KR101942368B1 - 전도성 나노필러를 포함하는 복합 재료 - Google Patents

전도성 나노필러를 포함하는 복합 재료 Download PDF

Info

Publication number
KR101942368B1
KR101942368B1 KR1020147017258A KR20147017258A KR101942368B1 KR 101942368 B1 KR101942368 B1 KR 101942368B1 KR 1020147017258 A KR1020147017258 A KR 1020147017258A KR 20147017258 A KR20147017258 A KR 20147017258A KR 101942368 B1 KR101942368 B1 KR 101942368B1
Authority
KR
South Korea
Prior art keywords
composition
delete delete
nanofiller
thermoplastic polymer
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020147017258A
Other languages
English (en)
Korean (ko)
Other versions
KR20140105777A (ko
Inventor
카멜로 루카 레스투치아
피오렌조 렌지
에밀리아노 프룰로니
나탈리 데니스 조단
마크 에드워드 해리먼
Original Assignee
사이텍 테크놀러지 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사이텍 테크놀러지 코포레이션 filed Critical 사이텍 테크놀러지 코포레이션
Publication of KR20140105777A publication Critical patent/KR20140105777A/ko
Application granted granted Critical
Publication of KR101942368B1 publication Critical patent/KR101942368B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/753—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc. with polymeric or organic binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/842—Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
    • Y10S977/847—Surface modifications, e.g. functionalization, coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Conductive Materials (AREA)
KR1020147017258A 2011-12-23 2012-12-19 전도성 나노필러를 포함하는 복합 재료 Expired - Fee Related KR101942368B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1122296.5 2011-12-23
GBGB1122296.5A GB201122296D0 (en) 2011-12-23 2011-12-23 Composite materials
PCT/US2012/070472 WO2013141916A2 (en) 2011-12-23 2012-12-19 Composite materials comprising conductive nano-fillers

Publications (2)

Publication Number Publication Date
KR20140105777A KR20140105777A (ko) 2014-09-02
KR101942368B1 true KR101942368B1 (ko) 2019-01-28

Family

ID=45573028

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147017258A Expired - Fee Related KR101942368B1 (ko) 2011-12-23 2012-12-19 전도성 나노필러를 포함하는 복합 재료

Country Status (16)

Country Link
US (2) US9640297B2 (https=)
EP (1) EP2768905B1 (https=)
JP (1) JP6184974B2 (https=)
KR (1) KR101942368B1 (https=)
CN (2) CN107254063B (https=)
AU (1) AU2012374052B2 (https=)
BR (1) BR112014011614B1 (https=)
CA (1) CA2860205C (https=)
ES (1) ES2727047T3 (https=)
GB (1) GB201122296D0 (https=)
IN (1) IN2014CN04489A (https=)
MX (1) MX2014005925A (https=)
MY (1) MY170238A (https=)
RU (1) RU2611512C2 (https=)
TW (1) TWI580731B (https=)
WO (1) WO2013141916A2 (https=)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201122296D0 (en) * 2011-12-23 2012-02-01 Cytec Tech Corp Composite materials
CN104837926B (zh) 2013-12-06 2017-10-13 Lg化学株式会社 用于雷达罩的热塑性树脂组合物
GB201322093D0 (en) * 2013-12-13 2014-01-29 Cytec Ind Inc Compositive materials with electrically conductive and delamination resistant properties
JP6049606B2 (ja) * 2013-12-25 2016-12-21 株式会社ノリタケカンパニーリミテド 加熱硬化型導電性ペースト
KR101477430B1 (ko) * 2013-12-30 2014-12-29 삼성전기주식회사 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품의 실장 기판
IL231673A0 (en) * 2014-03-24 2014-08-31 Israel Aerospace Ind Ltd Composite sandwich structures
WO2016003339A1 (en) * 2014-07-03 2016-01-07 Saab Ab A composite article having multifunctional properties and method for its manufacture
CN104448239B (zh) * 2014-10-11 2017-02-22 浙江大学 一种高强度环氧树脂复合材料及其制备方法
TWI663896B (zh) * 2014-10-15 2019-06-21 美商羅傑斯公司 磁-電介質基板、製作該磁-電介質基板之方法及包含該磁-電介質基板之物件
CN104527175A (zh) * 2014-12-15 2015-04-22 沈阳航空航天大学 一种纳米吸波薄膜功能化改性复合材料层压板的方法
KR102408039B1 (ko) * 2014-12-18 2022-06-13 사이텍 인더스트리스 인코포레이티드 액상 수지 주입에 적합한 개질된 수지 시스템
RU2604838C2 (ru) * 2015-01-12 2016-12-10 ФЕДЕРАЛЬНОЕ ГОСУДАРСТВЕННОЕ ВОЕННОЕ ОБРАЗОВАТЕЛЬНОЕ УЧРЕЖДЕНИЕ ВЫСШЕГО ПРОФЕССИОНАЛЬНОГО ОБРАЗОВАНИЯ "ВОЕННАЯ АКАДЕМИЯ ТЫЛА И ТРАНСПОРТА имени Генерала армии А.В. Хрулева" Нанокомпозит на основе углеродных нанотрубок для защиты радиоэлектронных элементов от ударного ускорения
US10105909B1 (en) * 2015-03-23 2018-10-23 The United States Of America As Represented By The Administrator Of Nasa Three-dimensional multifunctional ablative thermal protection system
KR20160116599A (ko) 2015-03-30 2016-10-10 삼성전자주식회사 도전성 복합체 제조용 조성물, 이로부터 제조된 복합체, 및 이를 포함한 전자 소자
US10364341B2 (en) * 2015-04-08 2019-07-30 Arevo, Inc. Method and apparatus for 3d printing of nano-filler/polymer composites
US10049784B2 (en) * 2015-10-07 2018-08-14 King Fahd University Of Petroleum And Minerals Nanocomposite films with conducting and insulating surfaces
US9493696B1 (en) 2015-11-24 2016-11-15 International Business Machines Corporation Multiphase resins with reduced percolation threshold
CN106189233A (zh) * 2016-07-11 2016-12-07 佛山杰致信息科技有限公司 一种高分子电热材料及其制备方法
DE102016220092A1 (de) * 2016-10-14 2018-04-19 Robert Bosch Gmbh Halbzeug zur Kontaktierung von Bauteilen
JP6987516B2 (ja) 2017-03-30 2022-01-05 住友化学株式会社 芳香族ポリスルホン、芳香族ポリスルホン組成物、及び芳香族ポリスルホンの製造方法
RU2669823C1 (ru) * 2017-11-07 2018-10-16 Кирилл Олегович Морозов Способ получения нанокомпозитного материала
DE102018100302A1 (de) * 2018-01-09 2019-07-11 Wobben Properties Gmbh Windenergieanlagen-Rotorblatt
KR20200144556A (ko) 2018-03-28 2020-12-29 졸텍 코포레이션 탄소 섬유용 전기 전도성 사이징
US11767436B2 (en) * 2018-08-01 2023-09-26 The Boeing Company Thermal and cold spray plastic coating covering vehicle fasteners inside fuel tank for lightning strike and other electromagnetic protection
US20230032553A1 (en) * 2018-08-21 2023-02-02 Laird Technologies, Inc. Electromagnetic interference (emi) mitigation materials and emi absorbing compositions including carbon nanotubes
CN112840002A (zh) * 2018-10-30 2021-05-25 汉高知识产权控股有限责任公司 导电油墨组合物
EP3880745A2 (en) 2018-11-13 2021-09-22 PPG Industries Ohio Inc. Conductive polymer composition
CN109593295B (zh) * 2018-11-27 2020-10-30 厦门众臣元科技有限公司 一种pvc导电脚轮材料及其制备方法
RU2704482C1 (ru) * 2019-04-18 2019-10-29 Федеральное государственное бюджетное образовательное учреждение высшего образования "Кабардино-Балкарский государственный университет им. Х.М. Бербекова" (КБГУ) Композиционный материал
EP3969508A1 (en) * 2019-05-15 2022-03-23 3M Innovative Properties Company (co)polymer matrix composites comprising thermally-conductive particles and magnetic particles and methods of making the same
US11258184B2 (en) * 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
CN110564107B (zh) * 2019-09-19 2022-07-12 四川大学 一种高效电磁屏蔽复合材料及其制备方法
FI20195949A1 (en) 2019-11-05 2021-05-06 Arctic Biomaterials Oy Conductive polymer composition
KR102305494B1 (ko) * 2019-11-13 2021-09-24 성균관대학교산학협력단 열 계면 소재, 이의 제조 방법 및 이를 포함하는 방열 장치 또는 시스템
CN111100531A (zh) * 2019-12-13 2020-05-05 江苏艾德卡建材科技有限公司 一种水性环氧防静电地坪底、中涂涂料及其施工工艺
RU2756749C2 (ru) * 2020-02-24 2021-10-05 Ирина Анатольевна Задорожная Способ изготовления противоосколочного экранирующего полотна
KR102276145B1 (ko) * 2020-04-20 2021-07-12 한국항공우주산업 주식회사 전파흡수용 구조체
RU2746096C1 (ru) * 2020-07-10 2021-04-06 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Установка для ориентирования нанотрубок
TWI864310B (zh) 2020-07-28 2024-12-01 愛爾蘭商范斯福複合材料有限公司 介電基板及含彼之包銅層板及印刷電路板
TWI833095B (zh) 2020-07-28 2024-02-21 美商聖高拜塑膠製品公司 敷銅層板、含其之印刷電路基板及其形成方法
RU2756754C1 (ru) * 2020-12-04 2021-10-05 МСД Текнолоджис С.а р.л. Способ получения электропроводящего полиуретанового композиционного материала и материал
CN116584155A (zh) 2020-12-16 2023-08-11 美国圣戈班性能塑料公司 覆铜层压板及其形成方法
TWI823206B (zh) 2020-12-16 2023-11-21 美商聖高拜塑膠製品公司 介電基板及其製造方法
KR20230118834A (ko) 2020-12-16 2023-08-14 생-고뱅 퍼포먼스 플라스틱스 코포레이션 유전체 기판 및 이를 형성하는 방법
KR102362090B1 (ko) * 2021-01-11 2022-02-15 한국과학기술연구원 섬유 강화 복합 소재의 플라즈마 방전을 이용한 레이더 흡수 섬유강화구조체 및 이를 포함하는 스텔스 시스템
JP7612498B2 (ja) * 2021-04-19 2025-01-14 三菱重工業株式会社 複合材料構造体
KR20240022457A (ko) 2021-06-14 2024-02-20 사이텍 인더스트리스 인코포레이티드 복합 물품을 제조하기 위한 공정, 및 이에 의해 제조된 복합 물품
DE102021121497A1 (de) 2021-08-19 2023-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Zusammensetzung zur Herstellung eines flächigen Halbzeugs
US20240376640A1 (en) 2021-10-06 2024-11-14 Cytec Industries Inc. A spinneret housing for use in the manufacture of polymer fibers, and method of use thereof.
EP4413185A1 (en) 2021-10-06 2024-08-14 Cytec Industries Inc. An apparatus for improved coagulation injection during the manufacture of polymer fibers, and method of use thereof
KR102521946B1 (ko) * 2022-02-24 2023-04-17 한국항공우주산업 주식회사 전자파흡수필름 제조방법 및 전자파흡수필름을 포함하는 항공기용 전자파흡수패널
US20250215171A1 (en) 2022-03-30 2025-07-03 Toray Industries, Inc. Carbon fiber reinforced composite material and prepreg
WO2023195383A1 (ja) 2022-04-06 2023-10-12 東レ株式会社 炭素繊維複合材料
KR102688580B1 (ko) * 2022-09-29 2024-07-25 경상국립대학교산학협력단 고온 내열성 및 내화학성을 갖는 전자기파 흡수 구조물
DE102022004648A1 (de) * 2022-12-12 2024-06-13 Mbda Deutschland Gmbh Radarabsorbierendes faserkunststoffverbundmaterial,halbzeug, lagenaufbau, verbundbauteil und objekt mit reduzierter radarsignatur, sowie herstellverfahren
WO2025143281A1 (ko) * 2023-12-26 2025-07-03 경상국립대학교 산학협력단 고온 내열성 및 내화학성을 갖는 전자기파 흡수 구조물
CN118895058B (zh) * 2024-09-26 2025-08-15 浙江原邦材料科技有限公司 一种具有抗静电涌浪性能的吸波材料及其应用
CN119646939B (zh) * 2024-11-27 2025-09-02 中国铁道科学研究院集团有限公司 一种基于动力安定性的高速铁路路基结构设计方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060069199A1 (en) 2003-08-12 2006-03-30 Charati Sanjay G Electrically conductive compositions and method of manufacture thereof

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305527A (en) 1964-12-09 1967-02-21 Celanese Coatings Company Inc Epoxide resin compositions
DE3275637D1 (en) 1981-01-21 1987-04-16 Ici Plc Fibre-reinforced compositions and methods for producing such compositions
DE3375486D1 (en) 1982-07-28 1988-03-03 Ici Plc Method of producing fibre-reinforced composition
EP0102159B1 (en) 1982-07-28 1988-01-27 Imperial Chemical Industries Plc Method of producing fibre-reinforced composition
EP0180012A1 (de) 1984-10-27 1986-05-07 Wolfram H. Prof. Dr. Gerlich Immunogene Polypeptidsequenz des Hepatitis B-Virus
DE3855530T2 (de) 1987-10-05 1997-02-06 Ici Composite Inc Polymermasse
US4972031A (en) 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
EP0801110A2 (en) 1990-11-13 1997-10-15 Ici Composites Inc. Resin bodies comprising a combination of thermoplastic and thermoset resin
RU2057767C1 (ru) * 1993-06-17 1996-04-10 Московский авиационный технологический институт им.К.Э.Циолковского Полимерный композиционный материал
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
GB9612523D0 (en) 1996-06-14 1996-08-14 Fiberite Inc Improvements relating to resin compositions
GB9803714D0 (en) 1998-02-24 1998-04-15 Cytec Tech Corp Process for preparing polymers
GB0020630D0 (en) 2000-08-22 2000-10-11 Cytec Tech Corp Support structure or carrier for a curable composition
GB0020620D0 (en) 2000-08-22 2000-10-11 Cytec Tech Corp Compostions adapted for chain linking
US20020048632A1 (en) 2000-08-24 2002-04-25 Smalley Richard E. Polymer-wrapped single wall carbon nanotubes
GB0028341D0 (en) * 2000-11-21 2001-01-03 Cytec Tech Corp Thermally stable resin binder composition and method for binding fibres
US20040034177A1 (en) 2002-05-02 2004-02-19 Jian Chen Polymer and method for using the polymer for solubilizing nanotubes
US6905667B1 (en) 2002-05-02 2005-06-14 Zyvex Corporation Polymer and method for using the polymer for noncovalently functionalizing nanotubes
US7550543B2 (en) 2003-08-05 2009-06-23 S.A. Nanocyl Polymer-based composites comprising carbon nanotubes as a filler, method for producing said composites, and associated uses
US7309727B2 (en) * 2003-09-29 2007-12-18 General Electric Company Conductive thermoplastic compositions, methods of manufacture and articles derived from such compositions
JP5254608B2 (ja) 2004-04-13 2013-08-07 ザイベックス パフォーマンス マテリアルズ、インク． モジュール式ポリ（フェニレンエチレニン）の合成方法及びナノマテリアルを機能化するためにその電子特性を微調整する方法
US8703630B2 (en) 2005-05-09 2014-04-22 Cytec Technology Corp Resin-soluble thermoplastic veil for composite materials
FR2893947A1 (fr) 2005-11-30 2007-06-01 Arkema Sa Composition pulverulente de nanotubes de carbone, ses procedes d'obtention et ses utilisations, notamment dans des materiaux polymeres.
JP2007332234A (ja) * 2006-06-14 2007-12-27 Toray Ind Inc マスターバッチおよびエポキシ樹脂組成物
KR20080033780A (ko) * 2006-10-13 2008-04-17 삼성전자주식회사 다성분계 탄소나노튜브-고분자 복합체, 이를 형성하기 위한조성물 및 그 제조방법
FR2918067B1 (fr) 2007-06-27 2011-07-01 Arkema France Materiau composite comprenant des nanotubes disperses dans une matrice polymerique fluroree.
EP2265658B1 (en) * 2008-04-14 2013-01-23 Hexcel Composites, Ltd. Thermosetting resin containing irradiated thermoplastic toughening agent
GB2464085A (en) * 2008-06-07 2010-04-07 Hexcel Composites Ltd Improved Conductivity of Resin Materials and Composite Materials
US20100009165A1 (en) 2008-07-10 2010-01-14 Zyvex Performance Materials, Llc Multifunctional Nanomaterial-Containing Composites and Methods for the Production Thereof
US8613980B2 (en) 2008-07-17 2013-12-24 Nanocyl S.A. Method for the preparation of a reinforced thermoset polymer composite
EP2346937B1 (en) 2008-10-20 2014-06-11 SABIC Innovative Plastics IP B.V. Flow-enhanced thermoplastic compositions and methods for enhancing the flow of thermoplastic compositions
KR101267272B1 (ko) * 2008-12-30 2013-05-23 제일모직주식회사 수지 조성물
US7939167B2 (en) 2008-12-30 2011-05-10 Cheil Industries Inc. Resin composition
JP2012518707A (ja) 2009-02-24 2012-08-16 ダウ グローバル テクノロジーズ エルエルシー 硬化性エポキシ樹脂組成物及びその硬化体生成物
CN101508824B (zh) 2009-03-26 2011-05-04 大连理工大学 含羧基侧基聚芳醚固化改性环氧树脂组合物及其制备方法
JP2011144213A (ja) 2010-01-12 2011-07-28 Toray Ind Inc 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料
WO2011112405A1 (en) 2010-03-11 2011-09-15 Huntsman Petrochemical Llc Cycloaliphatic carbonates as reactive diluents in epoxy resins
GB201122296D0 (en) * 2011-12-23 2012-02-01 Cytec Tech Corp Composite materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060069199A1 (en) 2003-08-12 2006-03-30 Charati Sanjay G Electrically conductive compositions and method of manufacture thereof

Also Published As

Publication number Publication date
US9640297B2 (en) 2017-05-02
JP6184974B2 (ja) 2017-08-23
CN103946312A (zh) 2014-07-23
CN107254063A (zh) 2017-10-17
CA2860205C (en) 2020-01-07
AU2012374052B2 (en) 2015-09-24
BR112014011614A8 (pt) 2017-06-20
MY170238A (en) 2019-07-11
BR112014011614B1 (pt) 2020-12-29
IN2014CN04489A (https=) 2015-09-11
RU2014130203A (ru) 2016-02-20
CN107254063B (zh) 2019-03-15
MX2014005925A (es) 2014-06-05
US20170301428A1 (en) 2017-10-19
EP2768905B1 (en) 2019-02-20
TWI580731B (zh) 2017-05-01
JP2015508437A (ja) 2015-03-19
WO2013141916A3 (en) 2014-03-13
ES2727047T3 (es) 2019-10-11
WO2013141916A2 (en) 2013-09-26
GB201122296D0 (en) 2012-02-01
CA2860205A1 (en) 2013-09-26
RU2611512C2 (ru) 2017-02-27
EP2768905A2 (en) 2014-08-27
CN103946312B (zh) 2017-05-24
US20140306164A1 (en) 2014-10-16
US10236092B2 (en) 2019-03-19
AU2012374052A1 (en) 2014-05-22
BR112014011614A2 (pt) 2017-06-13
KR20140105777A (ko) 2014-09-02
TW201335281A (zh) 2013-09-01

Similar Documents

Publication Publication Date Title
KR101942368B1 (ko) 전도성 나노필러를 포함하는 복합 재료
RU2702556C2 (ru) Композитные материалы с высокой удельной электрической проводимостью в z-направлении
US9202607B2 (en) Conductivity of resin materials and composite materials
TWI649196B (zh) 具有導電及抗脫層性質之複合材料
Kablov et al. Prospects of using carbonaceous nanoparticles in binders for polymer composites
Ji et al. Mussel inspired interfacial modification of boron nitride/carbon nanotubes hybrid fillers for epoxy composites with improved thermal conductivity and electrical insulation properties
JP2007169374A (ja) フラーレン類含有分散液
Njuguna et al. Polymer nanocomposites
Entezar Shabestari et al. Effect of nitrogen and oxygen doped carbon nanotubes on flammability of epoxy nanocomposites

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20211215

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240122

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240122