TWI653661B - 處理液生成裝置及使用該裝置的基板處理裝置 - Google Patents

處理液生成裝置及使用該裝置的基板處理裝置 Download PDF

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Publication number
TWI653661B
TWI653661B TW106122352A TW106122352A TWI653661B TW I653661 B TWI653661 B TW I653661B TW 106122352 A TW106122352 A TW 106122352A TW 106122352 A TW106122352 A TW 106122352A TW I653661 B TWI653661 B TW I653661B
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TW
Taiwan
Prior art keywords
concentration
processing liquid
liquid
processing
path
Prior art date
Application number
TW106122352A
Other languages
English (en)
Chinese (zh)
Other versions
TW201816835A (zh
Inventor
Konosuke Hayashi
林航之介
Kunihiro Miyazaki
宮崎邦浩
Original Assignee
Shibaura Mechatronics Corporation
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shibaura Mechatronics Corporation, 芝浦機械電子裝置股份有限公司 filed Critical Shibaura Mechatronics Corporation
Publication of TW201816835A publication Critical patent/TW201816835A/zh
Application granted granted Critical
Publication of TWI653661B publication Critical patent/TWI653661B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106122352A 2016-07-29 2017-07-04 處理液生成裝置及使用該裝置的基板處理裝置 TWI653661B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016150832 2016-07-29
JP2016-150832 2016-07-29
JP2017124215A JP6918600B2 (ja) 2016-07-29 2017-06-26 処理液生成装置及びそれを用いた基板処理装置
JP2017-124215 2017-06-26

Publications (2)

Publication Number Publication Date
TW201816835A TW201816835A (zh) 2018-05-01
TWI653661B true TWI653661B (zh) 2019-03-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106122352A TWI653661B (zh) 2016-07-29 2017-07-04 處理液生成裝置及使用該裝置的基板處理裝置

Country Status (3)

Country Link
JP (1) JP6918600B2 (https=)
KR (1) KR101967055B1 (https=)
TW (1) TWI653661B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7304692B2 (ja) * 2018-12-13 2023-07-07 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7264729B2 (ja) * 2019-05-31 2023-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102374423B1 (ko) * 2019-06-28 2022-03-15 홍석진 다중 농도 측정 장치를 구비한 현상액 농도 관리 장치
JP7665556B2 (ja) 2022-03-24 2025-04-21 芝浦メカトロニクス株式会社 処理液供給装置、基板処理装置及び処理液供給装置の検査方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7863195B2 (en) 2001-12-05 2011-01-04 Fujitsu Semiconductor Limited Chemical solution feeding apparatus and method for preparing slurry
TW201330153A (zh) 2011-12-19 2013-07-16 芝浦機械電子裝置股份有限公司 基板處理方法及基板處理系統
TW201507011A (zh) 2013-05-14 2015-02-16 芝浦機械電子裝置股份有限公司 液供給裝置及基板處理裝置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5924794A (en) * 1995-02-21 1999-07-20 Fsi International, Inc. Chemical blending system with titrator control
CN1332741C (zh) * 2002-07-19 2007-08-22 动力系统有限公司 混合过程原料的方法和设备
JP2005347384A (ja) * 2004-06-01 2005-12-15 Seiko Epson Corp 有機物の剥離装置及び有機物の剥離方法
JP2007005472A (ja) * 2005-06-22 2007-01-11 Sumitomo Electric Ind Ltd 基板の表面処理方法およびｉｉｉ−ｖ族化合物半導体の製造方法
KR20080011910A (ko) * 2006-08-01 2008-02-11 세메스 주식회사 약액 혼합 장치 및 방법
JP2008103678A (ja) * 2006-09-20 2008-05-01 Dainippon Screen Mfg Co Ltd 基板処理装置
CN103717351A (zh) * 2011-08-01 2014-04-09 巴斯夫欧洲公司 一种制造半导体装置的方法，其包括在具有3.0至5.5的pH值的CMP组合物的存在下化学机械抛光元素锗及/或Si1-xGex 材料
JP5878051B2 (ja) * 2012-03-21 2016-03-08 芝浦メカトロニクス株式会社 基板処理方法及び基板処理システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7863195B2 (en) 2001-12-05 2011-01-04 Fujitsu Semiconductor Limited Chemical solution feeding apparatus and method for preparing slurry
TW201330153A (zh) 2011-12-19 2013-07-16 芝浦機械電子裝置股份有限公司 基板處理方法及基板處理系統
TW201507011A (zh) 2013-05-14 2015-02-16 芝浦機械電子裝置股份有限公司 液供給裝置及基板處理裝置

Also Published As

Publication number Publication date
KR101967055B1 (ko) 2019-04-08
TW201816835A (zh) 2018-05-01
KR20180013807A (ko) 2018-02-07
JP6918600B2 (ja) 2021-08-11
JP2018026537A (ja) 2018-02-15

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