KR101972226B1 - 기판 세정 장치 및 그것을 구비하는 기판 처리 장치 - Google Patents

기판 세정 장치 및 그것을 구비하는 기판 처리 장치 Download PDF

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KR101972226B1
KR101972226B1 KR1020170111729A KR20170111729A KR101972226B1 KR 101972226 B1 KR101972226 B1 KR 101972226B1 KR 1020170111729 A KR1020170111729 A KR 1020170111729A KR 20170111729 A KR20170111729 A KR 20170111729A KR 101972226 B1 KR101972226 B1 KR 101972226B1
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cleaning
substrate
space
section
forming member
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KR20180027357A (ko
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히로미 무라치
류이치 요시다
고지 니시야마
도루 몸마
지카라 사가에
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가부시키가이샤 스크린 홀딩스
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/6704—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
KR1020170111729A 2016-09-05 2017-09-01 기판 세정 장치 및 그것을 구비하는 기판 처리 장치 Active KR101972226B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-172672 2016-09-05
JP2016172672A JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置

Publications (2)

Publication Number Publication Date
KR20180027357A KR20180027357A (ko) 2018-03-14
KR101972226B1 true KR101972226B1 (ko) 2019-04-24

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KR1020170111729A Active KR101972226B1 (ko) 2016-09-05 2017-09-01 기판 세정 장치 및 그것을 구비하는 기판 처리 장치

Country Status (5)

Country Link
US (1) US10331049B2 (https=)
JP (1) JP6684191B2 (https=)
KR (1) KR101972226B1 (https=)
CN (1) CN107799442B (https=)
TW (1) TWI674153B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102081706B1 (ko) * 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN111069115A (zh) * 2018-10-22 2020-04-28 长鑫存储技术有限公司 一种cmp后清洗方法
JP7348021B2 (ja) * 2019-10-15 2023-09-20 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2021074825A (ja) * 2019-11-11 2021-05-20 株式会社ディスコ 保持面洗浄装置
CN111341699B (zh) * 2020-03-09 2023-03-31 杭州众硅电子科技有限公司 一种清洗刷预清洗系统
JP2024106671A (ja) * 2023-01-27 2024-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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JP2015019024A (ja) 2013-07-12 2015-01-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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Publication number Publication date
JP2018041754A (ja) 2018-03-15
CN107799442B (zh) 2021-09-14
CN107799442A (zh) 2018-03-13
KR20180027357A (ko) 2018-03-14
US10331049B2 (en) 2019-06-25
TWI674153B (zh) 2019-10-11
US20180067407A1 (en) 2018-03-08
TW201811453A (zh) 2018-04-01
JP6684191B2 (ja) 2020-04-22

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