemarujongatasetsuchakuzainoseiho
MY111332A (en) * 1991-06-28 1999-11-30 Furukawa Electric Co Ltd Semiconductor wafer-securing adhesive tape.
JPH05279644A (ja) * 1992-03-31 1993-10-26 Sekisui Finechem Co Ltd 異方導電性接着シート
JP3038549B2 (ja) * 1998-02-27 2000-05-08 三洋化成工業株式会社 接着剤用添加剤およびホットメルト接着剤組成物
JP2000351952A (ja) * 1999-04-05 2000-12-19 Nitto Denko Corp 塗膜保護用シート
JP2001207136A (ja) * 2000-01-26 2001-07-31 Nitto Denko Corp 塗膜保護用シート
JP4106283B2 (ja) * 2002-02-08 2008-06-25 フェリック株式会社 温熱材用粘着剤及びこれを用いた温熱材
CA2554532C (en) * 2004-02-06 2013-02-12 Invista Technologies S.A.R.L. Substrates containing adhesion promoting additives and articles prepared therewith
US8268449B2 (en) 2006-02-06 2012-09-18 Brewer Science Inc. Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
DE102006039833A1 (de) * 2006-08-25 2008-03-20 Henkel Kgaa Schmelzklebstoff mit verbesserter Haftung
JP5301486B2 (ja) * 2010-03-17 2013-09-25 三井・デュポンポリケミカル株式会社 液晶ポリマー用ヒートシール性樹脂組成物、液晶ポリマー用ヒートシール材、蓋材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292919A (ja) 2002-01-30 2003-10-15 Sanyo Chem Ind Ltd ホットメルト接着剤
JP2004099785A (ja) 2002-09-11 2004-04-02 Sanyo Chem Ind Ltd 床版の防水用ホットメルト接着剤
WO2012004951A1 (ja) 2010-07-09 2012-01-12 三井化学株式会社 ペリクル及びそれに用いるマスク接着剤

Also Published As

Publication number Publication date
TWI586776B (zh) 2017-06-11
TW201425506A (zh) 2014-07-01
KR20140052860A (ko) 2014-05-07
JP2015013977A (ja) 2015-01-22
TW201726867A (zh) 2017-08-01
JP6216575B2 (ja) 2017-10-18
TWI643922B (zh) 2018-12-11

Similar Documents

Publication Publication Date Title
TWI483304B (zh) 剝離方法、基板之黏著劑、及含基板之層合物
US10793756B2 (en) Adhesive composition, adhesive film, and bonding method
KR102264947B1 (ko) 접착제 조성물, 적층체 및 박리 방법
KR101798687B1 (ko) 접착제 조성물, 접착 필름 및 첩부 방법
JP2014037458A (ja) 接着剤組成物、接着フィルムおよび貼付方法
KR101472182B1 (ko) 접착제 조성물, 접착 필름 및 기판의 처리 방법
KR102148125B1 (ko) 접착제 조성물 및 접착 필름
JP6194394B2 (ja) 半導体装置の製造方法
JP6059507B2 (ja) 接着剤組成物及び接着フィルム
JP6085161B2 (ja) 接着剤組成物及び接着フィルム
KR101809773B1 (ko) 접착제 조성물 및 접착 필름
JP6063737B2 (ja) 接着剤組成物、接着フィルムおよび基板の処理方法
KR101777895B1 (ko) 접착제 조성물, 접착 필름 및 기판의 처리 방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant