JP2013101005A5 - - Google Patents

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Publication number
JP2013101005A5
JP2013101005A5 JP2011243891A JP2011243891A JP2013101005A5 JP 2013101005 A5 JP2013101005 A5 JP 2013101005A5 JP 2011243891 A JP2011243891 A JP 2011243891A JP 2011243891 A JP2011243891 A JP 2011243891A JP 2013101005 A5 JP2013101005 A5 JP 2013101005A5
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JP
Japan
Prior art keywords
air hose
integrated circuit
temperature
medium
gas
Prior art date
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Granted
Application number
JP2011243891A
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English (en)
Japanese (ja)
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JP5743855B2 (ja
JP2013101005A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2011243891A external-priority patent/JP5743855B2/ja
Priority to JP2011243891A priority Critical patent/JP5743855B2/ja
Priority to KR1020147010865A priority patent/KR101910697B1/ko
Priority to US14/355,596 priority patent/US9658116B2/en
Priority to PCT/JP2012/072223 priority patent/WO2013069362A1/ja
Priority to TW101140594A priority patent/TWI588479B/zh
Publication of JP2013101005A publication Critical patent/JP2013101005A/ja
Publication of JP2013101005A5 publication Critical patent/JP2013101005A5/ja
Publication of JP5743855B2 publication Critical patent/JP5743855B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011243891A 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置 Active JP5743855B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011243891A JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置
KR1020147010865A KR101910697B1 (ko) 2011-11-07 2012-08-31 발열점 검출 방법 및 발열점 검출 장치
US14/355,596 US9658116B2 (en) 2011-11-07 2012-08-31 Method for detecting heat generation points and device for detecting heat generate points
PCT/JP2012/072223 WO2013069362A1 (ja) 2011-11-07 2012-08-31 発熱点検出方法及び発熱点検出装置
TW101140594A TWI588479B (zh) 2011-11-07 2012-11-01 Hot spot detection method and hot spot detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011243891A JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置

Publications (3)

Publication Number Publication Date
JP2013101005A JP2013101005A (ja) 2013-05-23
JP2013101005A5 true JP2013101005A5 (enExample) 2014-12-18
JP5743855B2 JP5743855B2 (ja) 2015-07-01

Family

ID=48289748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011243891A Active JP5743855B2 (ja) 2011-11-07 2011-11-07 発熱点検出方法及び発熱点検出装置

Country Status (5)

Country Link
US (1) US9658116B2 (enExample)
JP (1) JP5743855B2 (enExample)
KR (1) KR101910697B1 (enExample)
TW (1) TWI588479B (enExample)
WO (1) WO2013069362A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101528200B1 (ko) * 2014-12-30 2015-06-12 한국기초과학지원연구원 3차원 열영상 측정 장치 및 방법
US10605857B2 (en) * 2017-05-24 2020-03-31 Rohde & Schwarz Gmbh & Co. Kg Anechoic chamber for testing a device under test
CN113466253A (zh) * 2020-03-31 2021-10-01 苏州阿特斯阳光电力科技有限公司 太阳能电池热斑缺陷的检测方法与检测设备
US11243550B2 (en) * 2020-05-29 2022-02-08 Juniper Networks, Inc. Optical-electrical device using hybrid automated testing equipment
JP7624655B2 (ja) * 2021-03-10 2025-01-31 日本アビオニクス株式会社 パッケージ品の検査装置およびパッケージ品の検査方法
CN114264933B (zh) * 2021-12-21 2024-02-13 厦门宇昊软件有限公司 一种集成电路板的故障检测方法和故障检测系统
CN118566704B (zh) * 2024-06-21 2025-01-10 广东金鉴实验室科技有限公司 一种显微红外热点定位测试机

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3229411B2 (ja) * 1993-01-11 2001-11-19 株式会社日立製作所 薄膜トランジスタ基板の欠陥検出方法およびその修正方法
JP3130708B2 (ja) * 1993-01-13 2001-01-31 株式会社神戸製鋼所 試料の欠陥評価方法
JPH11337511A (ja) * 1998-05-25 1999-12-10 Advantest Corp 回路検査装置および方法
DE19837889C1 (de) * 1998-08-20 2000-12-21 Siemens Ag Thermowellen-Meßverfahren
US7401976B1 (en) * 2000-08-25 2008-07-22 Art Advanced Research Technologies Inc. Detection of defects by thermographic analysis
JP2003035690A (ja) * 2001-07-24 2003-02-07 Taiyo Yuden Co Ltd 検査方法及び検査装置
JP4097079B2 (ja) * 2004-02-27 2008-06-04 ▲隆▼英 阪上 欠陥検査方法およびその装置
JP4097083B2 (ja) * 2004-03-31 2008-06-04 ▲隆▼英 阪上 コンクリートの充填不良検査方法および装置
US7394659B2 (en) * 2004-11-19 2008-07-01 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
TW200801487A (en) 2006-06-23 2008-01-01 Innolux Display Corp Method and device for detecting circuit
BRPI0823078B1 (pt) 2008-09-17 2019-06-25 Nippon Steel & Sumitomo Metal Corporation Método para detectar defeito em material e sistema para o método.
SG10201601903YA (en) * 2010-06-08 2016-04-28 Dcg Systems Inc Three-dimensional hot spot localization
TWI460422B (zh) 2010-10-22 2014-11-11 Dcg Systems Inc 從裝置一側作鎖相熱雷射激發並從另一側取得鎖相熱發散影像

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