KR101891344B1 - 박판형 워크의 연삭 방법 및 양두 평면 연삭반 - Google Patents

박판형 워크의 연삭 방법 및 양두 평면 연삭반 Download PDF

Info

Publication number
KR101891344B1
KR101891344B1 KR1020120024977A KR20120024977A KR101891344B1 KR 101891344 B1 KR101891344 B1 KR 101891344B1 KR 1020120024977 A KR1020120024977 A KR 1020120024977A KR 20120024977 A KR20120024977 A KR 20120024977A KR 101891344 B1 KR101891344 B1 KR 101891344B1
Authority
KR
South Korea
Prior art keywords
grinding
work
workpiece
static pressure
sharpness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120024977A
Other languages
English (en)
Korean (ko)
Other versions
KR20120106576A (ko
Inventor
아츠시 시바나카
Original Assignee
고요 기카이 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고요 기카이 고교 가부시키가이샤 filed Critical 고요 기카이 고교 가부시키가이샤
Publication of KR20120106576A publication Critical patent/KR20120106576A/ko
Application granted granted Critical
Publication of KR101891344B1 publication Critical patent/KR101891344B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020120024977A 2011-03-18 2012-03-12 박판형 워크의 연삭 방법 및 양두 평면 연삭반 Active KR101891344B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2011-060520 2011-03-18
JP2011060520 2011-03-18
JPJP-P-2011-243137 2011-11-07
JP2011243137A JP5891010B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Publications (2)

Publication Number Publication Date
KR20120106576A KR20120106576A (ko) 2012-09-26
KR101891344B1 true KR101891344B1 (ko) 2018-08-24

Family

ID=46757087

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120024977A Active KR101891344B1 (ko) 2011-03-18 2012-03-12 박판형 워크의 연삭 방법 및 양두 평면 연삭반

Country Status (4)

Country Link
JP (1) JP5891010B2 (https=)
KR (1) KR101891344B1 (https=)
DE (1) DE102012204089A1 (https=)
TW (1) TWI558503B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104511814A (zh) * 2014-12-20 2015-04-15 重庆尹氏天润套装门有限公司 具有双面打磨的木板加工台
JP6285375B2 (ja) * 2015-02-17 2018-02-28 光洋機械工業株式会社 両頭平面研削装置
CN107984360A (zh) * 2017-11-20 2018-05-04 长沙市凤英机械科技有限公司 一种h型钢多面打磨除锈装置
CN108687644A (zh) * 2018-03-29 2018-10-23 芜湖凌梦电子商务有限公司 一种方便使用的平板电脑生产设备的抛光销
CN108747667B (zh) * 2018-05-07 2019-10-25 徐州恒林木业有限公司 一种bmc注塑模具板材表面去毛刺装置
CN110181383A (zh) * 2019-06-06 2019-08-30 扬州好管家科技信息咨询有限公司 一种升降式自控自吸型水泵模具加工用的高效性抛光装置
CN110539237B (zh) * 2019-09-30 2021-06-04 南通海润机床有限公司 一种磨床用可升降的双砂轮结构
CN110883661A (zh) * 2019-12-04 2020-03-17 浙江中慧厨房设备有限公司 一种用于钢板的双面抛光机
CN110860998B (zh) * 2019-12-09 2025-05-27 中环领先(徐州)半导体材料有限公司 双面减薄的装置和方法
CN111390678A (zh) * 2020-04-24 2020-07-10 山西潞安太阳能科技有限责任公司 一种硅片打磨机及其使用方法
JP7588494B2 (ja) * 2020-11-04 2024-11-22 株式会社ディスコ 被加工物の研削方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003236748A (ja) 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4524547A (en) * 1983-09-06 1985-06-25 Litton Industrial Products, Inc. Automatic double disc grinder control cycle
JP2003071713A (ja) 2001-08-29 2003-03-12 Nippei Toyama Corp 研削装置及びウェーハの厚さ管理方法
JP2004058175A (ja) * 2002-07-25 2004-02-26 Sumitomo Heavy Ind Ltd 両頭研削装置
JP4319092B2 (ja) * 2004-06-03 2009-08-26 住友重機械工業株式会社 両面加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2003236748A (ja) 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置

Also Published As

Publication number Publication date
DE102012204089A1 (de) 2012-09-20
KR20120106576A (ko) 2012-09-26
TW201249597A (en) 2012-12-16
TWI558503B (zh) 2016-11-21
JP2012210697A (ja) 2012-11-01
JP5891010B2 (ja) 2016-03-22

Similar Documents

Publication Publication Date Title
KR101891344B1 (ko) 박판형 워크의 연삭 방법 및 양두 평면 연삭반
KR101891345B1 (ko) 박판형 워크의 연삭 방법 및 양두 평면 연삭반
KR101983395B1 (ko) 양두 평면 연삭법 및 양두 평면 연삭반
US6336057B1 (en) Lens grinding apparatus
KR100954534B1 (ko) 얇은 원판형상 공작물의 양면 연삭방법 및 양면 연삭장치
EP1063053B1 (en) Bilateral automatic machine for edge-machining plates of glass, stone-like materials and the like
KR20180104575A (ko) 평면 연삭 방법 및 평면 연삭 장치
CN102300673A (zh) 玻璃基板的倒棱装置
TW201029797A (en) Lens processing method and grinding device
CN104853880A (zh) 磨削加工方法
JP4911810B2 (ja) ワークの研削装置および研削方法
KR20160120237A (ko) 박판형상 워크의 제조방법 및 양두 평면 연삭장치
CN103826798A (zh) 用于对眼镜片进行修边的方法
JP4319092B2 (ja) 両面加工装置
JP2002307303A (ja) 薄板円板状ワークの両面研削方法および装置
JPH09201768A (ja) 両頭研削盤における自動定寸装置及び方法
JPS63102872A (ja) 研削方法
JPH06258050A (ja) 砥石形状計測装置
JP2003236748A (ja) 研削装置
CN114227452A (zh) 打磨装置、打磨设备及打磨方法
JP2001277084A (ja) 両頭研削盤
JP2003326448A (ja) ベルトスリーブ研磨方法及び研磨装置
JP2001088024A (ja) 研削盤におけるテーパ補正制御方法
JPH0639711A (ja) 研削盤
JPS63114862A (ja) 球面研削盤

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20210715

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20220630

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000