KR101940365B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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KR101940365B1
KR101940365B1 KR1020150114433A KR20150114433A KR101940365B1 KR 101940365 B1 KR101940365 B1 KR 101940365B1 KR 1020150114433 A KR1020150114433 A KR 1020150114433A KR 20150114433 A KR20150114433 A KR 20150114433A KR 101940365 B1 KR101940365 B1 KR 101940365B1
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South Korea
Prior art keywords
mold
substrate
imprint material
pattern
separated
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Korean (ko)
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KR20160021053A (ko
Inventor
요오스케 다카라다
센타로 아이하라
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020150114433A 2014-08-14 2015-08-13 임프린트 장치 및 물품 제조 방법 Active KR101940365B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-165198 2014-08-14
JP2014165198A JP6472189B2 (ja) 2014-08-14 2014-08-14 インプリント装置、インプリント方法及び物品の製造方法

Publications (2)

Publication Number Publication Date
KR20160021053A KR20160021053A (ko) 2016-02-24
KR101940365B1 true KR101940365B1 (ko) 2019-01-18

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KR1020150114433A Active KR101940365B1 (ko) 2014-08-14 2015-08-13 임프린트 장치 및 물품 제조 방법

Country Status (4)

Country Link
US (1) US10514599B2 (enExample)
JP (1) JP6472189B2 (enExample)
KR (1) KR101940365B1 (enExample)
CN (1) CN106200260B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6659104B2 (ja) * 2014-11-11 2020-03-04 キヤノン株式会社 インプリント方法、インプリント装置、型、および物品の製造方法
JP6700936B2 (ja) * 2016-04-25 2020-05-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6762853B2 (ja) * 2016-11-11 2020-09-30 キヤノン株式会社 装置、方法、及び物品製造方法
JP7150535B2 (ja) * 2018-09-13 2022-10-11 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP7431694B2 (ja) * 2020-07-28 2024-02-15 キヤノン株式会社 情報処理装置、膜形成装置、物品の製造方法、およびプログラム
JP7361831B2 (ja) * 2021-07-30 2023-10-16 キヤノン株式会社 情報処理装置、成形装置、成形方法及び物品の製造方法
US12194671B2 (en) 2021-07-30 2025-01-14 Canon Kabushiki Kaisha Information processing apparatus, molding apparatus, molding method, and article manufacturing method
CN116277912A (zh) * 2021-12-20 2023-06-23 上海鲲游科技有限公司 压印产品的制造设备及其方法

Citations (3)

* Cited by examiner, † Cited by third party
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JP2012507141A (ja) * 2008-10-24 2012-03-22 モレキュラー・インプリンツ・インコーポレーテッド インプリント・プロセスの分離段階における歪みと動特性の制御
KR101238137B1 (ko) * 2007-02-06 2013-02-28 캐논 가부시끼가이샤 임프린트 방법 및 임프린트 장치
JP2013219331A (ja) * 2012-03-12 2013-10-24 Canon Inc インプリント方法およびインプリント装置、それを用いた物品の製造方法

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JP2004002702A (ja) * 2002-02-28 2004-01-08 Merck Patent Gmbh プレポリマー材料、ポリマー材料、インプリンティングプロセスおよびその使用
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
JP4217551B2 (ja) * 2003-07-02 2009-02-04 キヤノン株式会社 微細加工方法及び微細加工装置
JP4721393B2 (ja) * 2003-08-15 2011-07-13 キヤノン株式会社 近接場露光方法
WO2008129962A1 (ja) * 2007-04-19 2008-10-30 Konica Minolta Holdings, Inc. 成形装置及びその制御方法
US8945444B2 (en) * 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
JP5517423B2 (ja) 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
JP5173944B2 (ja) 2009-06-16 2013-04-03 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5669377B2 (ja) * 2009-11-09 2015-02-12 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5451450B2 (ja) * 2010-02-24 2014-03-26 キヤノン株式会社 インプリント装置及びそのテンプレート並びに物品の製造方法
JP5632633B2 (ja) 2010-03-26 2014-11-26 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6004738B2 (ja) * 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5938218B2 (ja) * 2012-01-16 2016-06-22 キヤノン株式会社 インプリント装置、物品の製造方法およびインプリント方法
JP6180131B2 (ja) 2012-03-19 2017-08-16 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2014033050A (ja) * 2012-08-02 2014-02-20 Toshiba Corp インプリントシステム及びインプリント方法
JP6282069B2 (ja) * 2013-09-13 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238137B1 (ko) * 2007-02-06 2013-02-28 캐논 가부시끼가이샤 임프린트 방법 및 임프린트 장치
JP2012507141A (ja) * 2008-10-24 2012-03-22 モレキュラー・インプリンツ・インコーポレーテッド インプリント・プロセスの分離段階における歪みと動特性の制御
JP2013219331A (ja) * 2012-03-12 2013-10-24 Canon Inc インプリント方法およびインプリント装置、それを用いた物品の製造方法

Also Published As

Publication number Publication date
CN106200260A (zh) 2016-12-07
JP2016042501A (ja) 2016-03-31
US20160046065A1 (en) 2016-02-18
US10514599B2 (en) 2019-12-24
CN106200260B (zh) 2020-01-21
JP6472189B2 (ja) 2019-02-20
KR20160021053A (ko) 2016-02-24

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