KR101908166B1 - 적층판의 제조 방법 - Google Patents

적층판의 제조 방법 Download PDF

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Publication number
KR101908166B1
KR101908166B1 KR1020147000907A KR20147000907A KR101908166B1 KR 101908166 B1 KR101908166 B1 KR 101908166B1 KR 1020147000907 A KR1020147000907 A KR 1020147000907A KR 20147000907 A KR20147000907 A KR 20147000907A KR 101908166 B1 KR101908166 B1 KR 101908166B1
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KR
South Korea
Prior art keywords
smoothing
temperature
laminate
resin
less
Prior art date
Application number
KR1020147000907A
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English (en)
Korean (ko)
Other versions
KR20140043433A (ko
Inventor
노리유키 오히가시
하루오 무라카미
다다스케 엔도
미치오 기무라
Original Assignee
스미토모 베이클리트 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20140043433A publication Critical patent/KR20140043433A/ko
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Publication of KR101908166B1 publication Critical patent/KR101908166B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020147000907A 2011-06-21 2012-06-18 적층판의 제조 방법 KR101908166B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-137598 2011-06-21
JP2011137598 2011-06-21
PCT/JP2012/003964 WO2012176424A1 (ja) 2011-06-21 2012-06-18 積層板の製造方法

Publications (2)

Publication Number Publication Date
KR20140043433A KR20140043433A (ko) 2014-04-09
KR101908166B1 true KR101908166B1 (ko) 2018-10-15

Family

ID=47422282

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147000907A KR101908166B1 (ko) 2011-06-21 2012-06-18 적층판의 제조 방법

Country Status (4)

Country Link
JP (1) JP5141843B2 (ja)
KR (1) KR101908166B1 (ja)
TW (1) TWI514945B (ja)
WO (1) WO2012176424A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6303320B2 (ja) * 2013-08-06 2018-04-04 味の素株式会社 部品実装基板の製造方法
KR101556658B1 (ko) 2013-11-26 2015-10-01 주식회사 두산 내열성 및 저유전 손실 특성을 가진 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
JP6528352B2 (ja) * 2014-03-13 2019-06-12 住友ベークライト株式会社 積層板の製造方法、プリント配線基板の製造方法
US10405421B2 (en) * 2017-12-18 2019-09-03 International Business Machines Corporation Selective dielectric resin application on circuitized core layers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251895A (ja) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd 多層配線板及び多層配線板の製造方法
JP2008198774A (ja) * 2007-02-13 2008-08-28 Sumitomo Bakelite Co Ltd 樹脂組成物、フィルム付きまたは金属箔付き絶縁樹脂シート、多層プリント配線板、多層プリント配線板の製造方法および半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003099952A1 (ja) * 2002-05-27 2005-10-20 味の素株式会社 接着フィルム及びプリプレグ
JP5011641B2 (ja) * 2004-01-28 2012-08-29 味の素株式会社 熱硬化性樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2006179888A (ja) * 2004-11-26 2006-07-06 Sanyo Chem Ind Ltd プリント配線板用層間フィルム
WO2009028493A1 (ja) * 2007-08-28 2009-03-05 Sumitomo Bakelite Company, Ltd. 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁樹脂シート、多層プリント配線板及び半導体装置
TWI611922B (zh) * 2008-03-25 2018-01-21 Ajinomoto Co., Inc. 絕緣樹脂薄片及使用該絕緣樹脂薄片的多層印刷電路板之製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251895A (ja) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd 多層配線板及び多層配線板の製造方法
JP2008198774A (ja) * 2007-02-13 2008-08-28 Sumitomo Bakelite Co Ltd 樹脂組成物、フィルム付きまたは金属箔付き絶縁樹脂シート、多層プリント配線板、多層プリント配線板の製造方法および半導体装置

Also Published As

Publication number Publication date
WO2012176424A1 (ja) 2012-12-27
JP2013030762A (ja) 2013-02-07
JP5141843B2 (ja) 2013-02-13
TWI514945B (zh) 2015-12-21
TW201311085A (zh) 2013-03-01
KR20140043433A (ko) 2014-04-09

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