KR102067988B1 - 스크라이빙 방법 - Google Patents

스크라이빙 방법 Download PDF

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Publication number
KR102067988B1
KR102067988B1 KR1020170127555A KR20170127555A KR102067988B1 KR 102067988 B1 KR102067988 B1 KR 102067988B1 KR 1020170127555 A KR1020170127555 A KR 1020170127555A KR 20170127555 A KR20170127555 A KR 20170127555A KR 102067988 B1 KR102067988 B1 KR 102067988B1
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KR
South Korea
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KR1020170127555A
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English (en)
Korean (ko)
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KR20190037828A (ko
Inventor
성호영
Original Assignee
주식회사 탑 엔지니어링
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Priority to KR1020170127555A priority Critical patent/KR102067988B1/ko
Priority to TW107132848A priority patent/TWI715868B/zh
Priority to CN201811102687.4A priority patent/CN109574485B/zh
Publication of KR20190037828A publication Critical patent/KR20190037828A/ko
Application granted granted Critical
Publication of KR102067988B1 publication Critical patent/KR102067988B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020170127555A 2017-09-29 2017-09-29 스크라이빙 방법 KR102067988B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170127555A KR102067988B1 (ko) 2017-09-29 2017-09-29 스크라이빙 방법
TW107132848A TWI715868B (zh) 2017-09-29 2018-09-18 劃片方法和劃片設備
CN201811102687.4A CN109574485B (zh) 2017-09-29 2018-09-20 划片方法和划片设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170127555A KR102067988B1 (ko) 2017-09-29 2017-09-29 스크라이빙 방법

Publications (2)

Publication Number Publication Date
KR20190037828A KR20190037828A (ko) 2019-04-08
KR102067988B1 true KR102067988B1 (ko) 2020-01-20

Family

ID=65919813

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170127555A KR102067988B1 (ko) 2017-09-29 2017-09-29 스크라이빙 방법

Country Status (3)

Country Link
KR (1) KR102067988B1 (zh)
CN (1) CN109574485B (zh)
TW (1) TWI715868B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013014107A (ja) * 2011-07-06 2013-01-24 Mitsuboshi Diamond Industrial Co Ltd 基板加工装置および基板加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4509316B2 (ja) * 2000-07-03 2010-07-21 三星ダイヤモンド工業株式会社 マルチスクライブヘッドによるスクライブ法およびスクライバー
CN102276139B (zh) * 2004-07-16 2014-08-06 三星钻石工业股份有限公司 刀轮及其制造方法、手动划线工具及划线装置
KR100753162B1 (ko) 2005-12-29 2007-08-30 주식회사 탑 엔지니어링 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버
KR100863438B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법
KR100904381B1 (ko) * 2007-08-09 2009-06-25 주식회사 탑 엔지니어링 스크라이빙 방법 및 스크라이빙 장치
KR101796937B1 (ko) * 2011-04-26 2017-11-13 주식회사 탑 엔지니어링 스크라이빙 장치
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
KR101407415B1 (ko) * 2012-08-30 2014-06-17 주식회사 에스에프에이 기판 절단시스템
JP2016007843A (ja) * 2014-06-26 2016-01-18 三星ダイヤモンド工業株式会社 スクライブ装置
JP2016047787A (ja) * 2014-08-28 2016-04-07 三星ダイヤモンド工業株式会社 スクライビングツールおよびスクライブ装置
JP2016108169A (ja) * 2014-12-03 2016-06-20 三星ダイヤモンド工業株式会社 スクライビングツールおよびスクライブ装置
CN106865972B (zh) * 2017-04-10 2023-06-16 东旭光电科技股份有限公司 玻璃划线机

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013014107A (ja) * 2011-07-06 2013-01-24 Mitsuboshi Diamond Industrial Co Ltd 基板加工装置および基板加工方法

Also Published As

Publication number Publication date
TW201916137A (zh) 2019-04-16
TWI715868B (zh) 2021-01-11
CN109574485A (zh) 2019-04-05
CN109574485B (zh) 2022-04-05
KR20190037828A (ko) 2019-04-08

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