KR102103852B1 - 정전척 및 반도체·액정 제조장치 - Google Patents

정전척 및 반도체·액정 제조장치 Download PDF

Info

Publication number
KR102103852B1
KR102103852B1 KR1020150054269A KR20150054269A KR102103852B1 KR 102103852 B1 KR102103852 B1 KR 102103852B1 KR 1020150054269 A KR1020150054269 A KR 1020150054269A KR 20150054269 A KR20150054269 A KR 20150054269A KR 102103852 B1 KR102103852 B1 KR 102103852B1
Authority
KR
South Korea
Prior art keywords
insulating component
cylindrical
cylindrical insulating
electrostatic chuck
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020150054269A
Other languages
English (en)
Korean (ko)
Other versions
KR20150135071A (ko
Inventor
요시후미 가타야마
지로 가와이
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20150135071A publication Critical patent/KR20150135071A/ko
Application granted granted Critical
Publication of KR102103852B1 publication Critical patent/KR102103852B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H01L21/324—
    • H01L21/6831—

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150054269A 2014-05-22 2015-04-17 정전척 및 반도체·액정 제조장치 Active KR102103852B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-105877 2014-05-22
JP2014105877A JP6292977B2 (ja) 2014-05-22 2014-05-22 静電チャック及び半導体・液晶製造装置

Publications (2)

Publication Number Publication Date
KR20150135071A KR20150135071A (ko) 2015-12-02
KR102103852B1 true KR102103852B1 (ko) 2020-04-24

Family

ID=54556585

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150054269A Active KR102103852B1 (ko) 2014-05-22 2015-04-17 정전척 및 반도체·액정 제조장치

Country Status (4)

Country Link
US (1) US9887117B2 (https=)
JP (1) JP6292977B2 (https=)
KR (1) KR102103852B1 (https=)
TW (1) TWI654713B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6308871B2 (ja) * 2014-05-28 2018-04-11 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
US10388558B2 (en) * 2016-12-05 2019-08-20 Tokyo Electron Limited Plasma processing apparatus
JP6760127B2 (ja) * 2017-02-24 2020-09-23 三菱電機株式会社 半導体装置、半導体装置の製造方法
US11367597B2 (en) 2018-07-05 2022-06-21 Samsung Electronics Co., Ltd. Electrostatic chuck and plasma processing apparatus including the same
JP7403215B2 (ja) * 2018-09-14 2023-12-22 東京エレクトロン株式会社 基板支持体及び基板処理装置
JP2020061445A (ja) * 2018-10-09 2020-04-16 京セラ株式会社 試料保持具
JP2020077750A (ja) * 2018-11-07 2020-05-21 東京エレクトロン株式会社 クリーニング方法及び成膜方法
KR102203859B1 (ko) * 2019-05-14 2021-01-15 주식회사 동탄이엔지 절연 저항이 우수한 정전척
JP7285154B2 (ja) * 2019-07-16 2023-06-01 日本特殊陶業株式会社 保持装置
JP2021145114A (ja) * 2020-03-13 2021-09-24 住友大阪セメント株式会社 サセプタ、静電チャック装置
JP7586682B2 (ja) * 2020-10-07 2024-11-19 日本特殊陶業株式会社 保持装置
JP7414747B2 (ja) * 2021-01-20 2024-01-16 日本碍子株式会社 ウエハ載置台及びその製造方法
US11651986B2 (en) * 2021-01-27 2023-05-16 Applied Materials, Inc. System for isolating electrodes at cryogenic temperatures
KR102396865B1 (ko) 2021-12-08 2022-05-12 주식회사 미코세라믹스 정전척
WO2023106445A1 (ko) 2021-12-08 2023-06-15 주식회사 미코세라믹스 극저온 서셉터 및 그에 사용되는 전기적 커넥터 어셈블리
JP7746199B2 (ja) * 2022-03-11 2025-09-30 京セラ株式会社 試料保持具
JP2026000632A (ja) 2024-06-18 2026-01-06 Toto株式会社 静電チャック
TWI900353B (zh) * 2024-11-29 2025-10-01 財團法人金屬工業研究發展中心 適用靜電吸盤之電引入裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130220545A1 (en) 2012-02-24 2013-08-29 Tokyo Electron Limited Substrate mounting table and plasma etching apparatus
JP2013191626A (ja) 2012-03-12 2013-09-26 Ngk Insulators Ltd 半導体製造装置及びその製法
US20130286531A1 (en) 2012-04-26 2013-10-31 Shinko Electric Industries Co., Ltd. Electrostatic chuck

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339058A (en) * 1992-10-22 1994-08-16 Trilogy Communications, Inc. Radiating coaxial cable
KR100260587B1 (ko) * 1993-06-01 2000-08-01 히가시 데쓰로 정전척 및 그의 제조방법
JPH0774234A (ja) * 1993-06-28 1995-03-17 Tokyo Electron Ltd 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置
JPH09102536A (ja) * 1995-10-09 1997-04-15 Hitachi Ltd 静電吸着装置
US6072685A (en) 1998-05-22 2000-06-06 Applied Materials, Inc. Electrostatic chuck having an electrical connector with housing
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
JP2003060016A (ja) * 2001-07-31 2003-02-28 Applied Materials Inc 電流導入端子及び半導体製造装置
JP3993408B2 (ja) * 2001-10-05 2007-10-17 株式会社巴川製紙所 静電チャック装置、その組立方法および静電チャック装置用部材
JP4021661B2 (ja) * 2001-12-27 2007-12-12 株式会社巴川製紙所 静電チャック装置
US8038796B2 (en) * 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
JP4767788B2 (ja) * 2006-08-12 2011-09-07 日本特殊陶業株式会社 静電チャック装置
JP4909704B2 (ja) * 2006-10-13 2012-04-04 日本特殊陶業株式会社 静電チャック装置
US7952851B2 (en) * 2008-10-31 2011-05-31 Axcelis Technologies, Inc. Wafer grounding method for electrostatic clamps
JP5563347B2 (ja) * 2010-03-30 2014-07-30 東京エレクトロン株式会社 プラズマ処理装置及び半導体装置の製造方法
JP5996340B2 (ja) * 2012-09-07 2016-09-21 東京エレクトロン株式会社 プラズマエッチング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130220545A1 (en) 2012-02-24 2013-08-29 Tokyo Electron Limited Substrate mounting table and plasma etching apparatus
JP2013191626A (ja) 2012-03-12 2013-09-26 Ngk Insulators Ltd 半導体製造装置及びその製法
US20130286531A1 (en) 2012-04-26 2013-10-31 Shinko Electric Industries Co., Ltd. Electrostatic chuck
JP2013229464A (ja) 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
US9887117B2 (en) 2018-02-06
JP6292977B2 (ja) 2018-03-14
TWI654713B (zh) 2019-03-21
US20150340261A1 (en) 2015-11-26
TW201604989A (zh) 2016-02-01
JP2015222748A (ja) 2015-12-10
KR20150135071A (ko) 2015-12-02

Similar Documents

Publication Publication Date Title
KR102103852B1 (ko) 정전척 및 반도체·액정 제조장치
KR102166737B1 (ko) 정전 척 및 반도체·액정 제조 장치
TWI747837B (zh) 用於電漿處理腔室的邊緣環組件及用於電漿處理的系統
US20190006156A1 (en) Plasma Processing Apparatus
JP4421874B2 (ja) プラズマ処理装置及びプラズマ処理方法
KR102353796B1 (ko) 정전척, 배치대, 플라즈마 처리 장치, 및 정전척의 제조방법
TW201923948A (zh) 具有電浮電源供應的基板支撐件
KR102035584B1 (ko) 정전 척 및 반도체 제조 장치
KR20180135152A (ko) 정전 척, 그를 포함하는 플라즈마 처리 장치 및 그를 이용한 반도체 소자의 제조방법
TWI421975B (zh) 電漿處理裝置用基板載置台、電漿處理裝置及絕緣皮膜之成膜方法
TW201606926A (zh) 具有射頻分流器的靜電夾頭
US20160079106A1 (en) Semiconductor manufacturing apparatus, control method of electrostatic chuck, and electrostatic chuck device
US20140224426A1 (en) Substrate support unit and plasma etching apparatus having the same
CN104992920B (zh) 一种控制静电吸盘吸力的方法
CN110828272B (zh) 腔室内衬、下电极装置和半导体处理设备
KR102559456B1 (ko) 기판 지지 어셈블리
KR102024799B1 (ko) 절연유닛 및 이를 포함하는 전극 조립체
JP5090281B2 (ja) 基板電位測定装置及び基板電位測定方法
KR20180035980A (ko) 플라즈마 식각장치의 포커스 링
JPWO2008029854A1 (ja) ドライエッチング装置及び方法
KR20130070089A (ko) 기판 처리 장치
KR20190093348A (ko) 정전 척 및 반도체 제조 장치
JP2012038998A (ja) プラズマ処理装置
KR20180000942U (ko) 접지 클램핑 유닛

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7