KR102122876B1 - 점착 시트, 전기 또는 전자 기기 부재 적층체 및 광학 부재 적층체 - Google Patents

점착 시트, 전기 또는 전자 기기 부재 적층체 및 광학 부재 적층체 Download PDF

Info

Publication number
KR102122876B1
KR102122876B1 KR1020130085177A KR20130085177A KR102122876B1 KR 102122876 B1 KR102122876 B1 KR 102122876B1 KR 1020130085177 A KR1020130085177 A KR 1020130085177A KR 20130085177 A KR20130085177 A KR 20130085177A KR 102122876 B1 KR102122876 B1 KR 102122876B1
Authority
KR
South Korea
Prior art keywords
sensitive adhesive
pressure
adhesive layer
adhesive sheet
separator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020130085177A
Other languages
English (en)
Korean (ko)
Other versions
KR20140011981A (ko
Inventor
마사아키 사토
요시카즈 소에다
히로시 와다
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20140011981A publication Critical patent/KR20140011981A/ko
Application granted granted Critical
Publication of KR102122876B1 publication Critical patent/KR102122876B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/401Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00Presence of unspecified rubber
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00Presence of block copolymer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020130085177A 2012-07-19 2013-07-19 점착 시트, 전기 또는 전자 기기 부재 적층체 및 광학 부재 적층체 Expired - Fee Related KR102122876B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012160179A JP5650166B2 (ja) 2012-07-19 2012-07-19 粘着シート、電子機器部材積層体及び光学部材積層体
JPJP-P-2012-160179 2012-07-19

Publications (2)

Publication Number Publication Date
KR20140011981A KR20140011981A (ko) 2014-01-29
KR102122876B1 true KR102122876B1 (ko) 2020-06-15

Family

ID=48917340

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130085177A Expired - Fee Related KR102122876B1 (ko) 2012-07-19 2013-07-19 점착 시트, 전기 또는 전자 기기 부재 적층체 및 광학 부재 적층체

Country Status (6)

Country Link
US (1) US20140023861A1 (enExample)
EP (1) EP2687570A3 (enExample)
JP (1) JP5650166B2 (enExample)
KR (1) KR102122876B1 (enExample)
CN (1) CN103571354B (enExample)
TW (1) TW201406917A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102191637B1 (ko) * 2014-03-31 2020-12-16 린텍 가부시키가이샤 양면 점착 시트 및 양면 점착 시트의 제조 방법
JP6325313B2 (ja) * 2014-03-31 2018-05-16 リンテック株式会社 シート状粘着剤および粘着シート
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
CN104085152A (zh) * 2014-07-25 2014-10-08 常熟璟杰进出口有限公司 一种覆铝无纺布
JP2016097562A (ja) * 2014-11-20 2016-05-30 日立化成株式会社 樹脂層付き基板の製造方法、導電層付き基板の製造方法、樹脂層付き基板、導電層付き基板及びタッチパネル。
JP6664166B2 (ja) * 2014-11-28 2020-03-13 日東電工株式会社 携帯電子機器用粘着シート
WO2016084946A1 (ja) * 2014-11-28 2016-06-02 日東電工株式会社 携帯電子機器用粘着シート
JP6480793B2 (ja) * 2015-04-15 2019-03-13 積水化学工業株式会社 両面粘着テープ
SG11201803429XA (en) * 2015-11-06 2018-05-30 Lintec Corp Release agent composition, release sheet, and adhesive body
CN106908988A (zh) * 2016-01-04 2017-06-30 宁波长阳科技股份有限公司 一种液晶显示器的背光组件
JP6745238B2 (ja) * 2017-03-22 2020-08-26 日本カーバイド工業株式会社 加飾フィルム用粘着剤組成物、加飾フィルム及び加飾成形品
JP6850182B2 (ja) * 2017-04-07 2021-03-31 綜研化学株式会社 粘着剤組成物および粘着シート
US10647102B2 (en) * 2017-07-06 2020-05-12 General Electric Company System and method for removal of a layer
JP7166052B2 (ja) * 2017-11-30 2022-11-07 日東電工株式会社 粘着シート
JP7069066B2 (ja) * 2019-02-27 2022-05-17 リンテック株式会社 繰り返し屈曲ディスプレイ
CN111087524B (zh) * 2019-12-17 2022-11-18 苏州赛伍应用技术股份有限公司 一种聚丙烯酸酯、压敏胶黏剂、压敏胶带、软磁屏蔽片及其制备方法
KR102880443B1 (ko) * 2022-02-09 2025-11-04 주식회사 엘지화학 적층체
CN116254081B (zh) * 2023-01-09 2024-12-17 恩平市盈嘉丰胶粘制品有限公司 一种高导热型电子压敏胶黏剂及其制备方法和使用方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5049426B2 (ja) 2000-08-31 2012-10-17 日東電工株式会社 アクリル系粘着剤の製造法
JP4646508B2 (ja) * 2003-10-01 2011-03-09 日東電工株式会社 両面接着テープ又はシートおよびその製造方法
JP3822213B2 (ja) * 2004-06-03 2006-09-13 日東電工株式会社 剥離力調整方法、光学部材用粘着剤層およびその製造方法、ならびに粘着剤付光学部材
JP5265845B2 (ja) * 2005-04-15 2013-08-14 スリーエム イノベイティブ プロパティズ カンパニー 両面粘着テープ
DE102007019131A1 (de) * 2007-04-20 2008-10-23 Tesa Ag Doppelseitiges Haftklebeband
JP5171332B2 (ja) * 2008-03-18 2013-03-27 リンテック株式会社 剥離シート、剥離シート付き偏光板、及び基材レス両面粘着シート
JP5867921B2 (ja) * 2008-05-14 2016-02-24 エルジー・ケム・リミテッド 粘着シート及びこれを利用した半導体ウェーハ裏面研削方法
JP2010155974A (ja) * 2008-12-01 2010-07-15 Nitto Denko Corp アクリル系感圧性接着シート、アクリル系感圧性接着シートの製造方法、及び積層構成
JP5820619B2 (ja) * 2011-01-20 2015-11-24 日東電工株式会社 粘着テープ

Also Published As

Publication number Publication date
CN103571354A (zh) 2014-02-12
EP2687570A3 (en) 2014-04-23
EP2687570A2 (en) 2014-01-22
KR20140011981A (ko) 2014-01-29
CN103571354B (zh) 2018-05-04
JP5650166B2 (ja) 2015-01-07
US20140023861A1 (en) 2014-01-23
TW201406917A (zh) 2014-02-16
JP2014019799A (ja) 2014-02-03

Similar Documents

Publication Publication Date Title
KR102122876B1 (ko) 점착 시트, 전기 또는 전자 기기 부재 적층체 및 광학 부재 적층체
JP6722267B2 (ja) 粘着剤組成物、粘着剤層、粘着シート、光学部材、及びタッチパネル
CN102533140B (zh) 光学压敏胶粘片、包含所述光学压敏胶粘片的液晶显示器和输入装置
JP5518436B2 (ja) 光学用粘着シート
JP6722245B2 (ja) 光学用粘着剤層、粘着シート、光学部材、及びタッチパネル
JP6508869B2 (ja) 粘着剤組成物、粘着剤層、粘着シート、光学部材、及びタッチパネル
CN102453445B (zh) 光学压敏胶粘片、光学膜和显示装置
CN103242748B (zh) 丙烯酸类压敏胶粘带
CN104342041B (zh) 粘合剂组合物、粘合带或粘合片
JP6001316B2 (ja) 粘着シート
CN102791815A (zh) 光学用粘合片
JP6592070B2 (ja) 粘着シート、電子機器部材積層体及び光学部材積層体
JP6282215B2 (ja) 粘着シート、電子機器部材積層体及び光学部材積層体
CN117120568A (zh) 光学层叠体、图像显示装置及粘合剂组合物

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230610

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230610

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000