JP6684191B2 - 基板洗浄装置およびそれを備える基板処理装置 - Google Patents

基板洗浄装置およびそれを備える基板処理装置 Download PDF

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Publication number
JP6684191B2
JP6684191B2 JP2016172672A JP2016172672A JP6684191B2 JP 6684191 B2 JP6684191 B2 JP 6684191B2 JP 2016172672 A JP2016172672 A JP 2016172672A JP 2016172672 A JP2016172672 A JP 2016172672A JP 6684191 B2 JP6684191 B2 JP 6684191B2
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Japan
Prior art keywords
substrate
cleaning
unit
end surface
forming member
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JP2016172672A
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English (en)
Japanese (ja)
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JP2018041754A (ja
JP2018041754A5 (https=
Inventor
弘美 村地
弘美 村地
隆一 吉田
隆一 吉田
耕二 西山
耕二 西山
徹 門間
徹 門間
力 寒河江
力 寒河江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
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Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2016172672A priority Critical patent/JP6684191B2/ja
Priority to TW106128549A priority patent/TWI674153B/zh
Priority to US15/691,929 priority patent/US10331049B2/en
Priority to KR1020170111729A priority patent/KR101972226B1/ko
Priority to CN201710779419.5A priority patent/CN107799442B/zh
Publication of JP2018041754A publication Critical patent/JP2018041754A/ja
Publication of JP2018041754A5 publication Critical patent/JP2018041754A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
JP2016172672A 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置 Active JP6684191B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016172672A JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置
TW106128549A TWI674153B (zh) 2016-09-05 2017-08-23 基板洗淨裝置及具備其之基板處理裝置
US15/691,929 US10331049B2 (en) 2016-09-05 2017-08-31 Substrate cleaning device and substrate processing apparatus including the same
KR1020170111729A KR101972226B1 (ko) 2016-09-05 2017-09-01 기판 세정 장치 및 그것을 구비하는 기판 처리 장치
CN201710779419.5A CN107799442B (zh) 2016-09-05 2017-09-01 基板清洗装置及具备该基板清洗装置的基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016172672A JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置

Publications (3)

Publication Number Publication Date
JP2018041754A JP2018041754A (ja) 2018-03-15
JP2018041754A5 JP2018041754A5 (https=) 2019-09-12
JP6684191B2 true JP6684191B2 (ja) 2020-04-22

Family

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Family Applications (1)

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JP2016172672A Active JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置

Country Status (5)

Country Link
US (1) US10331049B2 (https=)
JP (1) JP6684191B2 (https=)
KR (1) KR101972226B1 (https=)
CN (1) CN107799442B (https=)
TW (1) TWI674153B (https=)

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* Cited by examiner, † Cited by third party
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KR102081706B1 (ko) * 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN111069115A (zh) * 2018-10-22 2020-04-28 长鑫存储技术有限公司 一种cmp后清洗方法
JP7348021B2 (ja) * 2019-10-15 2023-09-20 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2021074825A (ja) * 2019-11-11 2021-05-20 株式会社ディスコ 保持面洗浄装置
CN111341699B (zh) * 2020-03-09 2023-03-31 杭州众硅电子科技有限公司 一种清洗刷预清洗系统
JP2024106671A (ja) * 2023-01-27 2024-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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JP3415435B2 (ja) * 1998-04-03 2003-06-09 東京エレクトロン株式会社 処理装置及び処理方法
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Also Published As

Publication number Publication date
KR101972226B1 (ko) 2019-04-24
JP2018041754A (ja) 2018-03-15
CN107799442B (zh) 2021-09-14
CN107799442A (zh) 2018-03-13
KR20180027357A (ko) 2018-03-14
US10331049B2 (en) 2019-06-25
TWI674153B (zh) 2019-10-11
US20180067407A1 (en) 2018-03-08
TW201811453A (zh) 2018-04-01

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