KR101910697B1 - 발열점 검출 방법 및 발열점 검출 장치 - Google Patents

발열점 검출 방법 및 발열점 검출 장치 Download PDF

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Publication number
KR101910697B1
KR101910697B1 KR1020147010865A KR20147010865A KR101910697B1 KR 101910697 B1 KR101910697 B1 KR 101910697B1 KR 1020147010865 A KR1020147010865 A KR 1020147010865A KR 20147010865 A KR20147010865 A KR 20147010865A KR 101910697 B1 KR101910697 B1 KR 101910697B1
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South Korea
Prior art keywords
integrated circuit
frequency
detection signal
temperature
heat
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Korean (ko)
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KR20140075757A (ko
Inventor
도모노리 나카무라
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하마마츠 포토닉스 가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
KR1020147010865A 2011-11-07 2012-08-31 발열점 검출 방법 및 발열점 검출 장치 Active KR101910697B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-243891 2011-11-07
JP2011243891A JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置
PCT/JP2012/072223 WO2013069362A1 (ja) 2011-11-07 2012-08-31 発熱点検出方法及び発熱点検出装置

Publications (2)

Publication Number Publication Date
KR20140075757A KR20140075757A (ko) 2014-06-19
KR101910697B1 true KR101910697B1 (ko) 2018-10-22

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KR1020147010865A Active KR101910697B1 (ko) 2011-11-07 2012-08-31 발열점 검출 방법 및 발열점 검출 장치

Country Status (5)

Country Link
US (1) US9658116B2 (enExample)
JP (1) JP5743855B2 (enExample)
KR (1) KR101910697B1 (enExample)
TW (1) TWI588479B (enExample)
WO (1) WO2013069362A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101528200B1 (ko) * 2014-12-30 2015-06-12 한국기초과학지원연구원 3차원 열영상 측정 장치 및 방법
US10605857B2 (en) * 2017-05-24 2020-03-31 Rohde & Schwarz Gmbh & Co. Kg Anechoic chamber for testing a device under test
CN113466253A (zh) * 2020-03-31 2021-10-01 苏州阿特斯阳光电力科技有限公司 太阳能电池热斑缺陷的检测方法与检测设备
US11243550B2 (en) * 2020-05-29 2022-02-08 Juniper Networks, Inc. Optical-electrical device using hybrid automated testing equipment
JP7624655B2 (ja) * 2021-03-10 2025-01-31 日本アビオニクス株式会社 パッケージ品の検査装置およびパッケージ品の検査方法
CN114264933B (zh) * 2021-12-21 2024-02-13 厦门宇昊软件有限公司 一种集成电路板的故障检测方法和故障检测系统
CN118566704B (zh) * 2024-06-21 2025-01-10 广东金鉴实验室科技有限公司 一种显微红外热点定位测试机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002523739A (ja) * 1998-08-20 2002-07-30 シーメンス アクチエンゲゼルシヤフト 熱波測定方法

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JP3229411B2 (ja) * 1993-01-11 2001-11-19 株式会社日立製作所 薄膜トランジスタ基板の欠陥検出方法およびその修正方法
JP3130708B2 (ja) * 1993-01-13 2001-01-31 株式会社神戸製鋼所 試料の欠陥評価方法
JPH11337511A (ja) * 1998-05-25 1999-12-10 Advantest Corp 回路検査装置および方法
US7401976B1 (en) * 2000-08-25 2008-07-22 Art Advanced Research Technologies Inc. Detection of defects by thermographic analysis
JP2003035690A (ja) * 2001-07-24 2003-02-07 Taiyo Yuden Co Ltd 検査方法及び検査装置
JP4097079B2 (ja) * 2004-02-27 2008-06-04 ▲隆▼英 阪上 欠陥検査方法およびその装置
JP4097083B2 (ja) * 2004-03-31 2008-06-04 ▲隆▼英 阪上 コンクリートの充填不良検査方法および装置
US7394659B2 (en) * 2004-11-19 2008-07-01 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
TW200801487A (en) 2006-06-23 2008-01-01 Innolux Display Corp Method and device for detecting circuit
BRPI0823078B1 (pt) 2008-09-17 2019-06-25 Nippon Steel & Sumitomo Metal Corporation Método para detectar defeito em material e sistema para o método.
SG10201601903YA (en) * 2010-06-08 2016-04-28 Dcg Systems Inc Three-dimensional hot spot localization
TWI460422B (zh) 2010-10-22 2014-11-11 Dcg Systems Inc 從裝置一側作鎖相熱雷射激發並從另一側取得鎖相熱發散影像

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002523739A (ja) * 1998-08-20 2002-07-30 シーメンス アクチエンゲゼルシヤフト 熱波測定方法

Also Published As

Publication number Publication date
JP5743855B2 (ja) 2015-07-01
TWI588479B (zh) 2017-06-21
JP2013101005A (ja) 2013-05-23
US9658116B2 (en) 2017-05-23
KR20140075757A (ko) 2014-06-19
TW201329441A (zh) 2013-07-16
WO2013069362A1 (ja) 2013-05-16
US20140294038A1 (en) 2014-10-02

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