KR102032894B1 - 반도체 설비 로딩 구역의 웨이퍼 분포 상황 조합 검측 방법 및 장치 - Google Patents

반도체 설비 로딩 구역의 웨이퍼 분포 상황 조합 검측 방법 및 장치 Download PDF

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KR102032894B1
KR102032894B1 KR1020187001029A KR20187001029A KR102032894B1 KR 102032894 B1 KR102032894 B1 KR 102032894B1 KR 1020187001029 A KR1020187001029 A KR 1020187001029A KR 20187001029 A KR20187001029 A KR 20187001029A KR 102032894 B1 KR102032894 B1 KR 102032894B1
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South Korea
Prior art keywords
wafer
photoelectric
detection
sensor sets
loader
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KR1020187001029A
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English (en)
Korean (ko)
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KR20180016587A (ko
Inventor
동 수
카이 왕
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베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
KR1020187001029A 2015-06-17 2015-06-25 반도체 설비 로딩 구역의 웨이퍼 분포 상황 조합 검측 방법 및 장치 KR102032894B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201510336793.9 2015-06-17
CN201510336793.9A CN104916573B (zh) 2015-06-17 2015-06-17 半导体设备承载区域的硅片分布状态组合检测方法及装置
PCT/CN2015/082296 WO2016201717A1 (zh) 2015-06-17 2015-06-25 半导体设备承载区域的硅片分布状态组合检测方法及装置

Publications (2)

Publication Number Publication Date
KR20180016587A KR20180016587A (ko) 2018-02-14
KR102032894B1 true KR102032894B1 (ko) 2019-10-16

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KR (1) KR102032894B1 (zh)
CN (1) CN104916573B (zh)
WO (1) WO2016201717A1 (zh)

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CN105619406B (zh) * 2015-12-31 2017-10-17 北京七星华创电子股份有限公司 多指机械手片叉的校准方法
CN107799430B (zh) * 2016-08-29 2021-10-15 北京北方华创微电子装备有限公司 晶片位置检测方法
CN107481960B (zh) * 2017-08-15 2024-05-28 紫石能源有限公司 一种方形晶片偏移量的测量、校准装置及其方法
CN108321100B (zh) * 2018-02-12 2024-04-19 苏州卓樱自动化设备有限公司 一种硅片清洗前的湿度保持机构
CN110797277B (zh) * 2018-08-01 2022-05-27 北京北方华创微电子装备有限公司 硅片位置检测方法及装置、半导体加工设备
CN109671637B (zh) * 2018-11-08 2021-05-07 北京北方华创微电子装备有限公司 一种晶圆检测装置及方法
KR20200102612A (ko) 2019-02-21 2020-09-01 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR20200133506A (ko) * 2019-05-20 2020-11-30 에스케이하이닉스 주식회사 반도체 웨이퍼 처리 장치 및 그 동작 방법
CN110600404B (zh) * 2019-08-28 2022-05-13 福建省福联集成电路有限公司 一种检测晶圆放置情况的设备
JP7443141B2 (ja) * 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの制御方法
CN111863688A (zh) * 2020-08-12 2020-10-30 无锡市南亚科技有限公司 一种硅片检测装置结构
CN112660828B (zh) * 2020-12-29 2022-03-08 飞马智科信息技术股份有限公司 一种取代Map传感器的液晶面板检测控制方法
CN112894609A (zh) * 2021-02-08 2021-06-04 上海新昇半导体科技有限公司 化学机械抛光系统及化学机械抛光监测方法
CN117334594A (zh) * 2022-06-27 2024-01-02 天津市环欧新能源技术有限公司 一种硅片移行步进监控系统及监控方法
CN116555736B (zh) * 2023-04-06 2023-11-14 中润新能源(徐州)有限公司 用于石墨舟设备的硅片取放装置
CN117238821B (zh) * 2023-11-10 2024-01-23 北京锐洁机器人科技有限公司 一种转运晶圆的机械手指及手指连接件

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JP2007285810A (ja) 2006-04-14 2007-11-01 Mitsubishi Heavy Ind Ltd 光電変換層評価装置及び光電変換層の評価方法
JP2011249820A (ja) 2004-07-02 2011-12-08 Strasbaugh ウエハ処理方法およびシステム

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JPH10321706A (ja) * 1997-05-20 1998-12-04 Tokyo Electron Ltd キャリア載置機構
KR100252041B1 (ko) * 1997-10-30 2000-04-15 윤종용 캐리어 내에서의 웨이퍼 로딩 상태 검출장치 및 방법
KR100490203B1 (ko) * 2002-02-04 2005-05-17 삼성전자주식회사 웨이퍼 맵핑 방법
JP5185756B2 (ja) * 2008-10-01 2013-04-17 川崎重工業株式会社 基板検出装置および方法
CN102152297B (zh) * 2011-03-16 2013-04-10 哈尔滨工业大学 一种串联型r轴扩展机械臂
NL2007114C2 (en) * 2011-07-14 2013-01-15 Levitech B V Floating substrate monitoring and control device, and method for the same.
CN103632995B (zh) * 2012-08-13 2016-06-08 上海华虹宏力半导体制造有限公司 片盒监控系统
CN102874534B (zh) * 2012-10-08 2017-03-01 上海集成电路研发中心有限公司 自动化物料输送系统及其方法
CN103681421B (zh) * 2013-11-29 2016-08-17 北京七星华创电子股份有限公司 半导体扩散设备的石英舟升降装置

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JP2011249820A (ja) 2004-07-02 2011-12-08 Strasbaugh ウエハ処理方法およびシステム
JP2012199558A (ja) 2004-07-02 2012-10-18 Strasbaugh ウエハ処理方法およびシステム
JP2007285810A (ja) 2006-04-14 2007-11-01 Mitsubishi Heavy Ind Ltd 光電変換層評価装置及び光電変換層の評価方法

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CN104916573B (zh) 2018-07-06
WO2016201717A1 (zh) 2016-12-22
KR20180016587A (ko) 2018-02-14
CN104916573A (zh) 2015-09-16

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