JP6918600B2 - 処理液生成装置及びそれを用いた基板処理装置 - Google Patents

処理液生成装置及びそれを用いた基板処理装置 Download PDF

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Publication number
JP6918600B2
JP6918600B2 JP2017124215A JP2017124215A JP6918600B2 JP 6918600 B2 JP6918600 B2 JP 6918600B2 JP 2017124215 A JP2017124215 A JP 2017124215A JP 2017124215 A JP2017124215 A JP 2017124215A JP 6918600 B2 JP6918600 B2 JP 6918600B2
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Prior art keywords
concentration
treatment liquid
densitometer
liquid
calibration
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JP2017124215A
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Japanese (ja)
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JP2018026537A (ja
JP2018026537A5 (https=
Inventor
林　航之介
航之介 林
邦浩 宮崎
邦浩 宮崎
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to TW106122352A priority Critical patent/TWI653661B/zh
Priority to CN201710624077.XA priority patent/CN107665839B/zh
Priority to US15/661,480 priority patent/US11670522B2/en
Priority to KR1020170096397A priority patent/KR101967055B1/ko
Publication of JP2018026537A publication Critical patent/JP2018026537A/ja
Publication of JP2018026537A5 publication Critical patent/JP2018026537A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring

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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017124215A 2016-07-29 2017-06-26 処理液生成装置及びそれを用いた基板処理装置 Active JP6918600B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW106122352A TWI653661B (zh) 2016-07-29 2017-07-04 處理液生成裝置及使用該裝置的基板處理裝置
CN201710624077.XA CN107665839B (zh) 2016-07-29 2017-07-27 处理液生成装置和使用该处理液生成装置的基板处理装置
US15/661,480 US11670522B2 (en) 2016-07-29 2017-07-27 Processing liquid generator and substrate processing apparatus using the same
KR1020170096397A KR101967055B1 (ko) 2016-07-29 2017-07-28 처리액 생성 장치 및 그것을 이용한 기판 처리 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016150832 2016-07-29
JP2016150832 2016-07-29

Publications (3)

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JP2018026537A JP2018026537A (ja) 2018-02-15
JP2018026537A5 JP2018026537A5 (https=) 2018-07-12
JP6918600B2 true JP6918600B2 (ja) 2021-08-11

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JP2017124215A Active JP6918600B2 (ja) 2016-07-29 2017-06-26 処理液生成装置及びそれを用いた基板処理装置

Country Status (3)

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JP (1) JP6918600B2 (https=)
KR (1) KR101967055B1 (https=)
TW (1) TWI653661B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7304692B2 (ja) * 2018-12-13 2023-07-07 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7264729B2 (ja) * 2019-05-31 2023-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102374423B1 (ko) * 2019-06-28 2022-03-15 홍석진 다중 농도 측정 장치를 구비한 현상액 농도 관리 장치
JP7665556B2 (ja) 2022-03-24 2025-04-21 芝浦メカトロニクス株式会社 処理液供給装置、基板処理装置及び処理液供給装置の検査方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5924794A (en) * 1995-02-21 1999-07-20 Fsi International, Inc. Chemical blending system with titrator control
JP4456308B2 (ja) 2001-12-05 2010-04-28 富士通マイクロエレクトロニクス株式会社 薬液供給装置
CN1332741C (zh) * 2002-07-19 2007-08-22 动力系统有限公司 混合过程原料的方法和设备
JP2005347384A (ja) * 2004-06-01 2005-12-15 Seiko Epson Corp 有機物の剥離装置及び有機物の剥離方法
JP2007005472A (ja) * 2005-06-22 2007-01-11 Sumitomo Electric Ind Ltd 基板の表面処理方法およびｉｉｉ−ｖ族化合物半導体の製造方法
KR20080011910A (ko) * 2006-08-01 2008-02-11 세메스 주식회사 약액 혼합 장치 및 방법
JP2008103678A (ja) * 2006-09-20 2008-05-01 Dainippon Screen Mfg Co Ltd 基板処理装置
CN103717351A (zh) * 2011-08-01 2014-04-09 巴斯夫欧洲公司 一种制造半导体装置的方法，其包括在具有3.0至5.5的pH值的CMP组合物的存在下化学机械抛光元素锗及/或Si1-xGex 材料
JP5858770B2 (ja) 2011-12-19 2016-02-10 芝浦メカトロニクス株式会社 基板処理システム
JP5878051B2 (ja) * 2012-03-21 2016-03-08 芝浦メカトロニクス株式会社 基板処理方法及び基板処理システム
TWI619155B (zh) 2013-05-14 2018-03-21 Shibaura Mechatronics Corporation 液供給裝置及基板處理裝置

Also Published As

Publication number Publication date
KR101967055B1 (ko) 2019-04-08
TW201816835A (zh) 2018-05-01
KR20180013807A (ko) 2018-02-07
TWI653661B (zh) 2019-03-11
JP2018026537A (ja) 2018-02-15

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