KR101930585B1 - 니켈층들의 무전해 성막을 위한 도금욕 - Google Patents

니켈층들의 무전해 성막을 위한 도금욕 Download PDF

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KR101930585B1
KR101930585B1 KR1020147033024A KR20147033024A KR101930585B1 KR 101930585 B1 KR101930585 B1 KR 101930585B1 KR 1020147033024 A KR1020147033024 A KR 1020147033024A KR 20147033024 A KR20147033024 A KR 20147033024A KR 101930585 B1 KR101930585 B1 KR 101930585B1
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nickel
plating bath
plating
range
bath composition
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Korean (ko)
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KR20150024317A (ko
Inventor
하이코 브루너
얀 피칼렉
율리아 베얀
카르슈텐 클라우제
홀거 베라
스펜 뤽브로트
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아토테크더치랜드게엠베하
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020147033024A 2012-06-04 2013-05-31 니켈층들의 무전해 성막을 위한 도금욕 Active KR101930585B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12170693.1 2012-06-04
EP20120170693 EP2671969A1 (en) 2012-06-04 2012-06-04 Plating bath for electroless deposition of nickel layers
PCT/EP2013/061280 WO2013182489A2 (en) 2012-06-04 2013-05-31 Plating bath for electroless deposition of nickel layers

Publications (2)

Publication Number Publication Date
KR20150024317A KR20150024317A (ko) 2015-03-06
KR101930585B1 true KR101930585B1 (ko) 2018-12-18

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Country Status (11)

Country Link
US (1) US9175399B2 (cg-RX-API-DMAC7.html)
EP (2) EP2671969A1 (cg-RX-API-DMAC7.html)
JP (1) JP6161691B2 (cg-RX-API-DMAC7.html)
KR (1) KR101930585B1 (cg-RX-API-DMAC7.html)
CN (1) CN104321463B (cg-RX-API-DMAC7.html)
BR (1) BR112014028715B1 (cg-RX-API-DMAC7.html)
CA (1) CA2875317C (cg-RX-API-DMAC7.html)
ES (1) ES2688547T3 (cg-RX-API-DMAC7.html)
MY (1) MY168645A (cg-RX-API-DMAC7.html)
TW (1) TWI560316B (cg-RX-API-DMAC7.html)
WO (1) WO2013182489A2 (cg-RX-API-DMAC7.html)

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US11685999B2 (en) * 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
JP6352079B2 (ja) * 2014-07-03 2018-07-04 奥野製薬工業株式会社 無電解めっき液、めっき皮膜、めっき品及びめっき皮膜の形成方法
EP3026143A1 (en) * 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plating bath and method for electroless deposition of nickel layers
ES2639300T3 (es) 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
KR102513653B1 (ko) 2015-03-20 2023-03-23 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 실리콘 기판의 활성화 방법
EP3839103B1 (en) 2015-06-30 2023-07-19 MacDermid Enthone Inc. Cobalt filling of interconnects in microelectronics
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
CN105624656B (zh) * 2015-12-30 2018-05-01 大连大学 一种化学镀Ni-P/Ni-Mo-P-PTFE复合结构镀层及其制备方法
EP3190208B1 (en) 2016-01-06 2018-09-12 ATOTECH Deutschland GmbH Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys
CN109072438B (zh) 2016-05-04 2021-08-13 德国艾托特克公司 沉积金属或金属合金到衬底表面及包括衬底表面活化的方法
US10577692B2 (en) * 2017-01-05 2020-03-03 International Business Machines Corporation Pretreatment of iron-based substrates for electroless plating
CN107313034A (zh) * 2017-06-27 2017-11-03 佛山科学技术学院 一种高磷化学镀镍钴锰磷合金溶液及其制备方法
CN107475699A (zh) * 2017-08-28 2017-12-15 中石化炼化工程（集团）股份有限公司 气液分配器的防腐涂层、制备方法及其应用
EP3456870A1 (en) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
KR102036334B1 (ko) * 2017-09-20 2019-10-25 한국기계연구원 무전해 도금액 및 무전해 도금 방법
KR102036329B1 (ko) * 2017-09-20 2019-10-25 한국기계연구원 무전해 도금액, 무전해 도금 방법 및 이를 이용하여 형성된 도금층
KR101932963B1 (ko) * 2018-02-20 2018-12-27 한국기계연구원 촉매-프리 무전해도금용 조성물 및 이를 이용한 무전해도금 방법
JP2021515110A (ja) * 2018-02-26 2021-06-17 グラフェン リーダーズ カナダ （ジーアールシー） インコーポレイテッド 炭素系材料によるオブジェクトの無電解めっき
CN108607586B (zh) * 2018-04-28 2021-02-05 重庆长安汽车股份有限公司 一种镍磷化物、其制备方法及电解水制氢的方法
EP3679167B1 (en) * 2018-11-06 2021-06-16 ATOTECH Deutschland GmbH Electroless nickel plating solution
KR102250500B1 (ko) * 2019-03-18 2021-05-12 (주)엠에스씨 자동차 lds 전장 부품용 무전해 중성-중온 니켈도금액
CN110079794A (zh) * 2019-05-08 2019-08-02 深圳市长裕环保有限公司 一种纳米易焊高硬耐磨防腐装饰合金催化液及其制备方法
DE102019112883B4 (de) * 2019-05-16 2024-05-16 Pac Tech - Packaging Technologies Gmbh Beschichtungsbad zur stromlosen Beschichtung eines Substrats
US20230178430A1 (en) * 2020-05-08 2023-06-08 Lam Research Corporation Electroplating cobalt, nickel, and alloys thereof
LT6899B (lt) * 2020-08-27 2022-04-11 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Vario paviršiaus cheminio nikeliavimo būdas, nenaudojant aktyvavimo paladžiu
US11505867B1 (en) 2021-06-14 2022-11-22 Consolidated Nuclear Security, LLC Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore
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Publication number Publication date
EP2671969A1 (en) 2013-12-11
EP2855732A2 (en) 2015-04-08
CN104321463A (zh) 2015-01-28
CA2875317A1 (en) 2013-12-12
CN104321463B (zh) 2016-12-28
US9175399B2 (en) 2015-11-03
JP2015524024A (ja) 2015-08-20
CA2875317C (en) 2020-03-31
JP6161691B2 (ja) 2017-07-12
BR112014028715A2 (pt) 2017-06-27
WO2013182489A2 (en) 2013-12-12
ES2688547T3 (es) 2018-11-05
WO2013182489A3 (en) 2014-07-17
KR20150024317A (ko) 2015-03-06
TW201406992A (zh) 2014-02-16
BR112014028715B1 (pt) 2022-01-25
TWI560316B (en) 2016-12-01
MY168645A (en) 2018-11-27
US20150110965A1 (en) 2015-04-23
EP2855732B1 (en) 2018-07-18

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