TWI588479B - Hot spot detection method and hot spot detection device - Google Patents
Hot spot detection method and hot spot detection device Download PDFInfo
- Publication number
- TWI588479B TWI588479B TW101140594A TW101140594A TWI588479B TW I588479 B TWI588479 B TW I588479B TW 101140594 A TW101140594 A TW 101140594A TW 101140594 A TW101140594 A TW 101140594A TW I588479 B TWI588479 B TW I588479B
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- frequency
- hot spot
- electrical signal
- heat
- Prior art date
Links
- 238000001514 detection method Methods 0.000 title claims description 97
- 230000020169 heat generation Effects 0.000 claims description 60
- 230000008859 change Effects 0.000 claims description 55
- 230000000737 periodic effect Effects 0.000 claims description 32
- 230000006641 stabilisation Effects 0.000 claims description 32
- 238000011105 stabilization Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 22
- 230000000087 stabilizing effect Effects 0.000 claims description 12
- 230000003247 decreasing effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 description 34
- 238000003384 imaging method Methods 0.000 description 33
- 238000012546 transfer Methods 0.000 description 30
- 238000012545 processing Methods 0.000 description 18
- 230000002123 temporal effect Effects 0.000 description 15
- 238000006073 displacement reaction Methods 0.000 description 12
- 230000004044 response Effects 0.000 description 10
- 206010037660 Pyrexia Diseases 0.000 description 9
- 238000001816 cooling Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011243891A JP5743855B2 (ja) | 2011-11-07 | 2011-11-07 | 発熱点検出方法及び発熱点検出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201329441A TW201329441A (zh) | 2013-07-16 |
| TWI588479B true TWI588479B (zh) | 2017-06-21 |
Family
ID=48289748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101140594A TWI588479B (zh) | 2011-11-07 | 2012-11-01 | Hot spot detection method and hot spot detection device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9658116B2 (enExample) |
| JP (1) | JP5743855B2 (enExample) |
| KR (1) | KR101910697B1 (enExample) |
| TW (1) | TWI588479B (enExample) |
| WO (1) | WO2013069362A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101528200B1 (ko) * | 2014-12-30 | 2015-06-12 | 한국기초과학지원연구원 | 3차원 열영상 측정 장치 및 방법 |
| US10605857B2 (en) * | 2017-05-24 | 2020-03-31 | Rohde & Schwarz Gmbh & Co. Kg | Anechoic chamber for testing a device under test |
| CN113466253A (zh) * | 2020-03-31 | 2021-10-01 | 苏州阿特斯阳光电力科技有限公司 | 太阳能电池热斑缺陷的检测方法与检测设备 |
| US11243550B2 (en) * | 2020-05-29 | 2022-02-08 | Juniper Networks, Inc. | Optical-electrical device using hybrid automated testing equipment |
| JP7624655B2 (ja) * | 2021-03-10 | 2025-01-31 | 日本アビオニクス株式会社 | パッケージ品の検査装置およびパッケージ品の検査方法 |
| CN114264933B (zh) * | 2021-12-21 | 2024-02-13 | 厦门宇昊软件有限公司 | 一种集成电路板的故障检测方法和故障检测系统 |
| CN118566704B (zh) * | 2024-06-21 | 2025-01-10 | 广东金鉴实验室科技有限公司 | 一种显微红外热点定位测试机 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06207914A (ja) * | 1993-01-11 | 1994-07-26 | Hitachi Ltd | 欠陥検出方法と装置および赤外線検出方法と装置 |
| US20060109630A1 (en) * | 2004-11-19 | 2006-05-25 | Colgan Evan G | Apparatus and methods for cooling semiconductor integrated circuit package structures |
| TW200801487A (en) * | 2006-06-23 | 2008-01-01 | Innolux Display Corp | Method and device for detecting circuit |
| CN102159940A (zh) * | 2008-09-17 | 2011-08-17 | 新日本制铁株式会社 | 用于检测材料中的缺陷的方法以及用于该方法的系统 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3130708B2 (ja) * | 1993-01-13 | 2001-01-31 | 株式会社神戸製鋼所 | 試料の欠陥評価方法 |
| JPH11337511A (ja) * | 1998-05-25 | 1999-12-10 | Advantest Corp | 回路検査装置および方法 |
| DE19837889C1 (de) * | 1998-08-20 | 2000-12-21 | Siemens Ag | Thermowellen-Meßverfahren |
| US7401976B1 (en) * | 2000-08-25 | 2008-07-22 | Art Advanced Research Technologies Inc. | Detection of defects by thermographic analysis |
| JP2003035690A (ja) * | 2001-07-24 | 2003-02-07 | Taiyo Yuden Co Ltd | 検査方法及び検査装置 |
| JP4097079B2 (ja) * | 2004-02-27 | 2008-06-04 | ▲隆▼英 阪上 | 欠陥検査方法およびその装置 |
| JP4097083B2 (ja) * | 2004-03-31 | 2008-06-04 | ▲隆▼英 阪上 | コンクリートの充填不良検査方法および装置 |
| JP2007024674A (ja) * | 2005-07-15 | 2007-02-01 | Hitachi Ltd | 表面・表層検査装置、及び表面・表層検査方法 |
| SG10201601903YA (en) * | 2010-06-08 | 2016-04-28 | Dcg Systems Inc | Three-dimensional hot spot localization |
| TWI460422B (zh) | 2010-10-22 | 2014-11-11 | Dcg Systems Inc | 從裝置一側作鎖相熱雷射激發並從另一側取得鎖相熱發散影像 |
-
2011
- 2011-11-07 JP JP2011243891A patent/JP5743855B2/ja active Active
-
2012
- 2012-08-31 KR KR1020147010865A patent/KR101910697B1/ko active Active
- 2012-08-31 WO PCT/JP2012/072223 patent/WO2013069362A1/ja not_active Ceased
- 2012-08-31 US US14/355,596 patent/US9658116B2/en active Active
- 2012-11-01 TW TW101140594A patent/TWI588479B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06207914A (ja) * | 1993-01-11 | 1994-07-26 | Hitachi Ltd | 欠陥検出方法と装置および赤外線検出方法と装置 |
| US20060109630A1 (en) * | 2004-11-19 | 2006-05-25 | Colgan Evan G | Apparatus and methods for cooling semiconductor integrated circuit package structures |
| TW200801487A (en) * | 2006-06-23 | 2008-01-01 | Innolux Display Corp | Method and device for detecting circuit |
| CN102159940A (zh) * | 2008-09-17 | 2011-08-17 | 新日本制铁株式会社 | 用于检测材料中的缺陷的方法以及用于该方法的系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5743855B2 (ja) | 2015-07-01 |
| JP2013101005A (ja) | 2013-05-23 |
| US9658116B2 (en) | 2017-05-23 |
| KR20140075757A (ko) | 2014-06-19 |
| TW201329441A (zh) | 2013-07-16 |
| KR101910697B1 (ko) | 2018-10-22 |
| WO2013069362A1 (ja) | 2013-05-16 |
| US20140294038A1 (en) | 2014-10-02 |
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