JP2008251891A - 回路基板及びその半導体装置 - Google Patents
回路基板及びその半導体装置 Download PDFInfo
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Abstract
【解決手段】回路基板11は、ガラスクロスをコア部に有する厚さ230μmの基板であって、上記回路基板11と、その一方の面に配置された半導体チップ31と、半導体チップ31の少なくとも上部および側面を封止する封止樹脂33の硬化物とからなる半導体装置に適用される。封止樹脂樹脂33の硬化後の厚みが、回路基板11の厚みの4倍以下であり、回路基板11は、その両端を基準位置として、半導体チップ31が配置されている面と反対の面側に凸の反りを有しており、かつ回路基板11を260℃で、1分間熱処理した後、室温でその凸側の反りを維持する。
【選択図】図3
Description
(実施例1)
(1)樹脂ワニスの調製
ノボラック型シアネート樹脂(ロンザジャパン株式会社製、プリマセットPT−30、平均分子量約700)19.7重量部、ビフェニルジメチレン型エポキシ樹脂(日本化薬株式会社製、NC−3000H、エポキシ当量275)11重量部、ビフェニルジメチレン型フェノール樹脂(明和化成株式会社製、MEH−7851−3H、水酸基当量230)9重量部、およびエポキシシラン型カップリング剤(GE東芝シリコーン株式会社製、A−187)0.3重量部をメチルエチルケトンに常温で溶解し、球状溶融シリカ(株式会社アドマテックス社製、球状溶融シリカ、SO−25R、平均粒径0.5μm)60重量部を添加し、高速攪拌機を用いて10分攪拌して、樹脂ワニスを得た。
(2)プリプレグの製造
上述の樹脂ワニスをガラスクロス(厚さ94μm、日東紡績製、WEA−2116)に含浸し、150℃の加熱炉で2分間乾燥して、ワニス固形分が約50質量%のプリプレグを得た。
(3)積層板の製造
上述のプリプレグの両面に18μmの銅箔を重ねて、圧力4MPa、温度200℃で2時間加熱加圧成形することによって、厚さ0.23mmの積層板を得た。
(4)回路基板の作製
上記方法により製造された積層板を用いて配線パターンを有する回路基板を10個作製した。このとき作製された回路基板のうち、5個は図4に示すような加熱温度プロファイルが設定されたリフロ装置(HELLER社製 1812EXL−S)で最高温度260度で加熱し(実施例1)、残り5個はかかる加熱を行わなかった(比較例1)。
(実験2)
上記作製したシアネート系のプリプレグを三菱瓦斯化学製のビスマレイミドトリアジン系のプリプレグを変更し、実験1と同様に作製された回路基板のうち、5個は上述の図4の加熱温度プロファイルが設定されたリフロ装置で最高温度260度で加熱し(実施例2)、残り5個はかかる加熱を行わなかった(比較例2)。
12 プリプレグ
14 導体層
15 配線パターン
Claims (3)
- 繊維基材をコア部に有する厚さ500μm以下の回路基板であって、
前記回路基板と、前記回路基板の一方の面に配置された半導体素子と、前記半導体素子の少なくとも上部および側面を封止する封止樹脂組成物の硬化物とからなる半導体装置に適用され、
前記封止樹脂組成物の硬化物の厚みが、前記回路基板の厚みの4倍以下であり、
前記回路基板は、その両端を基準位置として、前記半導体素子が配置されている面と反対の面側に凸の反りを有しており、
かつ前記回路基板を260℃で、1分間熱処理した後、室温で前記凸側の反りを維持することを特徴とする回路基板。 - 前記基準位置から前記反対の面側に0〜100μmの凸の反りを有することを特徴とする請求項1記載の回路基板。
- 請求項1又は2記載の回路基板を備えることを特徴とする半導体装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092209A JP2008251891A (ja) | 2007-03-30 | 2007-03-30 | 回路基板及びその半導体装置 |
CN2008800051824A CN101611490B (zh) | 2007-02-16 | 2008-02-08 | 电路板的制造方法、半导体制造装置、电路板和半导体器件 |
MYPI20093411 MY153017A (en) | 2007-02-16 | 2008-02-08 | Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
PCT/JP2008/052586 WO2008099940A1 (ja) | 2007-02-16 | 2008-02-08 | 回路基板の製造方法、半導体製造装置、回路基板及び半導体装置 |
US12/526,631 US8592256B2 (en) | 2007-02-16 | 2008-02-08 | Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
KR1020097016928A KR101409048B1 (ko) | 2007-02-16 | 2008-02-08 | 회로 기판의 제조 방법, 반도체 제조 장치, 회로 기판 및 반도체 장치 |
TW097105483A TWI424510B (zh) | 2007-02-16 | 2008-02-15 | Circuit board manufacturing method and semiconductor manufacturing device |
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JP2007092209A JP2008251891A (ja) | 2007-03-30 | 2007-03-30 | 回路基板及びその半導体装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011236367A (ja) * | 2010-05-12 | 2011-11-24 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物及び電子部品装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091476A (ja) * | 1998-07-16 | 2000-03-31 | Nitto Denko Corp | 半導体装置 |
JP2003031926A (ja) * | 2001-07-19 | 2003-01-31 | Kyoei Sangyo Kk | プリント基板のそり矯正方法 |
WO2006054637A1 (ja) * | 2004-11-18 | 2006-05-26 | Matsushita Electric Industrial Co., Ltd. | 配線基板とその製造方法および半導体装置 |
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2007
- 2007-03-30 JP JP2007092209A patent/JP2008251891A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091476A (ja) * | 1998-07-16 | 2000-03-31 | Nitto Denko Corp | 半導体装置 |
JP2003031926A (ja) * | 2001-07-19 | 2003-01-31 | Kyoei Sangyo Kk | プリント基板のそり矯正方法 |
WO2006054637A1 (ja) * | 2004-11-18 | 2006-05-26 | Matsushita Electric Industrial Co., Ltd. | 配線基板とその製造方法および半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011236367A (ja) * | 2010-05-12 | 2011-11-24 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物及び電子部品装置 |
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