JP5743855B2 - 発熱点検出方法及び発熱点検出装置 - Google Patents

発熱点検出方法及び発熱点検出装置 Download PDF

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JP5743855B2
JP5743855B2 JP2011243891A JP2011243891A JP5743855B2 JP 5743855 B2 JP5743855 B2 JP 5743855B2 JP 2011243891 A JP2011243891 A JP 2011243891A JP 2011243891 A JP2011243891 A JP 2011243891A JP 5743855 B2 JP5743855 B2 JP 5743855B2
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integrated circuit
frequency
unit
electrical signal
heating point
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English (en)
Japanese (ja)
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JP2013101005A (ja
JP2013101005A5 (enExample
Inventor
共則 中村
共則 中村
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Priority to JP2011243891A priority Critical patent/JP5743855B2/ja
Priority to KR1020147010865A priority patent/KR101910697B1/ko
Priority to US14/355,596 priority patent/US9658116B2/en
Priority to PCT/JP2012/072223 priority patent/WO2013069362A1/ja
Priority to TW101140594A priority patent/TWI588479B/zh
Publication of JP2013101005A publication Critical patent/JP2013101005A/ja
Publication of JP2013101005A5 publication Critical patent/JP2013101005A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP2011243891A 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置 Active JP5743855B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011243891A JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置
KR1020147010865A KR101910697B1 (ko) 2011-11-07 2012-08-31 발열점 검출 방법 및 발열점 검출 장치
US14/355,596 US9658116B2 (en) 2011-11-07 2012-08-31 Method for detecting heat generation points and device for detecting heat generate points
PCT/JP2012/072223 WO2013069362A1 (ja) 2011-11-07 2012-08-31 発熱点検出方法及び発熱点検出装置
TW101140594A TWI588479B (zh) 2011-11-07 2012-11-01 Hot spot detection method and hot spot detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011243891A JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置

Publications (3)

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JP2013101005A JP2013101005A (ja) 2013-05-23
JP2013101005A5 JP2013101005A5 (enExample) 2014-12-18
JP5743855B2 true JP5743855B2 (ja) 2015-07-01

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JP2011243891A Active JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置

Country Status (5)

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US (1) US9658116B2 (enExample)
JP (1) JP5743855B2 (enExample)
KR (1) KR101910697B1 (enExample)
TW (1) TWI588479B (enExample)
WO (1) WO2013069362A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101528200B1 (ko) * 2014-12-30 2015-06-12 한국기초과학지원연구원 3차원 열영상 측정 장치 및 방법
US10605857B2 (en) * 2017-05-24 2020-03-31 Rohde & Schwarz Gmbh & Co. Kg Anechoic chamber for testing a device under test
CN113466253A (zh) * 2020-03-31 2021-10-01 苏州阿特斯阳光电力科技有限公司 太阳能电池热斑缺陷的检测方法与检测设备
US11243550B2 (en) * 2020-05-29 2022-02-08 Juniper Networks, Inc. Optical-electrical device using hybrid automated testing equipment
JP7624655B2 (ja) * 2021-03-10 2025-01-31 日本アビオニクス株式会社 パッケージ品の検査装置およびパッケージ品の検査方法
CN114264933B (zh) * 2021-12-21 2024-02-13 厦门宇昊软件有限公司 一种集成电路板的故障检测方法和故障检测系统
CN118566704B (zh) * 2024-06-21 2025-01-10 广东金鉴实验室科技有限公司 一种显微红外热点定位测试机

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JP3229411B2 (ja) * 1993-01-11 2001-11-19 株式会社日立製作所 薄膜トランジスタ基板の欠陥検出方法およびその修正方法
JP3130708B2 (ja) * 1993-01-13 2001-01-31 株式会社神戸製鋼所 試料の欠陥評価方法
JPH11337511A (ja) * 1998-05-25 1999-12-10 Advantest Corp 回路検査装置および方法
DE19837889C1 (de) * 1998-08-20 2000-12-21 Siemens Ag Thermowellen-Meßverfahren
US7401976B1 (en) * 2000-08-25 2008-07-22 Art Advanced Research Technologies Inc. Detection of defects by thermographic analysis
JP2003035690A (ja) * 2001-07-24 2003-02-07 Taiyo Yuden Co Ltd 検査方法及び検査装置
JP4097079B2 (ja) * 2004-02-27 2008-06-04 ▲隆▼英 阪上 欠陥検査方法およびその装置
JP4097083B2 (ja) * 2004-03-31 2008-06-04 ▲隆▼英 阪上 コンクリートの充填不良検査方法および装置
US7394659B2 (en) * 2004-11-19 2008-07-01 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
TW200801487A (en) 2006-06-23 2008-01-01 Innolux Display Corp Method and device for detecting circuit
BRPI0823078B1 (pt) 2008-09-17 2019-06-25 Nippon Steel & Sumitomo Metal Corporation Método para detectar defeito em material e sistema para o método.
SG10201601903YA (en) * 2010-06-08 2016-04-28 Dcg Systems Inc Three-dimensional hot spot localization
TWI460422B (zh) 2010-10-22 2014-11-11 Dcg Systems Inc 從裝置一側作鎖相熱雷射激發並從另一側取得鎖相熱發散影像

Also Published As

Publication number Publication date
TWI588479B (zh) 2017-06-21
JP2013101005A (ja) 2013-05-23
US9658116B2 (en) 2017-05-23
KR20140075757A (ko) 2014-06-19
TW201329441A (zh) 2013-07-16
KR101910697B1 (ko) 2018-10-22
WO2013069362A1 (ja) 2013-05-16
US20140294038A1 (en) 2014-10-02

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