JP6378168B2 - 半導体ウェハーを洗浄する円錐型スポンジブラシ - Google Patents

半導体ウェハーを洗浄する円錐型スポンジブラシ Download PDF

Info

Publication number
JP6378168B2
JP6378168B2 JP2015504679A JP2015504679A JP6378168B2 JP 6378168 B2 JP6378168 B2 JP 6378168B2 JP 2015504679 A JP2015504679 A JP 2015504679A JP 2015504679 A JP2015504679 A JP 2015504679A JP 6378168 B2 JP6378168 B2 JP 6378168B2
Authority
JP
Japan
Prior art keywords
brush
substrate
axis
linear velocity
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015504679A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015517215A5 (enExample
JP2015517215A (ja
Inventor
ジェイ．ティレル ジェフェリー
ジェイ．ティレル ジェフェリー
エス．ウィザーズ ブラッドリー
エス．ウィザーズ ブラッドリー
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
イリノイ トゥール ワークス インコーポレイティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イリノイ トゥール ワークス インコーポレイティド, イリノイ トゥール ワークス インコーポレイティド filed Critical イリノイ トゥール ワークス インコーポレイティド
Publication of JP2015517215A publication Critical patent/JP2015517215A/ja
Publication of JP2015517215A5 publication Critical patent/JP2015517215A5/ja
Application granted granted Critical
Publication of JP6378168B2 publication Critical patent/JP6378168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B7/00—Bristle carriers arranged in the brush body
    • A46B7/04—Bristle carriers arranged in the brush body interchangeably removable bristle carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
    • A46B9/08—Supports or guides for bristles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Brushes (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015504679A 2012-04-03 2013-04-02 半導体ウェハーを洗浄する円錐型スポンジブラシ Active JP6378168B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261619512P 2012-04-03 2012-04-03
US61/619,512 2012-04-03
US13/803,211 US8778087B2 (en) 2012-04-03 2013-03-14 Conical sponge brush for cleaning semiconductor wafers
US13/803,211 2013-03-14
PCT/US2013/034964 WO2013152008A1 (en) 2012-04-03 2013-04-02 Conical sponge brush for cleaning semiconductor wafers

Publications (3)

Publication Number Publication Date
JP2015517215A JP2015517215A (ja) 2015-06-18
JP2015517215A5 JP2015517215A5 (enExample) 2016-06-02
JP6378168B2 true JP6378168B2 (ja) 2018-08-22

Family

ID=49233228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015504679A Active JP6378168B2 (ja) 2012-04-03 2013-04-02 半導体ウェハーを洗浄する円錐型スポンジブラシ

Country Status (5)

Country Link
US (2) US8778087B2 (enExample)
JP (1) JP6378168B2 (enExample)
KR (1) KR102054536B1 (enExample)
TW (1) TWI572419B (enExample)
WO (1) WO2013152008A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9168988B2 (en) * 2010-12-27 2015-10-27 Loch Stock and Barrel LLC Method of cleaning a rotating object
TWD148170S (zh) * 2011-06-09 2012-07-11 荏原製作所股份有限公司 基板洗淨用輥軸
CA2854475C (en) 2011-11-02 2016-07-19 Belanger, Inc. An illuminated hub for a vehicle wash component
US9079566B2 (en) * 2013-03-15 2015-07-14 Belanger, Inc. Absorbent media element for a vehicle wash component
USD735431S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
USD735429S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
USD735430S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
CN103639130B (zh) * 2013-12-25 2015-11-25 河北宇牛电气设备有限公司 佛尘式绝缘子宽阈定位快速清洁装置
US9475272B2 (en) * 2014-10-09 2016-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. De-bonding and cleaning process and system
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
WO2016164740A1 (en) * 2015-04-09 2016-10-13 Gen-Probe Incorporated Sample testing systems and methods with automated cleaning
CN105268671B (zh) * 2015-10-30 2017-08-29 国网山东省电力公司东营供电公司 附着式绝缘子本体清洁装置
CN106423949A (zh) * 2016-11-04 2017-02-22 广东技术师范学院 一种带有高效清理装置的控制器
CN110114857B (zh) * 2016-12-28 2023-06-13 芝浦机械电子株式会社 基板处理装置及基板处理方法
JP6975588B2 (ja) * 2017-09-13 2021-12-01 三和テッキ株式会社 トロリ線用塗布装置
USD923890S1 (en) * 2018-09-07 2021-06-29 Maradyne Corporation Mattress surface cleaning agitator
CN111215367B (zh) * 2018-11-27 2021-11-05 荣耀终端有限公司 针棒和清胶装置
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
KR102748075B1 (ko) * 2020-10-12 2024-12-30 삼성전자주식회사 웨이퍼 세척 장치 및 웨이퍼 연마 장비
US12023779B2 (en) 2021-07-14 2024-07-02 Applied Materials, Inc. Post-chemical mechanical polishing brush cleaning box
CN116403948B (zh) * 2023-06-08 2023-09-05 山东凯一达智能科技有限公司 一种半导体元件制造设备及使用方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1475079A (en) * 1920-06-08 1923-11-20 Miller Fred William Rotary brush
US2691181A (en) * 1950-04-07 1954-10-12 Gen Mills Inc Crumb sweeper
US3086241A (en) * 1961-10-20 1963-04-23 Frank W Bohn Glass washer
JPS596974A (ja) 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
JPH08299917A (ja) * 1995-05-08 1996-11-19 Wakomu Seisakusho:Kk 板状体洗浄方法および洗浄装置
KR100392828B1 (ko) 1995-10-13 2003-10-17 램 리서치 코포레이션 브러시를통한화학약품공급방법및장치
US5921399A (en) 1996-06-07 1999-07-13 Derrick Corporation Gumbo separator
US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JPH11625A (ja) * 1997-06-13 1999-01-06 Mitsubishi Materials Corp ウェーハの洗浄装置
JP3200036B2 (ja) 1998-05-22 2001-08-20 アイオン株式会社 洗浄用回転ブラシ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6269510B1 (en) 1999-01-04 2001-08-07 International Business Machines Corporation Post CMP clean brush with torque monitor
DE19901243A1 (de) 1999-01-14 2000-07-20 Heidelberger Druckmasch Ag Dosierbare Rasterwalze in einer Rotationsdruckmaschine
SG99307A1 (en) * 1999-06-01 2003-10-27 Applied Materials Inc Brush core for disk scrubbing apparatus and method for use thereof
US6240588B1 (en) 1999-12-03 2001-06-05 Lam Research Corporation Wafer scrubbing brush core
JP3844635B2 (ja) 2000-04-12 2006-11-15 株式会社荏原製作所 ロールスポンジ、ロールスポンジの製造方法、ロールスポンジの製造具及びロールスポンジを軸に取り付ける方法
US7955693B2 (en) 2001-04-20 2011-06-07 Tolland Development Company, Llc Foam composition roller brush with embedded mandrel
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
EP1474251A2 (en) * 2002-02-15 2004-11-10 Nutool, Inc. Integrated system for processing semiconductor wafers
US20040040576A1 (en) 2002-08-29 2004-03-04 Yuxia Sun Wafer cleaning brush
KR101158137B1 (ko) 2003-08-08 2012-06-19 엔테그리스, 아이엔씨. 회전식 기부 상에 주조된 일체형 다공성 패드를 제조하기위한 방법 및 재료
US6936540B2 (en) 2003-09-18 2005-08-30 Micron Technology, Inc. Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings
US7926144B1 (en) 2003-10-23 2011-04-19 R.E. Whittaker Company, Inc. Rollers and disks for carpet cleaning
US20050092350A1 (en) 2003-10-31 2005-05-05 Mark Buehler Scrubbing brush with ligand attachments
TWI245671B (en) 2005-03-08 2005-12-21 Quanta Display Inc Clean apparatus
JP4667264B2 (ja) 2006-02-08 2011-04-06 パナソニック株式会社 半導体基板の洗浄方法及び半導体基板の洗浄装置
USD622920S1 (en) 2007-05-02 2010-08-31 Entegris Corporation Cleaning sponge roller
JP2008282865A (ja) 2007-05-08 2008-11-20 Fuji Electric Device Technology Co Ltd スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ
TWM362051U (en) 2009-02-26 2009-08-01 Tung An Dev Ltd Structure for cleaning
US20130048018A1 (en) 2010-02-22 2013-02-28 Entegris, Inc. Post-cmp cleaning brush
GB2502483B (en) * 2010-09-20 2014-03-26 Ali Waqar Majeed Cleaning Device
US8821645B2 (en) * 2011-02-02 2014-09-02 Mari Kay Hentges Cosmetic removal apparatus
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
US20130283553A1 (en) * 2012-04-26 2013-10-31 Applied Materials, Inc. Anti-slip scrubber brush and assembly methods
US9119461B2 (en) * 2012-04-26 2015-09-01 Applied Materials, Inc. High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods

Also Published As

Publication number Publication date
TWI572419B (zh) 2017-03-01
KR102054536B1 (ko) 2019-12-10
KR20140143431A (ko) 2014-12-16
JP2015517215A (ja) 2015-06-18
US8778087B2 (en) 2014-07-15
US9237797B2 (en) 2016-01-19
US20140283320A1 (en) 2014-09-25
WO2013152008A1 (en) 2013-10-10
US20130255720A1 (en) 2013-10-03
TW201345620A (zh) 2013-11-16

Similar Documents

Publication Publication Date Title
JP6378168B2 (ja) 半導体ウェハーを洗浄する円錐型スポンジブラシ
JP6820285B2 (ja) 凹状突起部スポンジブラシ
JP7177110B2 (ja) 半導体洗浄用のアルキメデスブラシ
JP6027101B2 (ja) Ｐｖａスポンジブラシのブラシマンドレル
WO2013082092A1 (en) Brush with cantilevered nodules
KR101980206B1 (ko) Ｐｖａ 스폰지 브러시를 위한 브러시 굴대

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160404

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160404

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170221

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170519

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170821

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180509

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20180516

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180626

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180726

R150 Certificate of patent or registration of utility model

Ref document number: 6378168

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250