KR102064727B1 - 시트 부착 장치 및 장치의 대형화 방지 방법 - Google Patents

시트 부착 장치 및 장치의 대형화 방지 방법 Download PDF

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Publication number
KR102064727B1
KR102064727B1 KR1020130084030A KR20130084030A KR102064727B1 KR 102064727 B1 KR102064727 B1 KR 102064727B1 KR 1020130084030 A KR1020130084030 A KR 1020130084030A KR 20130084030 A KR20130084030 A KR 20130084030A KR 102064727 B1 KR102064727 B1 KR 102064727B1
Authority
KR
South Korea
Prior art keywords
frame member
frame
sheet
wafer
accommodating
Prior art date
Application number
KR1020130084030A
Other languages
English (en)
Korean (ko)
Other versions
KR20140011279A (ko
Inventor
요시아끼 수기시따
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20140011279A publication Critical patent/KR20140011279A/ko
Application granted granted Critical
Publication of KR102064727B1 publication Critical patent/KR102064727B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
    • B65G2207/02—Use of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/44—Moving, forwarding, guiding material
    • B65H2301/443—Moving, forwarding, guiding material by acting on surface of handled material
    • B65H2301/4433—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material
    • B65H2301/44335—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material using adhesive forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130084030A 2012-07-18 2013-07-17 시트 부착 장치 및 장치의 대형화 방지 방법 KR102064727B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012159676A JP6328874B2 (ja) 2012-07-18 2012-07-18 シート貼付装置および装置の大型化防止方法
JPJP-P-2012-159676 2012-07-18

Publications (2)

Publication Number Publication Date
KR20140011279A KR20140011279A (ko) 2014-01-28
KR102064727B1 true KR102064727B1 (ko) 2020-01-10

Family

ID=50050539

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130084030A KR102064727B1 (ko) 2012-07-18 2013-07-17 시트 부착 장치 및 장치의 대형화 방지 방법

Country Status (4)

Country Link
JP (1) JP6328874B2 (ja)
KR (1) KR102064727B1 (ja)
CN (1) CN103579045B (ja)
TW (1) TWI623971B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6710050B2 (ja) * 2016-01-19 2020-06-17 株式会社ディスコ 搬送装置
JP6678516B2 (ja) * 2016-05-31 2020-04-08 リンテック株式会社 シート貼付装置および貼付方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120840A (ja) * 1987-11-04 1989-05-12 Nec Corp 半導体マウント設備のリードフレーム供給装置
JPH09416A (ja) * 1995-06-23 1997-01-07 Akuteibu:Kk 衣服用ハンガー
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JP4001671B2 (ja) * 1998-03-26 2007-10-31 宮城沖電気株式会社 テープ剥離方法、テープ剥離機構及びテープ剥離装置
JP3770820B2 (ja) * 2001-10-03 2006-04-26 日東電工株式会社 保護テープの貼付け方法
JP2003297908A (ja) * 2002-04-02 2003-10-17 Mitsubishi Electric Corp 粘着シートの剥離装置およびこれを用いた剥離方法
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置

Also Published As

Publication number Publication date
JP2014022555A (ja) 2014-02-03
TW201409556A (zh) 2014-03-01
JP6328874B2 (ja) 2018-05-23
KR20140011279A (ko) 2014-01-28
CN103579045A (zh) 2014-02-12
TWI623971B (zh) 2018-05-11
CN103579045B (zh) 2019-02-15

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