KR102007404B1 - 발광소자 패키지 - Google Patents

발광소자 패키지 Download PDF

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Publication number
KR102007404B1
KR102007404B1 KR1020120146331A KR20120146331A KR102007404B1 KR 102007404 B1 KR102007404 B1 KR 102007404B1 KR 1020120146331 A KR1020120146331 A KR 1020120146331A KR 20120146331 A KR20120146331 A KR 20120146331A KR 102007404 B1 KR102007404 B1 KR 102007404B1
Authority
KR
South Korea
Prior art keywords
light emitting
disposed
emitting device
via hole
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020120146331A
Other languages
English (en)
Korean (ko)
Other versions
KR20140077478A (ko
Inventor
김병목
노영진
강보희
히로시 코다이라
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120146331A priority Critical patent/KR102007404B1/ko
Priority to EP13197210.1A priority patent/EP2744001A3/en
Priority to US14/105,439 priority patent/US9437791B2/en
Priority to JP2013258482A priority patent/JP6457713B2/ja
Priority to CN201310688975.3A priority patent/CN103872211B/zh
Publication of KR20140077478A publication Critical patent/KR20140077478A/ko
Application granted granted Critical
Publication of KR102007404B1 publication Critical patent/KR102007404B1/ko
Assigned to 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 reassignment 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 엘지이노텍 주식회사
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H10W72/583—Reinforcing structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
KR1020120146331A 2012-12-14 2012-12-14 발광소자 패키지 Expired - Fee Related KR102007404B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020120146331A KR102007404B1 (ko) 2012-12-14 2012-12-14 발광소자 패키지
EP13197210.1A EP2744001A3 (en) 2012-12-14 2013-12-13 Light emitting device package
US14/105,439 US9437791B2 (en) 2012-12-14 2013-12-13 Light emitting device package
JP2013258482A JP6457713B2 (ja) 2012-12-14 2013-12-13 発光素子パッケージ
CN201310688975.3A CN103872211B (zh) 2012-12-14 2013-12-16 发光器件封装

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120146331A KR102007404B1 (ko) 2012-12-14 2012-12-14 발광소자 패키지

Publications (2)

Publication Number Publication Date
KR20140077478A KR20140077478A (ko) 2014-06-24
KR102007404B1 true KR102007404B1 (ko) 2019-08-05

Family

ID=49759174

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120146331A Expired - Fee Related KR102007404B1 (ko) 2012-12-14 2012-12-14 발광소자 패키지

Country Status (5)

Country Link
US (1) US9437791B2 (https=)
EP (1) EP2744001A3 (https=)
JP (1) JP6457713B2 (https=)
KR (1) KR102007404B1 (https=)
CN (1) CN103872211B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
KR20160017849A (ko) * 2014-08-06 2016-02-17 서울바이오시스 주식회사 고출력 발광 장치 및 그 제조 방법
CN104465950A (zh) * 2014-12-02 2015-03-25 深圳市华星光电技术有限公司 一种发光二极管以及发光二极管的制造方法
JP2016138901A (ja) * 2015-01-26 2016-08-04 株式会社日立エルジーデータストレージ 光モジュール、及び走査型画像表示装置
DE102015205354A1 (de) * 2015-03-24 2016-09-29 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
CN106486590A (zh) * 2015-08-26 2017-03-08 深圳市斯迈得半导体有限公司 一种通用于应用线材焊线技术中的混合焊线装置
US20170356640A1 (en) * 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
CN106601701B (zh) * 2017-01-19 2023-03-28 贵州煜立电子科技有限公司 大功率二端表面引出脚电子元器件立体封装方法及结构
DE102017117165B4 (de) * 2017-07-28 2023-04-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
CN107644894B (zh) * 2017-09-18 2023-11-24 京东方科技集团股份有限公司 一种有机电致发光器件、其制备方法及显示装置
JP2020025034A (ja) * 2018-08-08 2020-02-13 ローム株式会社 Ｌｅｄパッケージ、ｌｅｄ表示装置
CN109713107A (zh) * 2018-12-13 2019-05-03 佛山市国星光电股份有限公司 支架结构、led器件和灯组阵列

Citations (3)

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JP2000101147A (ja) 1998-09-22 2000-04-07 Nichia Chem Ind Ltd 半導体装置及びその製造方法
JP2006128511A (ja) 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP2009099923A (ja) 2007-09-29 2009-05-07 Kyocera Corp 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法

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Publication number Priority date Publication date Assignee Title
JP2000101147A (ja) 1998-09-22 2000-04-07 Nichia Chem Ind Ltd 半導体装置及びその製造方法
JP2006128511A (ja) 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP2009099923A (ja) 2007-09-29 2009-05-07 Kyocera Corp 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法

Also Published As

Publication number Publication date
CN103872211A (zh) 2014-06-18
CN103872211B (zh) 2018-06-12
JP2014120778A (ja) 2014-06-30
EP2744001A3 (en) 2014-12-10
JP6457713B2 (ja) 2019-01-23
US20140167095A1 (en) 2014-06-19
US9437791B2 (en) 2016-09-06
KR20140077478A (ko) 2014-06-24
EP2744001A2 (en) 2014-06-18

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