KR102063450B1 - 워크 분할장치 및 워크 분할방법 - Google Patents

워크 분할장치 및 워크 분할방법 Download PDF

Info

Publication number
KR102063450B1
KR102063450B1 KR1020170062855A KR20170062855A KR102063450B1 KR 102063450 B1 KR102063450 B1 KR 102063450B1 KR 1020170062855 A KR1020170062855 A KR 1020170062855A KR 20170062855 A KR20170062855 A KR 20170062855A KR 102063450 B1 KR102063450 B1 KR 102063450B1
Authority
KR
South Korea
Prior art keywords
dicing tape
work
heating
optical heating
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170062855A
Other languages
English (en)
Korean (ko)
Other versions
KR20170063475A (ko
Inventor
다스쿠 시미즈
다카시 후지타
노부오 고지마
Original Assignee
가부시키가이샤 토쿄 세이미쯔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 토쿄 세이미쯔 filed Critical 가부시키가이샤 토쿄 세이미쯔
Publication of KR20170063475A publication Critical patent/KR20170063475A/ko
Application granted granted Critical
Publication of KR102063450B1 publication Critical patent/KR102063450B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H01L21/78—
    • H01L21/324—
    • H01L21/67098—
    • H01L21/6836—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Dicing (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020170062855A 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법 Active KR102063450B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2011-031292 2011-02-16
JP2011031292 2011-02-16
JPJP-P-2012-000142 2012-01-04
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020120013859A Division KR101843794B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190179457A Division KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법

Publications (2)

Publication Number Publication Date
KR20170063475A KR20170063475A (ko) 2017-06-08
KR102063450B1 true KR102063450B1 (ko) 2020-01-08

Family

ID=47016199

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020170062855A Active KR102063450B1 (ko) 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법
KR1020180033136A Active KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A Active KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A Active KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020180033136A Active KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A Active KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A Active KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Country Status (2)

Country Link
JP (1) JP5854215B2 (https=)
KR (4) KR102063450B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658815B1 (ko) * 2015-04-16 2016-09-22 디에이치케이솔루션(주) 웨이퍼 확장 방법
CN110838462B (zh) * 2018-08-15 2022-12-13 北科天绘(合肥)激光技术有限公司 一种器件阵列的巨量转移方法及系统
JP7313219B2 (ja) 2019-07-22 2023-07-24 株式会社ディスコ エキスパンド方法及びエキスパンド装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045149A (ja) 2003-07-25 2005-02-17 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2005142365A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007157887A (ja) 2005-12-02 2007-06-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007226911A (ja) 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147317A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP2010206136A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd ワーク分割装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321070A (ja) * 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
JP4288392B2 (ja) 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
KR101151023B1 (ko) * 2002-10-28 2012-05-30 가부시키가이샤 토쿄 세이미쯔 익스팬드방법 및 익스팬드장치
JP2004200381A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP4841944B2 (ja) 2005-12-07 2011-12-21 株式会社ディスコ 加工装置
JP2010147316A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045149A (ja) 2003-07-25 2005-02-17 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2005142365A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007157887A (ja) 2005-12-02 2007-06-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007226911A (ja) 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147317A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP2010206136A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd ワーク分割装置

Also Published As

Publication number Publication date
KR102105280B1 (ko) 2020-04-27
KR20170063475A (ko) 2017-06-08
JP2012186446A (ja) 2012-09-27
KR20200045456A (ko) 2020-05-04
KR102102596B1 (ko) 2020-04-21
KR20180036661A (ko) 2018-04-09
KR102225430B1 (ko) 2021-03-08
JP5854215B2 (ja) 2016-02-09
KR20200003773A (ko) 2020-01-10

Similar Documents

Publication Publication Date Title
JP6452016B1 (ja) ワーク分割装置及びワーク分割方法
JP6249586B2 (ja) ワーク分割装置及びワーク分割方法
KR102105280B1 (ko) 워크 분할장치 및 워크 분할방법
JP5885033B2 (ja) ワーク分割装置及びワーク分割方法
JP7030469B2 (ja) テープ拡張装置及びテープ拡張方法
JP6414995B2 (ja) ワーク分割装置及びワーク分割方法
KR20120094428A (ko) 워크 분할장치 및 워크 분할방법
CN108400089B (zh) 一种激光退火方法
KR20120094429A (ko) 워크 분할장치 및 워크 분할방법
JP5939416B2 (ja) ワーク分割装置及びワーク分割方法
JP6060475B2 (ja) ワーク分割装置及びワーク分割方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A302 Request for accelerated examination
PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

PE0801 Dismissal of amendment

St.27 status event code: A-2-2-P10-P12-nap-PE0801

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

J301 Trial decision

Free format text: TRIAL NUMBER: 2018101001610; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20180412

Effective date: 20190923

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20190923

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2017 0062855

Appeal request date: 20180412

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2018101001610

PS0901 Examination by remand of revocation

St.27 status event code: A-6-3-E10-E12-rex-PS0901

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

St.27 status event code: A-3-4-F10-F13-rex-PS0701

A107 Divisional application of patent
PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000