KR101967055B1 - 처리액 생성 장치 및 그것을 이용한 기판 처리 장치 - Google Patents

처리액 생성 장치 및 그것을 이용한 기판 처리 장치 Download PDF

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KR101967055B1
KR101967055B1 KR1020170096397A KR20170096397A KR101967055B1 KR 101967055 B1 KR101967055 B1 KR 101967055B1 KR 1020170096397 A KR1020170096397 A KR 1020170096397A KR 20170096397 A KR20170096397 A KR 20170096397A KR 101967055 B1 KR101967055 B1 KR 101967055B1
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South Korea
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concentration
liquid
treatment liquid
densitometer
valve
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Korean (ko)
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KR20180013807A (ko
Inventor
고노스케 하야시
구니히로 미야자키
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시바우라 메카트로닉스 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/6704—
    • H01L21/6715—
    • H01L21/67242—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring

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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170096397A 2016-07-29 2017-07-28 처리액 생성 장치 및 그것을 이용한 기판 처리 장치 Active KR101967055B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016150832 2016-07-29
JPJP-P-2016-150832 2016-07-29
JP2017124215A JP6918600B2 (ja) 2016-07-29 2017-06-26 処理液生成装置及びそれを用いた基板処理装置
JPJP-P-2017-124215 2017-06-26

Publications (2)

Publication Number Publication Date
KR20180013807A KR20180013807A (ko) 2018-02-07
KR101967055B1 true KR101967055B1 (ko) 2019-04-08

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KR1020170096397A Active KR101967055B1 (ko) 2016-07-29 2017-07-28 처리액 생성 장치 및 그것을 이용한 기판 처리 장치

Country Status (3)

Country Link
JP (1) JP6918600B2 (https=)
KR (1) KR101967055B1 (https=)
TW (1) TWI653661B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7304692B2 (ja) * 2018-12-13 2023-07-07 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7264729B2 (ja) * 2019-05-31 2023-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102374423B1 (ko) * 2019-06-28 2022-03-15 홍석진 다중 농도 측정 장치를 구비한 현상액 농도 관리 장치
JP7665556B2 (ja) 2022-03-24 2025-04-21 芝浦メカトロニクス株式会社 処理液供給装置、基板処理装置及び処理液供給装置の検査方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100837673B1 (ko) * 2001-12-05 2008-06-13 후지쯔 가부시끼가이샤 약액 공급 장치 및 슬러리의 조합 방법
JP2013197360A (ja) * 2012-03-21 2013-09-30 Shibaura Mechatronics Corp 基板処理方法及び基板処理システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5924794A (en) * 1995-02-21 1999-07-20 Fsi International, Inc. Chemical blending system with titrator control
CN1332741C (zh) * 2002-07-19 2007-08-22 动力系统有限公司 混合过程原料的方法和设备
JP2005347384A (ja) * 2004-06-01 2005-12-15 Seiko Epson Corp 有機物の剥離装置及び有機物の剥離方法
JP2007005472A (ja) * 2005-06-22 2007-01-11 Sumitomo Electric Ind Ltd 基板の表面処理方法およびｉｉｉ−ｖ族化合物半導体の製造方法
KR20080011910A (ko) * 2006-08-01 2008-02-11 세메스 주식회사 약액 혼합 장치 및 방법
JP2008103678A (ja) * 2006-09-20 2008-05-01 Dainippon Screen Mfg Co Ltd 基板処理装置
CN103717351A (zh) * 2011-08-01 2014-04-09 巴斯夫欧洲公司 一种制造半导体装置的方法，其包括在具有3.0至5.5的pH值的CMP组合物的存在下化学机械抛光元素锗及/或Si1-xGex 材料
JP5858770B2 (ja) 2011-12-19 2016-02-10 芝浦メカトロニクス株式会社 基板処理システム
TWI619155B (zh) 2013-05-14 2018-03-21 Shibaura Mechatronics Corporation 液供給裝置及基板處理裝置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100837673B1 (ko) * 2001-12-05 2008-06-13 후지쯔 가부시끼가이샤 약액 공급 장치 및 슬러리의 조합 방법
JP2013197360A (ja) * 2012-03-21 2013-09-30 Shibaura Mechatronics Corp 基板処理方法及び基板処理システム

Also Published As

Publication number Publication date
TW201816835A (zh) 2018-05-01
KR20180013807A (ko) 2018-02-07
TWI653661B (zh) 2019-03-11
JP6918600B2 (ja) 2021-08-11
JP2018026537A (ja) 2018-02-15

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