CN103579045B - 片材粘贴装置及片材粘贴装置的大型化防止方法 - Google Patents

片材粘贴装置及片材粘贴装置的大型化防止方法 Download PDF

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Publication number
CN103579045B
CN103579045B CN201310298219.XA CN201310298219A CN103579045B CN 103579045 B CN103579045 B CN 103579045B CN 201310298219 A CN201310298219 A CN 201310298219A CN 103579045 B CN103579045 B CN 103579045B
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CN
China
Prior art keywords
unit
annular frame
attaching apparatus
sheet attaching
frame
Prior art date
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Active
Application number
CN201310298219.XA
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English (en)
Chinese (zh)
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CN103579045A (zh
Inventor
杉下芳昭
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Lintec Corp
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Lintec Corp
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Publication of CN103579045A publication Critical patent/CN103579045A/zh
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Publication of CN103579045B publication Critical patent/CN103579045B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
    • B65G2207/02—Use of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/44—Moving, forwarding, guiding material
    • B65H2301/443—Moving, forwarding, guiding material by acting on surface of handled material
    • B65H2301/4433—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material
    • B65H2301/44335—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material using adhesive forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201310298219.XA 2012-07-18 2013-07-16 片材粘贴装置及片材粘贴装置的大型化防止方法 Active CN103579045B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP2012-159676 2012-07-18
JP2012-159676 2012-07-18
JP2012159676A JP6328874B2 (ja) 2012-07-18 2012-07-18 シート貼付装置および装置の大型化防止方法

Publications (2)

Publication Number Publication Date
CN103579045A CN103579045A (zh) 2014-02-12
CN103579045B true CN103579045B (zh) 2019-02-15

Family

ID=50050539

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310298219.XA Active CN103579045B (zh) 2012-07-18 2013-07-16 片材粘贴装置及片材粘贴装置的大型化防止方法

Country Status (4)

Country Link
JP (1) JP6328874B2 (ja)
KR (1) KR102064727B1 (ja)
CN (1) CN103579045B (ja)
TW (1) TWI623971B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6710050B2 (ja) * 2016-01-19 2020-06-17 株式会社ディスコ 搬送装置
JP6678516B2 (ja) * 2016-05-31 2020-04-08 リンテック株式会社 シート貼付装置および貼付方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120840A (ja) * 1987-11-04 1989-05-12 Nec Corp 半導体マウント設備のリードフレーム供給装置
JPH11176915A (ja) * 1997-12-08 1999-07-02 Nitto Denko Corp 半導体ウエハの自動貼付け装置
JPH11274186A (ja) * 1998-03-26 1999-10-08 Miyagi Oki Denki Kk テープ剥離方法、テープ剥離機構及びテープ剥離装置
JP2003297908A (ja) * 2002-04-02 2003-10-17 Mitsubishi Electric Corp 粘着シートの剥離装置およびこれを用いた剥離方法
CN1293610C (zh) * 2001-10-03 2007-01-03 日东电工株式会社 保护带的贴附和剥离方法
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09416A (ja) * 1995-06-23 1997-01-07 Akuteibu:Kk 衣服用ハンガー

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120840A (ja) * 1987-11-04 1989-05-12 Nec Corp 半導体マウント設備のリードフレーム供給装置
JPH11176915A (ja) * 1997-12-08 1999-07-02 Nitto Denko Corp 半導体ウエハの自動貼付け装置
JPH11274186A (ja) * 1998-03-26 1999-10-08 Miyagi Oki Denki Kk テープ剥離方法、テープ剥離機構及びテープ剥離装置
CN1293610C (zh) * 2001-10-03 2007-01-03 日东电工株式会社 保护带的贴附和剥离方法
JP2003297908A (ja) * 2002-04-02 2003-10-17 Mitsubishi Electric Corp 粘着シートの剥離装置およびこれを用いた剥離方法
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置

Also Published As

Publication number Publication date
JP2014022555A (ja) 2014-02-03
CN103579045A (zh) 2014-02-12
TW201409556A (zh) 2014-03-01
KR102064727B1 (ko) 2020-01-10
KR20140011279A (ko) 2014-01-28
JP6328874B2 (ja) 2018-05-23
TWI623971B (zh) 2018-05-11

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