KR101988188B1 - 야금 망상 조성물의 제조 및 그것의 사용 방법 - Google Patents

야금 망상 조성물의 제조 및 그것의 사용 방법 Download PDF

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KR101988188B1
KR101988188B1 KR1020187013019A KR20187013019A KR101988188B1 KR 101988188 B1 KR101988188 B1 KR 101988188B1 KR 1020187013019 A KR1020187013019 A KR 1020187013019A KR 20187013019 A KR20187013019 A KR 20187013019A KR 101988188 B1 KR101988188 B1 KR 101988188B1
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South Korea
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metal
composition
network
alloy
mass
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Korean (ko)
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KR20180054887A (ko
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캐서린 시어러
케니스 씨 홀콤
지 델버트 프리젠
마이클 씨 매튜스
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오르멧 서키츠 인코퍼레이티드
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/047—Making non-ferrous alloys by powder metallurgy comprising intermetallic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • C22C1/0491—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H01L2224/83825—
    • H01L2224/8384—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
KR1020187013019A 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법 Active KR101988188B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25836509P 2009-11-05 2009-11-05
US61/258,365 2009-11-05
PCT/US2010/055562 WO2011078918A2 (en) 2009-11-05 2010-11-05 Preparation of metallurgic network compositions and methods of use thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127014423A Division KR20120096928A (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197015899A Division KR102108773B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Publications (2)

Publication Number Publication Date
KR20180054887A KR20180054887A (ko) 2018-05-24
KR101988188B1 true KR101988188B1 (ko) 2019-06-11

Family

ID=44196381

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020187013019A Active KR101988188B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법
KR1020197015899A Active KR102108773B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법
KR1020127014423A Ceased KR20120096928A (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020197015899A Active KR102108773B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법
KR1020127014423A Ceased KR20120096928A (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Country Status (5)

Country Link
US (1) US8840700B2 (enExample)
JP (2) JP6203493B2 (enExample)
KR (3) KR101988188B1 (enExample)
TW (1) TWI481728B (enExample)
WO (1) WO2011078918A2 (enExample)

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US8221518B2 (en) 2009-04-02 2012-07-17 Ormet Circuits, Inc. Conductive compositions containing blended alloy fillers
KR101988188B1 (ko) 2009-11-05 2019-06-11 오르멧 서키츠 인코퍼레이티드 야금 망상 조성물의 제조 및 그것의 사용 방법
US8557146B1 (en) 2012-03-26 2013-10-15 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions
US9583453B2 (en) 2012-05-30 2017-02-28 Ormet Circuits, Inc. Semiconductor packaging containing sintering die-attach material
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JP6975708B2 (ja) * 2015-04-28 2021-12-01 オルメット・サーキッツ・インコーポレイテッド 半導体ダイ接着用途のための高金属負荷量の焼結ペースト
KR101658733B1 (ko) * 2015-07-08 2016-09-21 엘지전자 주식회사 태양 전지 모듈
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JPWO2018105128A1 (ja) * 2016-12-09 2019-10-24 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
WO2018105125A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
WO2018105127A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 接合体の製造方法、遷移的液相焼結用組成物、焼結体及び接合体
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Also Published As

Publication number Publication date
TWI481728B (zh) 2015-04-21
JP6203493B2 (ja) 2017-09-27
KR102108773B1 (ko) 2020-05-11
KR20180054887A (ko) 2018-05-24
US8840700B2 (en) 2014-09-23
WO2011078918A2 (en) 2011-06-30
US20110171372A1 (en) 2011-07-14
KR20190065473A (ko) 2019-06-11
JP2017222930A (ja) 2017-12-21
KR20120096928A (ko) 2012-08-31
TW201124542A (en) 2011-07-16
WO2011078918A3 (en) 2011-10-27
JP6976029B2 (ja) 2021-12-01
JP2013510240A (ja) 2013-03-21

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