KR102103891B1 - 반송 장치, 리소그래피 장치 및 물품의 제조 방법 - Google Patents

반송 장치, 리소그래피 장치 및 물품의 제조 방법 Download PDF

Info

Publication number
KR102103891B1
KR102103891B1 KR1020170040431A KR20170040431A KR102103891B1 KR 102103891 B1 KR102103891 B1 KR 102103891B1 KR 1020170040431 A KR1020170040431 A KR 1020170040431A KR 20170040431 A KR20170040431 A KR 20170040431A KR 102103891 B1 KR102103891 B1 KR 102103891B1
Authority
KR
South Korea
Prior art keywords
substrate
unit
conveying
stage
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170040431A
Other languages
English (en)
Korean (ko)
Other versions
KR20170113383A (ko
Inventor
야스나오 마츠히라
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20170113383A publication Critical patent/KR20170113383A/ko
Application granted granted Critical
Publication of KR102103891B1 publication Critical patent/KR102103891B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/67742—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H01L21/0274—
    • H01L21/67259—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020170040431A 2016-03-31 2017-03-30 반송 장치, 리소그래피 장치 및 물품의 제조 방법 Active KR102103891B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-073179 2016-03-31
JP2016073179A JP6357187B2 (ja) 2016-03-31 2016-03-31 搬送装置、リソグラフィ装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20170113383A KR20170113383A (ko) 2017-10-12
KR102103891B1 true KR102103891B1 (ko) 2020-04-24

Family

ID=59958707

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170040431A Active KR102103891B1 (ko) 2016-03-31 2017-03-30 반송 장치, 리소그래피 장치 및 물품의 제조 방법

Country Status (5)

Country Link
US (1) US10222712B2 (https=)
JP (1) JP6357187B2 (https=)
KR (1) KR102103891B1 (https=)
CN (1) CN107272346B (https=)
TW (1) TWI696233B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210362290A1 (en) * 2018-07-09 2021-11-25 Tokyo Electron Limited Processing apparatus, processing method and computer- readable recording medium
JP7638662B2 (ja) * 2020-10-22 2025-03-04 キヤノン株式会社 無線伝送システム、制御方法、およびプログラム
JP7698543B2 (ja) * 2021-09-28 2025-06-25 キヤノン株式会社 ステージ装置、リソグラフィ装置及び物品の製造方法
JP2023132218A (ja) * 2022-03-10 2023-09-22 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
JP2007189211A (ja) * 2005-12-14 2007-07-26 Fujitsu Ltd 検査方法および検査装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
JP3741401B2 (ja) * 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
JP2000114345A (ja) * 1998-09-30 2000-04-21 Ebara Corp 基板の位置決め装置
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
JP2004151102A (ja) 2003-10-28 2004-05-27 Kyocera Corp ウエハー形状測定装置
JP2005260010A (ja) * 2004-03-11 2005-09-22 Nec Electronics Corp ウエハ搬送装置及びウエハ搬送方法
JP4695406B2 (ja) * 2005-02-10 2011-06-08 パナソニック株式会社 部品実装装置及び部品実装方法
JP4794882B2 (ja) * 2005-03-25 2011-10-19 キヤノン株式会社 走査型露光装置、走査型露光方法
US20080145957A1 (en) * 2006-12-14 2008-06-19 Lee Young-Sun Wafer transferring robot in semiconductor device fabrication equipmentand method of detecting wafer warpage using the same
JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
US8225683B2 (en) * 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
KR20100074345A (ko) * 2008-12-24 2010-07-02 주식회사 동부하이텍 웨이퍼 휨 변형 검지장치 및 그 방법
JP5665336B2 (ja) 2009-04-06 2015-02-04 キヤノン株式会社 基板保持装置、及びそれを用いたリソグラフィー装置
JP5258981B2 (ja) * 2010-02-05 2013-08-07 東京エレクトロン株式会社 基板保持具及び基板搬送装置及び基板処理装置
JP6124900B2 (ja) * 2012-08-29 2017-05-10 富士機械製造株式会社 基板用作業機器の基板高さ補正方法
JP6122299B2 (ja) * 2013-01-15 2017-04-26 キヤノン株式会社 処理装置、処理方法、及びデバイスの製造方法
CN103972135B (zh) * 2013-01-25 2017-02-22 上海微电子装备有限公司 一种硅片精确定位传输装置及定位方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
JP2007189211A (ja) * 2005-12-14 2007-07-26 Fujitsu Ltd 検査方法および検査装置

Also Published As

Publication number Publication date
US20170285492A1 (en) 2017-10-05
CN107272346B (zh) 2020-05-19
JP6357187B2 (ja) 2018-07-11
JP2017183669A (ja) 2017-10-05
TW201737400A (zh) 2017-10-16
US10222712B2 (en) 2019-03-05
CN107272346A (zh) 2017-10-20
KR20170113383A (ko) 2017-10-12
TWI696233B (zh) 2020-06-11

Similar Documents

Publication Publication Date Title
US9915868B2 (en) Imprint apparatus, imprint method, and article manufacturing method
JP5190497B2 (ja) インプリント装置及び方法
US9387607B2 (en) Imprint apparatus, imprint method, and method for producing device
KR102032017B1 (ko) 리소그래피 장치, 리소그래피 방법, 프로그램, 리소그래피 시스템 및 물품 제조 방법
KR102103891B1 (ko) 반송 장치, 리소그래피 장치 및 물품의 제조 방법
JP6278833B2 (ja) リソグラフィ装置、および物品の製造方法
JP7278828B2 (ja) 成形方法、成形装置、インプリント方法、および物品の製造方法
JP6294633B2 (ja) リソグラフィ装置、決定方法及び物品の製造方法
JP6087669B2 (ja) 基板処理装置、リソグラフィ装置および物品の製造方法
JP6700983B2 (ja) 計測装置、搬送システム、リソグラフィ装置、および物品の製造方法
KR102059758B1 (ko) 임프린트 장치 및 물품 제조 방법
JP2019062164A (ja) インプリント装置、インプリント方法、インプリント材の配置パターンの決定方法、および物品の製造方法
JP6659181B2 (ja) 搬送装置、リソグラフィ装置、および物品の製造方法
US20240025106A1 (en) Control method, molding apparatus, and article manufacturing method
JP7051455B2 (ja) パターン形成装置および半導体装置の製造方法
JP7422458B2 (ja) 異物検査装置、異物検査方法、処理装置および物品製造方法
KR20230004264A (ko) 반송 장치, 평탄화 장치 및 물품 제조 방법
US20250108982A1 (en) Conveyance apparatus, shaping apparatus, and article manufacturing method
JP2019204895A (ja) 型を用いて基板上の組成物を成形する成形装置、成形方法、基板処理方法、および、物品製造方法
KR20250150491A (ko) 평탄화 방법, 평탄화 장치, 및 물품 제조 방법
US9927725B2 (en) Lithography apparatus, lithography method, program, lithography system, and article manufacturing method

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7