KR102139020B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents
기판 처리 장치 및 기판 처리 방법 Download PDFInfo
- Publication number
- KR102139020B1 KR102139020B1 KR1020197006620A KR20197006620A KR102139020B1 KR 102139020 B1 KR102139020 B1 KR 102139020B1 KR 1020197006620 A KR1020197006620 A KR 1020197006620A KR 20197006620 A KR20197006620 A KR 20197006620A KR 102139020 B1 KR102139020 B1 KR 102139020B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- substrate
- cup
- cup portion
- chamber body
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-185657 | 2016-09-23 | ||
JP2016185657A JP6706564B2 (ja) | 2016-09-23 | 2016-09-23 | 基板処理装置および基板処理方法 |
PCT/JP2017/025122 WO2018055877A1 (ja) | 2016-09-23 | 2017-07-10 | 基板処理装置および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190034654A KR20190034654A (ko) | 2019-04-02 |
KR102139020B1 true KR102139020B1 (ko) | 2020-07-28 |
Family
ID=61690264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197006620A KR102139020B1 (ko) | 2016-09-23 | 2017-07-10 | 기판 처리 장치 및 기판 처리 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6706564B2 (ja) |
KR (1) | KR102139020B1 (ja) |
CN (1) | CN109716489B (ja) |
TW (1) | TWI635529B (ja) |
WO (1) | WO2018055877A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7055720B2 (ja) * | 2018-08-10 | 2022-04-18 | 株式会社荏原製作所 | 基板回転装置、基板洗浄装置および基板処理装置ならびに基板回転装置の制御方法 |
KR102583555B1 (ko) * | 2020-12-09 | 2023-09-26 | 세메스 주식회사 | 처리액 공급 유닛을 포함하는 기판 처리 장치 및 기판 처리 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014049605A (ja) | 2012-08-31 | 2014-03-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2014179491A (ja) | 2013-03-15 | 2014-09-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4803592B2 (ja) * | 2006-06-16 | 2011-10-26 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
KR100900628B1 (ko) * | 2006-09-15 | 2009-06-02 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
JP5606992B2 (ja) * | 2011-06-09 | 2014-10-15 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP6057624B2 (ja) * | 2012-09-03 | 2017-01-11 | 株式会社Screenセミコンダクターソリューションズ | カップおよび基板処理装置 |
JP6017262B2 (ja) * | 2012-10-25 | 2016-10-26 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP5956946B2 (ja) * | 2013-03-13 | 2016-07-27 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP2014179489A (ja) * | 2013-03-15 | 2014-09-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2015012013A (ja) * | 2013-06-26 | 2015-01-19 | 京セラ株式会社 | 多層配線基板およびそれを備えたプローブカード用基板 |
CN105849871B (zh) * | 2013-12-25 | 2018-05-29 | 株式会社思可林集团 | 基板处理装置 |
JP6057886B2 (ja) * | 2013-12-25 | 2017-01-11 | 株式会社Screenホールディングス | 基板処理装置 |
-
2016
- 2016-09-23 JP JP2016185657A patent/JP6706564B2/ja not_active Expired - Fee Related
-
2017
- 2017-07-10 WO PCT/JP2017/025122 patent/WO2018055877A1/ja active Application Filing
- 2017-07-10 CN CN201780055662.0A patent/CN109716489B/zh active Active
- 2017-07-10 KR KR1020197006620A patent/KR102139020B1/ko active IP Right Grant
- 2017-07-27 TW TW106125288A patent/TWI635529B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014049605A (ja) | 2012-08-31 | 2014-03-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2014179491A (ja) | 2013-03-15 | 2014-09-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI635529B (zh) | 2018-09-11 |
WO2018055877A1 (ja) | 2018-03-29 |
KR20190034654A (ko) | 2019-04-02 |
TW201814766A (zh) | 2018-04-16 |
JP2018049985A (ja) | 2018-03-29 |
CN109716489A (zh) | 2019-05-03 |
CN109716489B (zh) | 2022-11-15 |
JP6706564B2 (ja) | 2020-06-10 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |