KR102054536B1 - 반도체 웨이퍼를 세척하기 위한 원추형 스펀지 브러시 - Google Patents

반도체 웨이퍼를 세척하기 위한 원추형 스펀지 브러시 Download PDF

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Publication number
KR102054536B1
KR102054536B1 KR1020147030690A KR20147030690A KR102054536B1 KR 102054536 B1 KR102054536 B1 KR 102054536B1 KR 1020147030690 A KR1020147030690 A KR 1020147030690A KR 20147030690 A KR20147030690 A KR 20147030690A KR 102054536 B1 KR102054536 B1 KR 102054536B1
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South Korea
Prior art keywords
brush
substrate
axis
cleaning
core
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KR1020147030690A
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English (en)
Korean (ko)
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KR20140143431A (ko
Inventor
제프리 제이 티렐
브레들리 에스 위더즈
Original Assignee
일리노이즈 툴 워크스 인코포레이티드
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Publication of KR20140143431A publication Critical patent/KR20140143431A/ko
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    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B7/00—Bristle carriers arranged in the brush body
    • A46B7/04—Bristle carriers arranged in the brush body interchangeably removable bristle carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
    • A46B9/08—Supports or guides for bristles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Brushes (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020147030690A 2012-04-03 2013-04-02 반도체 웨이퍼를 세척하기 위한 원추형 스펀지 브러시 Active KR102054536B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261619512P 2012-04-03 2012-04-03
US61/619,512 2012-04-03
US13/803,211 2013-03-14
US13/803,211 US8778087B2 (en) 2012-04-03 2013-03-14 Conical sponge brush for cleaning semiconductor wafers
PCT/US2013/034964 WO2013152008A1 (en) 2012-04-03 2013-04-02 Conical sponge brush for cleaning semiconductor wafers

Publications (2)

Publication Number Publication Date
KR20140143431A KR20140143431A (ko) 2014-12-16
KR102054536B1 true KR102054536B1 (ko) 2019-12-10

Family

ID=49233228

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147030690A Active KR102054536B1 (ko) 2012-04-03 2013-04-02 반도체 웨이퍼를 세척하기 위한 원추형 스펀지 브러시

Country Status (5)

Country Link
US (2) US8778087B2 (enExample)
JP (1) JP6378168B2 (enExample)
KR (1) KR102054536B1 (enExample)
TW (1) TWI572419B (enExample)
WO (1) WO2013152008A1 (enExample)

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USD710062S1 (en) * 2011-06-09 2014-07-29 Ebara Corporation Roller shaft for semiconductor cleaning
CA2854475C (en) 2011-11-02 2016-07-19 Belanger, Inc. An illuminated hub for a vehicle wash component
US9079566B2 (en) * 2013-03-15 2015-07-14 Belanger, Inc. Absorbent media element for a vehicle wash component
TWD170203S (zh) * 2013-09-24 2015-09-01 荏原製作所股份有限公司 基板洗淨用滾軸桿之部分
USD735430S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
USD735429S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
CN103639130B (zh) * 2013-12-25 2015-11-25 河北宇牛电气设备有限公司 佛尘式绝缘子宽阈定位快速清洁装置
US9475272B2 (en) 2014-10-09 2016-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. De-bonding and cleaning process and system
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
WO2016164740A1 (en) * 2015-04-09 2016-10-13 Gen-Probe Incorporated Sample testing systems and methods with automated cleaning
CN105268671B (zh) * 2015-10-30 2017-08-29 国网山东省电力公司东营供电公司 附着式绝缘子本体清洁装置
CN106423949A (zh) * 2016-11-04 2017-02-22 广东技术师范学院 一种带有高效清理装置的控制器
JP6750040B2 (ja) * 2016-12-28 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6975588B2 (ja) * 2017-09-13 2021-12-01 三和テッキ株式会社 トロリ線用塗布装置
USD923890S1 (en) * 2018-09-07 2021-06-29 Maradyne Corporation Mattress surface cleaning agitator
CN111215367B (zh) * 2018-11-27 2021-11-05 荣耀终端有限公司 针棒和清胶装置
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
KR102748075B1 (ko) * 2020-10-12 2024-12-30 삼성전자주식회사 웨이퍼 세척 장치 및 웨이퍼 연마 장비
US12023779B2 (en) 2021-07-14 2024-07-02 Applied Materials, Inc. Post-chemical mechanical polishing brush cleaning box
CN116403948B (zh) * 2023-06-08 2023-09-05 山东凯一达智能科技有限公司 一种半导体元件制造设备及使用方法

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JP2008282865A (ja) * 2007-05-08 2008-11-20 Fuji Electric Device Technology Co Ltd スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
JP2008282865A (ja) * 2007-05-08 2008-11-20 Fuji Electric Device Technology Co Ltd スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ

Also Published As

Publication number Publication date
TW201345620A (zh) 2013-11-16
JP6378168B2 (ja) 2018-08-22
US20140283320A1 (en) 2014-09-25
TWI572419B (zh) 2017-03-01
US20130255720A1 (en) 2013-10-03
WO2013152008A1 (en) 2013-10-10
US8778087B2 (en) 2014-07-15
KR20140143431A (ko) 2014-12-16
JP2015517215A (ja) 2015-06-18
US9237797B2 (en) 2016-01-19

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