KR101871207B1 - 부품 실장 장치, 표면 실장기, 및 흡착 높이 위치의 검출 방법 - Google Patents

부품 실장 장치, 표면 실장기, 및 흡착 높이 위치의 검출 방법 Download PDF

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Publication number
KR101871207B1
KR101871207B1 KR1020167034408A KR20167034408A KR101871207B1 KR 101871207 B1 KR101871207 B1 KR 101871207B1 KR 1020167034408 A KR1020167034408 A KR 1020167034408A KR 20167034408 A KR20167034408 A KR 20167034408A KR 101871207 B1 KR101871207 B1 KR 101871207B1
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KR
South Korea
Prior art keywords
suction
component
unit
waveform
adsorption
Prior art date
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KR1020167034408A
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English (en)
Korean (ko)
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KR20170002593A (ko
Inventor
유키나리 아와노
타카시 이
타로 카와이
나오키 하나무라
Original Assignee
야마하하쓰도키 가부시키가이샤
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Application filed by 야마하하쓰도키 가부시키가이샤 filed Critical 야마하하쓰도키 가부시키가이샤
Publication of KR20170002593A publication Critical patent/KR20170002593A/ko
Application granted granted Critical
Publication of KR101871207B1 publication Critical patent/KR101871207B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020167034408A 2014-09-26 2014-09-26 부품 실장 장치, 표면 실장기, 및 흡착 높이 위치의 검출 방법 KR101871207B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/075647 WO2016046958A1 (ja) 2014-09-26 2014-09-26 部品実装装置、表面実装機、及び吸着高さ位置の検出方法

Publications (2)

Publication Number Publication Date
KR20170002593A KR20170002593A (ko) 2017-01-06
KR101871207B1 true KR101871207B1 (ko) 2018-06-27

Family

ID=55580517

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167034408A KR101871207B1 (ko) 2014-09-26 2014-09-26 부품 실장 장치, 표면 실장기, 및 흡착 높이 위치의 검출 방법

Country Status (4)

Country Link
JP (1) JP6207758B2 (ja)
KR (1) KR101871207B1 (ja)
CN (1) CN106465577B (ja)
WO (1) WO2016046958A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6548040B2 (ja) * 2016-09-06 2019-07-24 パナソニックＩｐマネジメント株式会社 電子部品の実装方法及び実装装置
CN111656882B (zh) * 2018-03-07 2022-07-05 株式会社富士 元件安装系统
JP7421430B2 (ja) 2020-07-06 2024-01-24 株式会社Fuji 部品吸着位置設定方法および部品吸着装置
CN115623350B (zh) * 2022-11-22 2023-04-07 深圳市米尔电子有限公司 一种智能无线路由组件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001177296A (ja) 1999-12-17 2001-06-29 Yamaha Motor Co Ltd 表面実装部品装着機および表面実装部品装着方法
JP2002368491A (ja) 2001-06-13 2002-12-20 Sony Corp 部品装着装置における部品高さ測定方法及びその装置
JP2003133795A (ja) 2001-10-29 2003-05-09 Matsushita Electric Ind Co Ltd 電子部品実装装置における基板上面高さの検出方法
JP2006108540A (ja) 2004-10-08 2006-04-20 Matsushita Electric Ind Co Ltd ノズル部材検出方法、部品保持検出方法、部品実装方法及び部品実装装置
JP2009130334A (ja) 2007-11-28 2009-06-11 Yamaha Motor Co Ltd 部品移載装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133786A (ja) 2001-10-23 2003-05-09 Sharp Corp 高周波集積回路搭載装置およびこれを用いた電子回路装置
JP4516836B2 (ja) * 2004-12-21 2010-08-04 Ｊｕｋｉ株式会社 部品実装装置
JP2009016498A (ja) * 2007-07-03 2009-01-22 Yamaha Motor Co Ltd 部品吸着方法および表面実装機
JP5095542B2 (ja) * 2008-07-24 2012-12-12 Ｊｕｋｉ株式会社 電子部品実装装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001177296A (ja) 1999-12-17 2001-06-29 Yamaha Motor Co Ltd 表面実装部品装着機および表面実装部品装着方法
JP2002368491A (ja) 2001-06-13 2002-12-20 Sony Corp 部品装着装置における部品高さ測定方法及びその装置
JP2003133795A (ja) 2001-10-29 2003-05-09 Matsushita Electric Ind Co Ltd 電子部品実装装置における基板上面高さの検出方法
JP2006108540A (ja) 2004-10-08 2006-04-20 Matsushita Electric Ind Co Ltd ノズル部材検出方法、部品保持検出方法、部品実装方法及び部品実装装置
JP2009130334A (ja) 2007-11-28 2009-06-11 Yamaha Motor Co Ltd 部品移載装置

Also Published As

Publication number Publication date
JP6207758B2 (ja) 2017-10-04
KR20170002593A (ko) 2017-01-06
CN106465577B (zh) 2019-03-19
WO2016046958A1 (ja) 2016-03-31
CN106465577A (zh) 2017-02-22
JPWO2016046958A1 (ja) 2017-04-27

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