KR101987398B1 - 신규한 열적 프로세싱 장치 - Google Patents
신규한 열적 프로세싱 장치 Download PDFInfo
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- KR101987398B1 KR101987398B1 KR1020147001261A KR20147001261A KR101987398B1 KR 101987398 B1 KR101987398 B1 KR 101987398B1 KR 1020147001261 A KR1020147001261 A KR 1020147001261A KR 20147001261 A KR20147001261 A KR 20147001261A KR 101987398 B1 KR101987398 B1 KR 101987398B1
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- Prior art keywords
- pulse
- energy
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- electromagnetic energy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
- F27B5/14—Arrangements of heating devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- High Energy & Nuclear Physics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161500727P | 2011-06-24 | 2011-06-24 | |
US61/500,727 | 2011-06-24 | ||
US13/194,775 US8569187B2 (en) | 2011-06-24 | 2011-07-29 | Thermal processing apparatus |
US13/194,552 | 2011-07-29 | ||
US13/194,775 | 2011-07-29 | ||
US13/194,552 US20120325784A1 (en) | 2011-06-24 | 2011-07-29 | Novel thermal processing apparatus |
PCT/US2012/043323 WO2012177743A2 (fr) | 2011-06-24 | 2012-06-20 | Nouvel appareil de traitement thermique |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140039300A KR20140039300A (ko) | 2014-04-01 |
KR101987398B1 true KR101987398B1 (ko) | 2019-06-10 |
Family
ID=47360854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147001261A KR101987398B1 (ko) | 2011-06-24 | 2012-06-20 | 신규한 열적 프로세싱 장치 |
Country Status (7)
Country | Link |
---|---|
US (3) | US8569187B2 (fr) |
EP (1) | EP2724364B1 (fr) |
JP (3) | JP6096184B2 (fr) |
KR (1) | KR101987398B1 (fr) |
CN (2) | CN103597587B (fr) |
TW (4) | TWI547978B (fr) |
WO (1) | WO2012177743A2 (fr) |
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US8569187B2 (en) * | 2011-06-24 | 2013-10-29 | Applied Materials, Inc. | Thermal processing apparatus |
FR2989388B1 (fr) * | 2012-04-17 | 2019-10-18 | Saint-Gobain Glass France | Procede d'obtention d'un substrat muni d'un revetement |
JP2015521368A (ja) * | 2012-04-18 | 2015-07-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | アドバンスアニールプロセスにおいて粒子を低減させる装置および方法 |
US9146337B2 (en) | 2013-03-11 | 2015-09-29 | Applied Materials, Inc. | Apparatus for speckle reduction, pulse stretching, and beam homogenization |
US9390926B2 (en) * | 2013-03-11 | 2016-07-12 | Applied Materials, Inc. | Process sheet resistance uniformity improvement using multiple melt laser exposures |
CN105643107B (zh) | 2013-03-12 | 2019-03-01 | 应用材料公司 | 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状 |
KR102163606B1 (ko) * | 2013-03-27 | 2020-10-08 | 고쿠리쓰다이가쿠호진 규슈다이가쿠 | 레이저 어닐링 장치 |
CN105453231B (zh) * | 2013-08-08 | 2019-06-11 | 应用材料公司 | 用于使用耗尽光束形成亚微米特征结构的反应物的光子活化 |
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US11204506B2 (en) * | 2014-03-05 | 2021-12-21 | TeraDiode, Inc. | Polarization-adjusted and shape-adjusted beam operation for materials processing |
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JP7048372B2 (ja) * | 2018-03-20 | 2022-04-05 | 株式会社Screenホールディングス | 熱処理装置および熱処理方法 |
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2011
- 2011-07-29 US US13/194,775 patent/US8569187B2/en active Active
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- 2012-06-20 WO PCT/US2012/043323 patent/WO2012177743A2/fr unknown
- 2012-06-20 EP EP12802296.9A patent/EP2724364B1/fr active Active
- 2012-06-20 KR KR1020147001261A patent/KR101987398B1/ko active IP Right Grant
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Patent Citations (3)
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JP2005217267A (ja) * | 2004-01-30 | 2005-08-11 | Sumitomo Heavy Ind Ltd | レーザ照射装置 |
US20090032511A1 (en) * | 2007-07-31 | 2009-02-05 | Adams Bruce E | Apparatus and method of improving beam shaping and beam homogenization |
WO2011027972A2 (fr) * | 2009-09-02 | 2011-03-10 | 위아코퍼레이션 주식회사 | Masque réfléchissant le laser et procédé de fabrication associé |
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Publication number | Publication date |
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JP6321237B2 (ja) | 2018-05-09 |
TWI654669B (zh) | 2019-03-21 |
US10181409B2 (en) | 2019-01-15 |
JP2017135390A (ja) | 2017-08-03 |
JP6290997B2 (ja) | 2018-03-07 |
EP2724364A4 (fr) | 2015-09-30 |
US20140138362A1 (en) | 2014-05-22 |
CN103597587A (zh) | 2014-02-19 |
US8569187B2 (en) | 2013-10-29 |
CN106141424A (zh) | 2016-11-23 |
TWI547978B (zh) | 2016-09-01 |
JP2014525141A (ja) | 2014-09-25 |
TW201926423A (zh) | 2019-07-01 |
EP2724364B1 (fr) | 2020-04-29 |
WO2012177743A3 (fr) | 2013-04-04 |
TW201812868A (zh) | 2018-04-01 |
TW201637079A (zh) | 2016-10-16 |
WO2012177743A2 (fr) | 2012-12-27 |
TW201303977A (zh) | 2013-01-16 |
EP2724364A2 (fr) | 2014-04-30 |
US20120329178A1 (en) | 2012-12-27 |
US20120325784A1 (en) | 2012-12-27 |
TWI700736B (zh) | 2020-08-01 |
JP2017041637A (ja) | 2017-02-23 |
CN103597587B (zh) | 2016-08-17 |
JP6096184B2 (ja) | 2017-03-15 |
CN106141424B (zh) | 2018-05-29 |
KR20140039300A (ko) | 2014-04-01 |
TWI600063B (zh) | 2017-09-21 |
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