KR101871207B1 - Component mounting device, surface mounting machine, and method for detecting adsorption height position - Google Patents

Abstract

As the component mounting apparatus 30 for mounting the component E1 adsorbed by the adsorption section 54 on the substrate P1 and a suction section 54 for suctioning the component by suctioning the component from the upper side by the negative pressure A measuring section 60 for measuring the magnitude of the negative pressure in the adsorbing section 54 and a control section 70 for controlling the adsorbing section 54 and the measuring section 60. The control section 70 is configured to adsorb Observation observing the time variation of the magnitude of the negative pressure measured by the measuring section 60 during the time from when the component E1 is sucked from the component 54 to when the suction of the component E1 is started after the component E1 starts to be suctioned And a determination processing unit 77 for determining an adsorption height position when the component E1 is adsorbed by the adsorption unit 54 based on a temporal change in the magnitude of the negative pressure observed in the observation processing, , And the observation process changes the distance between the part E1 and the suction part 54 at the time of starting the suction of the part E1 Execute a number of times.

Description

TECHNICAL FIELD [0001] The present invention relates to a component mounting apparatus, a surface seal member,

The technique disclosed in this specification relates to a component mounting apparatus for determining a position of a suction height of a component, a surface body having the component mounting apparatus, and a method for detecting a suction height position.

BACKGROUND ART [0002] Conventionally, there is known a component mounting apparatus which includes a plurality of suction nozzles for suctioning various electronic components or the like by negative pressure, and mounts the electronic components adsorbed by the suction nozzles onto a printed board. In the component mounting apparatus having such a suction nozzle, when the suction height position is excessively close to the electronic component when the electronic component is mounted on the printed board, the tip of the suction nozzle excessively interferes with the electronic component and the suction nozzle or the electronic component is damaged There is work. Therefore, it is required to detect the optimum position of the suction height for each type of electronic component before mounting the electronic component on the printed circuit board.

The following Patent Document 1 discloses a detection method for detecting a suction height position of a suction nozzle for mounting an electronic component in the above component mounting apparatus. In this detection method, the flow rate of the air sucked from the suction nozzle is measured while the suction nozzle is lowered with respect to a predetermined measurement reference plane, the timing at which the flow rate measurement value falls below a predetermined value is calculated from the flow rate measurement result, The suction height position of the suction nozzle is detected.

Japanese Patent Application Laid-Open No. 2003-133786

However, since the detection method of Patent Document 1 does not measure the flow rate while lowering the adsorption nozzle with respect to the electronic component to be adsorbed, it is difficult to cope with the difference in the position of the adsorption height due to the unevenness of each adsorbed component. Further, even if the flow rate is measured while lowering the suction nozzle with respect to the electronic component by using the detection method of Patent Document 1, the electronic component is sucked by the suction nozzle and the electronic component floats from the mounting surface. It is difficult to detect the position of the adsorption height with high accuracy.

The technique disclosed in the present specification was created in view of the above problems and is intended to provide a component mounting apparatus capable of detecting a suction height position of various parts with high precision, a surface seal member having such a component mounting apparatus, So that it is possible to detect the height position with high accuracy.

A component mounting apparatus for mounting the component adsorbed by the adsorption section on a substrate, the component mounting apparatus comprising a suction section for adsorbing the component by suctioning the component from above by a negative pressure, And a control unit for controlling the adsorption unit and the measurement unit, wherein the control unit sucks the component to the adsorption unit and starts sucking the component, An observation processing section that performs observation processing to observe a temporal change in the magnitude of the negative pressure measured by the measuring section during a period from the time when the pressure is applied to the workpiece to the workpiece, A crystal processing for determining the position of the adsorption height when the component is adsorbed by the adsorption section is mounted on the substrate And the observation processing section changes the distance between the component and the adsorption section at the time of starting the suction of the component and executes the observation process a plurality of times. The measurement of the magnitude of the negative pressure in this specification is not limited to the measurement of the magnitude of the negative pressure by the pressure value, but also includes, for example, measuring the magnitude of the negative pressure as the voltage value or the flow rate.

In the component mounting apparatus, the observing processing section of the control section observes the temporal change in the magnitude of the negative pressure measured by the measuring section from the start of the suction of the component to the end of the suction in the observation process. Here, the size of the negative pressure measured by the measuring unit changes to a gentle gradient as the electronic component floats from the mounting surface in accordance with the suction by the suction unit. When the electronic component contacts the suction unit, the degree of vacuum in the suction unit rapidly It becomes higher and becomes a sudden power. Therefore, it is possible to calculate the elapsed time from the start of the suction by the suction unit to the suction of the electronic component by observing the time change of the size of the negative pressure. As the elapsed time becomes shorter, Can be regarded as being short.

In the component mounting apparatus, the determination processing section of the control section executes the measurement processing a plurality of times by changing the distance between the component and the adsorption section at the time of starting the component suction, and in the crystal processing, The adsorption height position with respect to the part is determined based on the time variation of the adsorption height. Therefore, by comparing the elapsed time calculated in each of the measurement processes executed a plurality of times, it is possible to determine the optimum height of the adsorption portion of the adsorption unit, which is very close to between the electronic component and the adsorption unit. Then, by performing each of the above processes for each of a plurality of kinds of parts having different shapes and the like, it is possible to detect an optimum position of the suction height for each part with high accuracy. As described above, in the above-described component mounting apparatus, the attraction height position of various parts can be detected with high accuracy by focusing on the characteristic of the time change in the magnitude of the negative pressure when the component floats and is attracted to the attracting section by suction by the attracting section have.

Wherein the component mounting apparatus includes a storage unit and the observation processing unit terminates the suction after a lapse of a predetermined time from the start of suction of the component by the suction unit in the observation process, And the determination processing unit, in the determination processing, determines whether or not the waveform of the component corresponding to one of the plurality of waveforms stored in the storage unit is stored in the storage unit, based on a distance between the component and the adsorption unit, The adsorption height position may be determined. In the present specification, the predetermined time is a time obtained by adding a minute time to the time when the adsorption portion disposed above the component starts to be adsorbed and then the component is adsorbed on the adsorption portion, and is, for example, several milliseconds .

According to this configuration, since the time from the start of the suction of the component to the end of the suction is the same for the observation process to be performed a plurality of times, the waveforms observed in the plurality of observation processes are overlapped each other, It is possible to effectively compare the above-mentioned elapsed time. Therefore, the adsorption height position can be determined with high accuracy in the crystal processing.

In the component mounting apparatus, the observation processing section performs the distance measurement in a single observation process among the observation processes executed a plurality of times as a distance at which the component is not adsorbed to the adsorption section during the predetermined time, Is stored in the storage unit as a reference waveform, and in another observation observation process, the waveform is stored in the storage unit as a normal waveform, and in the determination process, the reference waveform and the normal waveform are read from the storage unit A differential waveform calculating process for calculating a waveform having a difference between the reference waveform and the normal waveform as a differential waveform and a differential waveform calculating process for calculating a difference between the magnitudes of the negative pressures The elapsed time to calculate the elapsed time until the threshold value is calculated And the suction height position may be determined based on the distance between the part corresponding to the differential waveform at which the elapsed time is calculated and the suction part.

In the normal waveform and the differential waveform, since the waveform changes gently at the change point of the gradient when the component is attracted to the adsorption section, it is difficult to detect the change point with high precision. According to the above configuration, since the elapsed time is uniquely determined by calculating the differential waveform from the read reference waveform and the normal waveform and calculating the elapsed time until the predetermined differential value is reached with respect to the differential waveform, Can be eliminated. The position of the suction height can be determined with higher precision by determining the position of the suction height based on the distance between the part corresponding to the differential waveform calculated elapsed time excluding the influence of the waveform near the change point and the suction part .

In the above-described component mounting apparatus, the determination processing section executes a time difference calculating process for calculating a difference between the elapsed times for two adjacent differential waveforms when a plurality of the differential waveforms are overlapped, The adsorption height position may be determined based on the distance corresponding to one of the differential waveforms in which the elapsed time is relatively large, out of the two differential waveforms in which the difference in time is equal to or less than the first predetermined value.

The difference between the elapsed times excluding the influence of the waveform near the change point tends to become smaller as the distance between the component and the adsorption section becomes smaller. According to the above arrangement, the suction height position is determined based on the distance between the part corresponding to one differential waveform and the suction part when the difference in the calculated elapsed time becomes equal to or less than the first predetermined value, Can be determined.

In the above-described component mounting apparatus, the determination processing unit may be configured such that the determination processing includes: reading processing for reading a plurality of waveforms from the storage unit; differential waveform generating processing for calculating a differential waveform that differentiates the waveform; An elapsed time calculating process of calculating the elapsed time from the start of suction to the point of occurrence of the second peak relating to the magnitude of the negative pressure is performed and the elapsed time is calculated based on the elapsed time of the component corresponding to the calculated differential waveform And the adsorption height position may be determined based on the distance between the adsorption units.

According to this configuration, the influence of the waveform near the change point can be excluded by calculating the difference between the elapsed times with respect to the differential waveform calculated from the waveform. Further, the differential waveform is calculated without calculating the reference waveform, and the elapsed time until the second peak of the calculated differential waveform is generated is calculated. Here, since the point at which the second peak occurs is set to one point, the elapsed time can be accurately detected by looking at the time when the second peak occurs. The position of the suction height can be determined with higher accuracy by determining the position of the suction height based on the distance between the part corresponding to the differential waveform calculated with the elapsed time so accurately and the suction part.

In the above-described component mounting apparatus, when the plurality of the differentiated waveforms are overlapped, the determination processing section executes a time difference calculating process for calculating a difference between the elapsed times for the two differentiated waveforms whose elapsed times are close to each other And the absorption height position may be determined on the basis of the distance corresponding to one of the differential waveforms whose elapsed time is relatively large among the two differentiated waveforms whose difference between the elapsed times is equal to or less than the second predetermined value.

According to this configuration, the difference in elapsed time from the two adjacent differential waveforms is calculated, so that the suction height position can be detected a small number of times for the observation process. In this configuration, the time required until the suction height position is detected after the detection of the suction height position is started can be shortened.

In the above component mounting apparatus, the crystal processing section may determine the absorption height position when the elapsed time with respect to the one differential waveform or the one differential waveform is equal to or less than a third predetermined value in the crystal processing.

Even if the two adjacent differential waveforms calculated in the crystal process or the two adjacent differential waveforms are different from each other depending on the variation width of the distance between the component and the suction portion, Or may be lower than a predetermined value or lower than a second predetermined value. According to the above configuration, since the position of the suction height is determined when the elapsed time is equal to or less than the third predetermined value, it is possible to prevent the suction height position from being determined even though the suction part is separated from the part. Therefore, the position of the adsorption height can be determined with higher precision.

In the component mounting apparatus, the observation processing section may perform the observation processing a plurality of times by changing the distance between the component and the adsorption section at equal intervals.

If the observation process is performed a plurality of times by changing the distances to equal intervals, the difference between the elapsed times becomes smaller as the attracting portion approaches the component. According to the above arrangement, when the difference between the elapsed times is equal to or less than the first predetermined value or equal to or less than the second predetermined value, the position of the adsorption height can be determined without setting a separate condition for determining the adsorption height position. Therefore, the position of the adsorption height can be determined by a simpler determination method.

In the above-described component mounting apparatus, the determination processing unit may be configured such that the determination processing includes: reading processing for reading a plurality of waveforms from the storage unit; differential waveform generating processing for calculating a differential waveform that differentiates the waveform; An elapsed time calculating step of calculating an elapsed time from the start of suction to a point of time when a second peak is generated with respect to the magnitude of the negative pressure; and an elapsed time calculating step of calculating elapsed time and elapsed time corresponding to the calculated differential waveform A function calculating process for calculating an approximate function from the distance may be executed and the position of the adsorption height may be determined based on the distance between the part and the adsorption unit when the elapsed time reaches a predetermined threshold value in the approximate function good.

In the above arrangement, the control unit calculates the approximate function from the distance corresponding to the differentiated waveform and the elapsed time and the elapsed time, and determines the adsorption height position from the calculated approximate function. This approximate function can be calculated by performing at least three observations. Therefore, the position of the suction height can be detected a smaller number of times for the observation process, and the time required until the suction height position is detected after the detection of the suction height position is started can be further shortened.

The component mounting apparatus may include an input unit for receiving an input from the outside, and the observation processing unit and the determination processing unit may execute the observation processing and the determination processing by receiving the input of the input unit.

According to this configuration, the input section can start processing for detecting the suction height position based on the intention of the operator or the like by accepting an input from the outside such as an operator.

The component mounting apparatus may include an elevating section for elevating and lowering the adsorption section vertically and the control section may execute the observation processing a plurality of times by changing the height of the adsorption section when the suction of the component is started by controlling the elevation section .

According to this, a specific configuration for changing the distance between the component and the adsorption section can be provided by the lifting and lowering of the adsorption section by the control section.

Another technique disclosed in this specification relates to a surface mounting machine including the component mounting apparatus, a component supplying apparatus for supplying the component to the component mounting apparatus, and a substrate transferring apparatus for transferring the substrate in the transferring direction.

Another technique disclosed in this specification includes a suction unit for suctioning a component by suction from its upper side by a negative pressure and a measurement unit for measuring the size of the negative pressure in the suction unit, A component mounting apparatus for mounting a component on a substrate, the component mounting apparatus comprising: a pickup height position detecting unit for detecting a position of a pickup height when the component is picked up by the pickup unit to mount the component on the substrate, And a time step of observing a change with time in the magnitude of the negative pressure measured by the measuring unit during the period from the start of the suction of the component to the end of the suction, And a determining step of determining whether or not the component is to be sucked, Wherein the step of determining the time of the change in the size of the negative pressure is performed a plurality of times by changing the distance between the adsorption height And a method for detecting a position.

(Effects of the Invention)

According to the technique disclosed in this specification, a component mounting apparatus capable of detecting a suction height position of various parts with high accuracy, a surface seal member having such a component mounting apparatus, and a suction head It is possible to provide a method of detecting a position of a suction height that can be performed.

1 is a plan view
2 is an enlarged front view of the head unit viewed from the front;
3 is a schematic diagram showing a configuration for generating a negative pressure in the adsorption nozzle
4 is a block diagram showing an electrical configuration of a surface seal member
5 is a flowchart showing the flow from the start of detection of the suction height position to the mounting of the electronic component
6 is a flowchart showing the flow of the suction height position detecting process
Fig. 7 is an explanatory diagram showing a change in the distance between the electronic component and the suction nozzle in the suction height position detecting process
8 is a graph showing each waveform observed in the observation process
9 is a graph showing differential waveforms of the respective waveforms
10 is a flow chart showing the flow of the suction height position detecting process of the second embodiment
11 is a graph showing each waveform observed in the observation process of the second embodiment
12 is a graph showing a differential waveform of each waveform in the second embodiment
13 is a flow chart showing the flow of the suction height position detecting process of the third embodiment
14 is a graph showing each waveform observed in the observation process of the third embodiment
15 is a graph showing a differential waveform of each waveform in the third embodiment
16 is a graph showing an approximate function in the third embodiment
17 is a schematic diagram showing a configuration for generating a negative pressure in the suction nozzle in the fourth embodiment
18 is a graph showing each waveform observed in the observation process of the fourth embodiment
19 is a graph showing differential waveforms of the respective waveforms in the fourth embodiment
20 is a graph showing each waveform observed in the observation process of the fifth embodiment
21 is a graph showing a differential waveform of each waveform in the fifth embodiment
22 is a graph showing each waveform observed in the observation process of the sixth embodiment
23 is a graph showing a differential waveform of each waveform in the sixth embodiment
24 is a graph showing an approximate function in the sixth embodiment
25 is a flow chart showing the flow of the suction height position detecting process of the seventh embodiment

(Total composition of surface yarn)

The first embodiment will be described with reference to the drawings. In the present embodiment, the surface treatment organ 1 shown in Fig. 1 is exemplified. The surface sealant 1 has the same structure in each of the following embodiments. The surface ceramic body 1 includes a base 10, a transfer conveyor 20 (an example of a substrate transfer apparatus) for transferring a printed substrate (an example of a substrate) P1, (An example of a component supply apparatus) 40 for supplying an electronic component E1 to the component mounting apparatus 30, a component mounting apparatus 30 for mounting an electronic component E1 (an example of a component) And the like.

The base 10 has a rectangular shape in plan view and has a flat upper surface. A backup plate or the like not shown in the drawings for backing up the printed board P when the electronic component E1 is mounted on the printed board P1 is provided below the conveying conveyor 20 in the base 10 Is installed. In the following description, the long side direction (left and right direction in FIG. 1) of the base 10 and the conveying direction of the conveying conveyor 20 are set as the X axis direction, and the short side direction Axis direction, and the vertical direction of the base 10 (vertical direction in Fig. 2) is the Z-axis direction.

The conveying conveyor 20 is disposed at a substantially central position of the base 10 in the Y-axis direction and conveys the printed board P1 along the conveying direction (X-axis direction). The conveying conveyor 20 has a pair of conveyor belts 22 that are circulatingly driven in the conveying direction. The printed board P1 is set to be mounted on both conveyor belts 22. In the present embodiment, the printed board P1 is moved from the one side (the right side shown in Fig. 1) in the carrying direction to the working position (the position surrounded by the two-dot chain line in Fig. 1) on the base 10 along the conveyor belt 22 And is carried out to the other side (the left side shown in Fig. 1) along the conveyor belt 22 after the electronic component E1 is mounted on the machine at the working position.

The feeder-type feeder 40 is arranged at four places in total, two at both sides (upper and lower sides in Fig. 1) of the conveyor 20 in the X-axis direction. In the feeder-type feeder 40, a plurality of feeders 42 are attached in a side-by-side arrangement. Each feeder 42 includes a reel (not shown) in which a component supply tape (not shown) accommodating a plurality of electronic components E1 is wound, and an electric delivery device (not shown in the figure) for taking out the component supply tape from the reel And the electronic component E1 is supplied one by one from the end located on the conveying conveyor side.

The component mounting apparatus 30 includes a pair of support frames 31 provided above the base 10 and the feeder-like feeder 40 or the like, a head unit 32, Unit driving mechanism. Each of the support frames 31 is located on both sides of the base 10 in the X-axis direction and extends in the Y-axis direction. The support frame 31 is provided with an X-axis servo mechanism and a Y-axis servo mechanism constituting a head unit drive mechanism. The head unit 32 is movable in the X-axis direction and the Y-axis direction within a certain movable region by the X-axis servo mechanism and the Y-axis servo mechanism.

The Y-axis servo mechanism constituting the head unit drive mechanism includes a Y-axis guide rail 34Y provided on each support frame 31 extending in the Y-axis direction and a Y-axis guide rail 34Y extending in the Y- And a Y-axis servo motor 38Y attached to the Y-axis ball screw 36Y. The Y-axis servo motor 38Y is mounted on the Y-axis ball screw 36Y.

Further, a head supporting body 39 fixed to the ball nut is attached to each Y-axis guide rail 34Y so as to extend in the X-axis direction. When the Y axis servo motor 38Y is energized and controlled, the ball nut moves forward and backward along the Y axis ball screw 36Y. As a result, the head support 39 fixed to the ball nut and the head unit 32 Is moved in the Y-axis direction along the Y-axis guide rail 34Y.

The X-axis servo mechanism constituting the head unit drive mechanism includes an X-axis guide rail 34X (see FIG. 2) provided on the head support body in a form extending in the X-axis direction and a head support body 39 Axis ball screw 36X which is threadedly coupled with a ball nut, not shown, and a Y-axis servo motor 38X attached to the X-axis ball screw 36X.

A head unit 32 is movably attached to the X-axis guide rail 34X along its axial direction. When the X axis servo motor 38X is energized and controlled, the ball nut moves forward and back along the X axis ball screw 36X. As a result, the head unit 32 fixed to the ball nut moves along the X axis guide rail 34X Move in the X-axis direction.

The head unit 32 draws out the electronic component E1 supplied onto the base 10 from the feeder-type feeder 40 and mounts it on the printed board P1. As shown in Fig. 2, a plurality of mounting heads 52 are mounted on the head unit 32 for performing mounting operation of the electronic component E1. Each mounting head 52 protrudes downward from the lower surface of the head unit 32, and a suction nozzle (an example of the suction unit) 54 is provided at the tip thereof.

Each mounting head 52 is capable of rotating around the axis by the R-axis servomotor 38R (see Fig. 4) or the like. Each of the mounting heads 52 is configured to be vertically movable with respect to the frame 32A of the head unit 32 by driving the Z-axis servomotor 38Z (one example of the elevating portion, see Fig. 4) . Therefore, when the Z axis servo motor 38Z is controlled to be energized, the suction nozzle 54 moves up and down together with the mounting head 52, and the height position of the lower end of the suction nozzle 54 is changed.

The head unit 32 is provided with a board recognition camera C1 (see FIG. 4, not shown in FIGS. 1 and 2). The substrate recognition camera C1 is fixed to the head unit 32 in a state in which the imaging surface faces downward and is configured to move integrally with the head unit 32. [ Therefore, by driving the above-described X-axis servo mechanism and Y-axis servo mechanism, it is possible to pick up an image at an arbitrary position on the printed board P stopped at the working position by the board recognition camera C1.

(Configuration for generating negative pressure on the suction nozzle)

Next, a configuration for generating a negative pressure in the suction nozzle 54 will be described. 3, the suction passage 56 formed in the suction nozzle 54 is connected to the valve 62 via a pressure sensor (an example of the measurement section) The valve 62 is also connected to the negative pressure generating portion 64. The negative pressure generating portion 64 is, for example, a vacuum pump and generates a negative pressure at a constant pressure value (for example, -80 to 90 kPa). The pressure sensor 60, the valve 62, and the negative pressure generating portion 64 are connected to a control portion 70, which will be described later.

When the valve 62 is opened in the state where the negative pressure generating portion 64 is turned on by the control portion 70, negative pressure is supplied from the negative pressure generating portion 64 to the adsorption nozzle 54, So that a suction force is generated. The electronic component E1 supplied through the feeder F1 is sucked to the tip end portion 54A of the suction nozzle 54 of the component mounting apparatus 30 and the printed board P1 stopped at the working position, As shown in FIG. The suction nozzles 54 protruding from the respective mounting heads 52 have different diameters and protruding lengths, and the sizes of the negative pressures supplied to the suction passages 56 are also different.

The pressure sensor 60 connected to the suction path 56 outputs the magnitude of the negative pressure in the suction path 56 in the vicinity of the suction nozzle 54 to the control unit 70 as a voltage value. 1, the component recognition camera C2 is fixed in the vicinity of the mounting position by the head unit 32 on the base 10, respectively. The component recognition camera C2 picks up an image of the electronic component E1 taken out from the feeder-type supply device 40 by the mounting head 52 to pick up each electronic component E1 by the suction nozzle 54 And so on.

(Electrical construction of surface seal)

Next, the electrical construction of the surface treatment organ 1 will be described with reference to Fig. The main body of the surface yarn organ 1 is controlled and controlled by the control unit 70 as a whole. The control unit 70 includes an arithmetic processing unit 71 constituted by a CPU or the like. The calculation processing unit 71 is provided with a motor control unit 72, a storage unit 73, an image processing unit 74, an external input / output unit 75, an observation processing unit 76, a determination processing unit 77, An input unit 78, and an input unit 79, respectively.

The motor control unit 72 drives the X axis servo motor 38X, the Y axis servo motor 38Y, the Z axis servo motor 38Z and the R axis servo motor 38X of each head unit 32 in accordance with a mounting program 73A (38R). The motor control unit 72 drives the conveying conveyor 20 in accordance with the mounting program 73A.

The storage section 73 is constituted by a ROM (Read Only Memory) for storing a program for controlling the CPU and the like, and a RAM (Random Access Memory) for temporarily storing various data during operation of the apparatus. The storage unit 73 stores a mounting program 73A and various data 73B to be described later.

The mounting program 73A stored in the storage section 73 stores the number of the electronic components E1 to be mounted on the printed board P1, Type information, mounting information regarding the mounting position of the electronic component E1 on the printed board P1, and the like. Incidentally, the mounting program 73A includes information on the position of the suction height with respect to the various electronic components E1 detected in the suction height position detecting process described later.

The various data 73B stored in the storage section 73 also include data regarding the number and type of the electronic components E1 held by the feeders 42 of the feeder-type feeder 40, Data relating to various waveforms observed in the suction height position detecting process, data on various predetermined values, threshold values, and allowable time used in the suction height position detecting process to be described later, and the like.

The imaging signal output from the board recognition camera C1 and the component recognition camera C2 are respectively introduced into the image processing unit 74. [ In the image processing section 74, on the basis of the image pickup signals from the cameras (C1, C2) introduced, the parts image is analyzed and the substrate image is analyzed.

The external input / output section 75 is configured to introduce a detection signal output from various sensors 75A, such as the above-described pressure sensor 60, provided on the body of the surface body 1 as a so-called interface. The external input / output unit 75 is configured to perform an operation control on the various actuators 75B, such as the opening / closing control of the valve 62 described above, based on the control signal output from the calculation processing unit 71. [

The observation processing unit (76) observes the time of the magnitude of the negative pressure measured by the pressure sensor (60). The crystal processing section 77 controls the electronic component E1 to be attached to the suction nozzle 54 in order to mount the electronic component E1 on the printed board P1 based on the temporal change in the magnitude of the negative pressure observed by the observation processing section 76. [ To determine the position of the adsorption height at the time of adsorption.

The display unit 78 is constituted by a liquid crystal display or the like having a display screen and displays the state of the surface real-organ 1 on the display screen. The input unit 79 is constituted by a keyboard or the like, and accepts input from the outside by manual operation.

(Operation mode of surface treatment)

The front surface body 1 according to the present embodiment has a conveying state in which the conveying operation of the printed board P1 by the conveying conveyor 20 is performed during automatic operation and a conveying state in which the conveying conveying operation of the electronic part E1 on the printed board P1 And is mounted alternately in a mounting state in which the mounting operation is performed. The feeder-type feeder 40 also accommodates a plurality of kinds of electronic components E1 having different shapes for each of the feeders 42. The feeder- When the electronic component E1 is different in shape and size from one type to another and the electronic component E1 is connected to the suction nozzle 54 in order to mount the electronic component E1 on the printed board P1 The optimum position of the adsorption height at the time of adsorption is different.

Therefore, in the surface treatment organ 1, the control unit 70 detects the suction height position for each type of the electronic component E1 to be mounted before mounting the various electronic components E1 on the printed board P1 Processing is executed. The suction height position may be detected, for example, in the conveying state during automatic operation. For example, during the stop of the automatic operation, the input unit 79 receives an input for starting the detection of the suction height position from the outside . In the mounted state, the electronic component E1 is mounted on the basis of the suction height position detected for the various electronic components E1.

(Processing executed by the control unit)

The surface mount body 1 according to the present embodiment has the above-described structure. Next, after the detection of the suction height position of the electronic component E1 is started, Will be described with reference to the flow chart shown in Fig. The series of processes shown below are the processes executed by the control unit 70 in accordance with the above-described mounting program 73A.

The detection of the adsorption height position is performed for each electronic component E1 of different kinds with respect to each adsorption nozzle 54. [ The control unit 70 first controls the X-axis servo mechanism and the Y-axis servo mechanism so that the suction nozzle 54 for performing the detection of the suction height position among the suction nozzles 54 is positioned above the electronic component E1 to be detected. The servo mechanism is driven to move the head unit 32 (S2).

Next, the observation processing unit 76 and the determination processing unit 77 of the control unit 70 execute the suction height position detection processing for detecting the suction height position with respect to the electronic component E1 to be detected (S4). The adsorption height position detection processing will be described later in detail. When the suction height position detection process is completed, the control unit 70 stores the detection result, that is, the suction height position detected in the suction height position detection process, in the mounting program 73A of the storage unit 73, and shifts to S8 .

The control unit 70 shifts to the mounting state at S8 and executes the mounting operation of various electronic components E1. In this mounting operation, the control unit 70 reads the suction height position of the electronic component E1 to be mounted on the suction nozzle 54, from which the suction is performed, from the mounting program 73A, The mounting operation of the electronic component E1 is performed at the optimum height of the adsorption surface.

(Suction height position detection processing)

Next, the embodiments of the adsorption height position detection process executed by the observation processing unit 76 and the determination processing unit 77 of the control unit 70 at S4 will be described. In the first embodiment, the second embodiment and the third embodiment, the configurations of the surface seal organ 1 and the processes of S2, S6, and S8 performed by the control unit 70 are common to the respective embodiments. Therefore, It will be omitted from the following description.

(Embodiment 1)

The suction height position determination process of the first embodiment will be described with reference to the flow chart shown in Fig. Here, as an example of the electronic component E1 to be the detection target of the suction height position, the electronic component E1 of the substantially block shape shown in Fig. 7 is exemplified. In the electronic component (E1), the upper surface thereof is an adsorption site to be adsorbed by the adsorption nozzle (54).

7 (A), the observation processing unit 76 of the control unit 70 first drives the Z-axis servomotor 38Z so that the Z-axis servo motor 38Z is driven so as to be sufficiently distant from the electronic component E1 to be detected The adsorption nozzle 54 is moved to the position (S10). Here, the position sufficiently away from the electronic component E1 is a position when the suction nozzle 54 is at the uppermost position, for example, a position from the start of suction by the suction nozzle 54 to the end of suction Refers to a position at which the electronic component E1 does not float from the loading surface due to the suction force of the suction nozzle 54. [ 7 indicate the distances between the electronic component E1 and the suction nozzle 54 when the suction nozzles 54 are at the positions shown in Figs. 7 (A) to 7 (E), respectively .

Next, the observation processing unit 76 of the control unit 70 starts suction of the electronic component E1 by the suction nozzle 54, and terminates suction after a predetermined time (for example, several milliseconds) has elapsed. The observation processing unit 76 of the control unit 70 observes the temporal change of the magnitude of the negative pressure measured by the pressure sensor 60 during the predetermined period of time (S12) and displays the observed temporal change as a reference waveform in the storage unit 73 (S14).

Here, an example of the reference waveform of the time change stored in the storage unit 73 in the process of S14 is shown by the waveform W0 in the graph of Fig. The horizontal axis in FIG. 8 is the time axis, and the time point at which the suction of the electronic component E1 by the suction nozzle 54 is started, that is, the point at which the valve 62 is opened by the control unit 70 is set to zero. 8 indicates the magnitude of the negative pressure outputted as the pressure, that is, the voltage value from the pressure sensor 60, and the negative pressure is higher toward the upper side of the graph (the degree of vacuum in the suction path 56 is higher).

In the process of S12, since the suction nozzle 54 is located sufficiently far from the electronic component E1 as described above, the electronic component E1 is supplied with the suction force from the suction nozzle 54 So that the suction is not hindered. Therefore, as shown by the reference waveform W0 in Fig. 8, the negative pressure measured in the process of S12 is greatly increased from the time when the suction by the suction nozzle 54 is started and the suction air reaches the pressure sensor 60, Becomes constant and becomes constant until it becomes equal to the pressure value (P0) of the negative pressure generated in the negative pressure generating part (64).

7B, when the process of S14 is completed, the observation processing unit 76 of the control unit 70 determines whether or not the electronic component E1 is at a height position at which the electronic component E1 is lifted from the mounting surface by suction by the suction nozzle 54 The adsorption nozzle 54 is lowered (S16). Next, the observation processing unit 76 of the control unit 70 starts suction of the electronic component E1 by the suction nozzle 54, and terminates the suction after the predetermined time elapses. The observation processing unit 76 of the control unit 70 observes the temporal change of the magnitude of the negative pressure measured by the pressure sensor 60 during the predetermined period of time (S18) and displays the observed temporal change as a normal waveform in the storage unit 73 (S20).

Here, when the height position of the suction nozzle 54 is the position shown in Fig. 7 (B), an example of the normal waveform of the time variation stored in the storage unit 73 in the process of S20 is shown in the graph of Fig. 8 And is represented by waveform W1. When the height position of the suction nozzle 54 is the position shown in Fig. 7B, after the suction by the suction nozzle 54 is started, the suction of the suction nozzle 54 causes the electronic component E1 to be loaded And the upper surface of the electronic component E1 is adsorbed to the lower end of the adsorption nozzle 54 as indicated by the two-dot chain line in Fig. 7 (B). When the electronic component E1 is adsorbed by the suction nozzle 54, the suction port of the lower end of the suction nozzle 54 is blocked by the electronic component E1, so that the negative pressure measured by the pressure sensor 60 further rises, The degree of vacuum in the suction path 56 becomes high.

Therefore, the normal waveform W1 shown in Fig. 8 rises largely for the first time and then rises until it becomes equal to the negative pressure value P0 generated in the negative pressure generating portion 64, E1) is adsorbed to the adsorption nozzle 54, the adsorbed amount of the adsorbed adsorbed gas 54 is constant. The normal waveform W1 shown in Fig. 8 again rises again at the point of time TA1 (the change point of the gradient, the second rising point) at which the electronic component E1 is adsorbed by the adsorption nozzle 54, Until the passage of time elapses, a curve is drawn on the graph of Fig.

The observation processing unit 76 of the control unit 70 determines whether or not the difference between the elapsed times of no calculation can be calculated (S22). The difference in elapsed time referred to here is calculated in a process to be described later, and is calculated based on the reference waveform and two normal waveforms. Therefore, when at least two normal waveforms in which the difference in elapsed time is not calculated are stored in the storage section 73, the observation processing section 76 of the control section 70 determines that the difference in elapsed time of the non- (S22: YES), the process proceeds to S24. On the other hand, when at least two normal waveforms in which the difference in elapsed time is not calculated are not stored in the storage section 73, the observation processing section 76 of the control section 70 can calculate the difference in elapsed time (S22: NO), the process returns to S16.

First, the case where the process returns from the process of S22 to the process of S16 will be described. When returning from S22 to S16, the observation processing unit 76 of the control unit 70 further moves the suction nozzle 54 from the position shown in Fig. 7B to the position shown in Fig. 7C (S16). After that, the control unit 70 sequentially executes the processes of S18 and S20 described above, and then the process returns to S22. Thus, the process from S16 to S22 is executed plural times by changing the distance between the electronic component E1 and the suction nozzle 54. [ The processing performed by the observation processing unit 76 of the control unit 70 in steps S10 to S14 and the processing executed in steps S16 to S22 are examples of the observation processing.

An example of the normal waveform of the temporal change stored in the storage unit 73 when the height position of the suction nozzle 54 is the position shown in Fig. 7 (C) is shown by the waveform W2 in Fig. The distance between the electronic component E1 and the suction nozzle 54 is reduced by lowering the suction nozzle 54 from the position shown in Fig. 7 (B) to the position shown in Fig. 7 (C) The elapsed time from the start of suction by the suction nozzle 54 to the suction of the electronic component E1 is shortened. Therefore, as shown in Fig. 8, the normal waveform W2 has a shorter elapsed time from the start of suction to the second rising point TA2 compared with the normal waveform W1.

7 (D) from the position shown in Fig. 7 (C) to the observation processing unit 76 of the control unit 70 at S16 every time when the process returns from the process of S22 to the process of S16, 7E to the position shown in Fig. 7F from the position shown in Fig. 7D to the position shown in Fig. 7E to the position shown in Fig. . In the position shown in Fig. 7 (F), the lower end of the suction nozzle 54 is in contact with the upper surface of the electronic component E1. In this embodiment, the lowering width of the suction nozzle 54 is not constant but variable, and is controlled so that the lowering width of the suction nozzle 54 becomes smaller as the suction nozzle 54 approaches the electronic component E1.

When the height position of the suction nozzle 54 is the position shown in Fig. 7 (C), the position shown in Fig. 7 (D) An example of the normal waveform stored in the storage unit 73 in the case of FIG. 8 is represented by waveforms W2, W3, W4, and W5, respectively. As the adsorption nozzle 54 descends (as the distance between the electronic component E1 and the adsorption nozzle 54 becomes shorter, as shown by the normal waveform W2, the normal waveform W3, and the normal waveform W4) , The elapsed time from the start of suction to the second rising point is gradually shortened. 7 (F)), the suction port of the lower end of the suction nozzle 54 has already reached the suction port of the electronic component E1 at the point of time when the suction nozzle 54 starts to suction, The negative pressure measured in the process of S12 is drawn from the initial rising point to a pressure value in a vacuum state while drawing a curve on the graph of Fig. 8, as shown by the normal waveform W5 in Fig. 8 Rise.

Continuation of the flow chart shown in Fig. 6 will be described. In S24, the determination processing unit 77 of the control unit 70 reads the reference waveform and the plurality of normal waveform data stored in the storage unit 73 from the storage unit 73 (an example of read processing). Next, the determination processing section 77 of the control section 70 calculates a differential waveform having a difference from the reference waveform for a plurality of normal waveforms (S26, an example of differential waveform calculation processing). Differential waveforms related to the normal waveforms W1, W2, W3, W4 and W5 shown in Fig. 8 are denoted by D1, D2, D3, D4 and D5 in Fig. The horizontal axis of FIG. 9 is the same as the horizontal axis of FIG. The vertical axis in Fig. 9 represents the pressure difference, and the difference in pressure from the reference waveform W0 becomes larger toward the upper side of the graph.

Next, the determination processing section 77 of the control section 70 calculates the elapsed time until the differential of the magnitude of the negative pressure becomes a predetermined threshold value after starting the suction for the differential waveform calculated in S26 (S28, elapsed time An example of calculation processing). In the example shown in Fig. 9, the threshold value is denoted by TH1. This threshold value TH1 is for eliminating the influence of the waveform near the rising point of each of the differential waveforms D1, D2, D3, D4 and D5 and is set in advance based on the evaluation test. In FIG. 9, T1, T2, T3, T4, and T5 represent the elapsed time for each of the differential waveforms D1, D2, D3, D4, and D5.

Next, the determination processing section 77 of the control section 70 calculates the difference between the elapsed times for two adjacent differential waveforms (two adjacent differential waveforms shown in Fig. 9) when a plurality of differential waveforms overlap each other S30, an example of time difference calculation processing). 9, the difference between the elapsed times of the differential waveform D1 and the differential waveform D2 is represented by T1-T2, the difference between the elapsed times of the differential waveform D2 and the differential waveform D3 is represented by T2-T3 , The difference between the elapsed times of the differential waveform D3 and the differential waveform D4 is represented by T3-T4 and the difference between the elapsed times of the differential waveform D4 and the differential waveform D5 is represented by T4-T5.

Next, the determination processing unit 77 of the control unit 70 determines whether the difference between the elapsed times calculated in S30 is the first predetermined value (S32). The first predetermined value is a value that can be regarded as a sufficiently small difference between elapsed times, and is set in advance based on the evaluation test, for example, 5 milliseconds. Therefore, when the difference between the elapsed times calculated in S30 is equal to the first predetermined value, it means that the difference between the elapsed times is substantially equal to the calculated elapsed time. If the control unit 70 determines in S32 that the difference in elapsed time is the first predetermined value (S32: YES), the control unit 70 proceeds to S34. When the determination processing unit 77 of the control unit 70 determines in S32 that the difference in elapsed time is not the first predetermined value (S32: NO), the process goes back to S16.

The determination processing unit 77 of the control unit 70 determines in step S34 whether or not the difference waveform of the two differential waveforms whose difference in elapsed time is determined to be equal to the first predetermined value is one of the differential waveforms whose elapsed time is relatively large, It is determined whether the elapsed time is equal to or less than a third predetermined value. The third predetermined value is an integer and is set in advance on the basis of the evaluation test for each surface treatment organ 1.

8, for example, the third predetermined value is set to a value obtained by multiplying the branch point J1 of the normal waveform W5 observed when the reference waveform W0 and the suction nozzle 54 are in contact with the electronic component E1 And the allowable time required to determine the adsorption height position is added. Both the reference waveform W0 and the normal waveform W5 can be observed irrespective of whether the electronic component E1 is present or not. Namely, the normal waveform W5 can be obtained, for example, by observing the temporal change in the magnitude of the negative pressure measured by the pressure sensor 60 while the operator closes the suction port of the tip portion 54A of the suction nozzle 54 .

When the elapsed time is judged to be equal to the third predetermined value in S34 (S34: YES), the determination processing section 77 of the control section 70 determines whether or not the elapsed time equal to or less than the third predetermined value is equal to the calculated normal waveform corresponding to the calculated differential waveform The height position of the suction nozzle 54 when the normal waveform is observed is determined as the suction height position (S36), and the suction height position detection process is terminated. If the determination processing unit 77 of the control unit 70 determines in S34 that the elapsed time is not equal to or less than the third predetermined value (S34: NO), the process goes back to S16. The processing that the control section 70 executes in S24 to S36 is an example of the determination processing.

Here, in the present embodiment, only T3-T4 and T4-T5 among the differences between the elapsed times described above are assumed to be equal to or less than the first predetermined value, and the time indicated by the symbol TS3 in Fig. 9 is set as the third predetermined value. Therefore, in the present embodiment, when the difference between elapsed times calculated in S30 is any one of T1-T2 and T2-T3, it is determined in S32 that the difference in elapsed time is not equal to or less than the first predetermined value (S32: NO).

In the present embodiment, when the difference between the elapsed times calculated in S30 is T3-T4, the determination processing unit 77 of the control unit 70 determines that the difference between elapsed times is equal to the first predetermined value in S32 (S32: YES) , It is determined in step S34 that the elapsed time T3 of the differential waveform having the relatively long elapsed time, that is, the differential waveform D3 is not equal to or less than the third predetermined value TS3 (S34: NO).

In the present embodiment, when the difference between the elapsed times calculated in S30 is T4-T5, the determination processing unit 77 of the control unit 70 determines that the difference between elapsed times is equal to the first predetermined value in S32 (S32: YES) , It is judged in S34 that the elapsed time T4 of the differential waveform having a relatively large elapsed time, that is, the differential waveform D4 is equal to or smaller than the third predetermined value TS3 (S34: YES). The determination processing unit 77 of the control unit 70 determines whether or not the normal waveform W4 corresponding to the differential waveform D4 obtained by calculating the elapsed time T4 equal to or less than the third predetermined value TS3 The height position of the suction nozzle 54 when the waveform W4 is observed, that is, the height position shown in Fig. 7 (E) is determined as the suction height position.

As described above, the optimum adsorption height position for each of the various electronic components E1 is detected for each of the plurality of adsorption nozzles 54. [ The reason why the height position (the height position at which the normal waveform W5 is observed) when the suction nozzle 54 is in contact with the electronic component E1 is not set to the optimum suction height position is that the suction nozzle 54, The tip 54A of the suction nozzle 54 may excessively interfere with the electronic component E1 if the suction nozzle 54 is brought into contact with the electronic component E1 by lowering the suction nozzle 54. In this case, , The electronic component E1 or the suction nozzle 54 may be damaged, so that it can not be said to be the optimum adsorption height position.

(Effect of Embodiment 1)

As described above, in the present embodiment, the temporal change of the magnitude of the negative pressure is observed as the reference waveform and the normal waveform, and the differential waveform is calculated from the reference waveform and the normal waveform. Here, the normal waveform and the differential waveform gradually change in waveform at the change point (second rising point) of the gradient when the electronic component E1 is adsorbed to the adsorption nozzle 54, so that the change point is detected with high precision It is difficult. On the contrary, in the present embodiment, the difference waveform is calculated from the read reference waveform and the normal waveform, and the difference between the elapsed time until the predetermined difference value TH1 is obtained with respect to the differential waveform is calculated so that the influence of the waveform near the change point Can be excluded. Also, the difference in elapsed time tends to decrease as the distance between the electronic component E1 and the suction nozzle 54 becomes smaller. Therefore, the position of the suction height can be determined on the basis of the distance between the electronic component E1 and the suction nozzle 54 corresponding to one differential waveform when the calculated elapsed time difference becomes equal to or less than the first predetermined value.

As described above, in this embodiment, attention is paid to the characteristic of the time variation of the negative pressure when the electronic component E1 floats and is sucked to the suction nozzle 54 by the suction by the suction nozzle 54, The position of the adsorption height can be determined with high accuracy.

In the present embodiment, the determination processing unit 77 of the control unit 70 determines the suction height position when the elapsed time with respect to the one differential waveform is equal to or less than the third predetermined value. Here, in the adjacent two of the differential waveforms calculated in the process of S26, depending on the variation width of the distance between the electronic component E1 and the suction nozzle 54, the suction nozzle 54 is separated from the electronic component E1 And the suction height position is determined when the elapsed time is equal to or less than the third predetermined value, it is possible to prevent the suction height position from being determined even though the suction nozzle 54 is separated from the electronic component E1. Therefore, the position of the adsorption height can be determined with higher precision.

In the present embodiment, an input unit 79 for accepting input from the outside is connected to the control unit 70. Then, the control unit 70 executes the suction height position detection process by the input unit 79 receiving the input. Therefore, the input unit 79 can receive the input from the operator and start the suction height position detection processing based on the operator's intention.

(Modification of Embodiment 1)

Subsequently, a modification of the first embodiment will be described. In this modified example, in the suction height position detection process described in the first embodiment, the process of observing each waveform is executed a plurality of times by changing the distance by which the suction nozzle 54 is lowered at equal intervals. Further, in this modification, the determination processing unit 77 of the control unit 70 does not execute the processing of S34, and if the difference of the elapsed time is determined to be equal to the first predetermined value (S32: YES), the processing proceeds to S36. That is, when the determination processing unit 77 of the control unit 70 determines in S32 that the difference in elapsed time is equal to the first predetermined value (S32: YES), the normal waveform corresponding to the one differential waveform is observed The height position of the suction nozzle 54 is determined as the suction height position.

If the process of observing the waveform by changing the distance at equal intervals as in the present modification example is performed a plurality of times, the difference between the elapsed times becomes smaller as the adsorption nozzle 54 approaches the electronic component E1. Therefore, in this modification, in the case where the difference between the elapsed times becomes equal to or less than the first predetermined value, without setting the additional condition (for example, whether or not the difference is equal to or less than the third predetermined value) The position of the adsorption height can be determined with high accuracy. Therefore, the position of the adsorption height can be determined by a simpler determination method.

(Embodiment 2)

Next, the suction height position detecting process of the second embodiment will be described with reference to a flowchart shown in Fig. In the suction height position detection processing of the present embodiment, the observation processing unit 76 of the control unit 70 first lowers the suction nozzle 54 to the position where the electronic component E1 is sucked (S110). Here, the position where the electronic component E1 is sucked refers to a position shown in Fig. 7 (B), for example.

Next, the observation processing unit 76 of the control unit 70 starts suction of the electronic component E1 by the suction nozzle 54, and terminates the suction after a predetermined time (for example, several seconds) has elapsed. The observation processing unit 76 of the control unit 70 observes the time change of the magnitude of the negative pressure measured by the pressure sensor 60 during the predetermined time at step S112 and outputs the observed time change as a waveform to the storage unit 73. [ (S114).

Here, an example of the waveform of the time change stored in the storage unit 73 in the process of S114 is shown by the waveform W11 in the graph of Fig. The horizontal axis in FIG. 11 is the time axis, and the time point at which the suction of the electronic component E1 by the suction nozzle 54 is started, that is, the point at which the valve 62 is opened by the control unit 70 is set to zero. 11 shows the magnitude of the negative pressure outputted as the pressure, that is, the voltage value from the pressure sensor 60, and the negative pressure becomes higher toward the upper side of the graph (the degree of vacuum in the suction path 56 is higher).

When the suction nozzle 54 is located at the position where the electronic component E1 is sucked, after the suction by the suction nozzle 54 is started, the suction of the suction nozzle 54 causes the electronic component E1 to move And the upper surface of the electronic component E1 is adsorbed to the lower end portion of the adsorption nozzle 54. [ Therefore, the waveform W11 shown in Fig. 11 rises until it becomes equal to the pressure value P0 of the negative pressure generated in the negative pressure generating portion 64 after the first rise (the first rising point TA0) The electronic component E1 rises at the time TA11 at which the electronic component E1 is adsorbed by the suction nozzle 54 until the electronic component E1 lifted from the loading surface is adsorbed by the adsorption nozzle 54, (The change point of the gradient, the second rising point), and rises toward the pressure value of the vacuum state while drawing a curve on the graph of Fig. 11 until the predetermined time elapses.

The observation processing unit 76 of the control unit 70 determines whether or not the difference between the elapsed time of the non-calculation can be calculated (S116). The difference in elapsed time referred to here is calculated in the processing to be described later, and is calculated based on two differential waveforms to be described later. Therefore, when at least two differentiated waveforms for which the difference in elapsed time is not calculated are stored in the storage section 73, the observation processing section 76 of the control section 70 determines that the difference in elapsed time of the non- (S116: YES), the process proceeds to S120. On the other hand, when at least two differential waveforms for which the difference in elapsed time is not calculated are not stored in the storage section 73, the observation processing section 76 of the control section 70 can calculate the difference between elapsed times (S116: NO), the process proceeds to S118.

The observation processing unit 76 of the control unit 70 further lowers the height position of the suction nozzle 54 in S118 and returns to S112. 7 (B), the control unit 70 changes the height position of the suction nozzle 54 from the position shown in FIG. 7 (B) to the position shown in FIG. 7 (C) ) To the position shown in Fig. Thereafter, the observation processing unit 76 of the control unit 70 sequentially executes the processes of S112 and S114 described above, and then proceeds to S116. The processes of S112 to S116 are executed a plurality of times by changing the distance between the electronic component E1 and the suction nozzle 54. [ The processing performed by the observation processing unit 76 of the control unit 70 in S110 and the processing executed in S112 to S116 are examples of observation processing.

When the height position of the suction nozzle 54 is the position shown in Fig. 7 (C), the position shown in Fig. 7 (D) An example of the waveform stored in the storage unit 73 in the case of Fig. 11 is represented by waveforms W12, W13, W14, and W15, respectively. The waveforms of the waveforms W12, W13, W14 and W15 are the same as those of the normal waveforms W2, W3, W4 and W5 described in the first embodiment. The reference numerals TA12, TA13, TA14 and TA15 in Fig. 11 represent the second rising points of the waveforms W12, W13, W14 and W15.

Continuation of the flow chart shown in Fig. 10 will be described. In S120, the determination processing unit 77 of the control unit 70 reads data of each waveform stored in the storage unit 73 from the storage unit 73 (an example of read processing). Next, the determination processing section 77 of the control section 70 calculates differential waveforms obtained by differentiating the plurality of waveforms (S122, an example of the differential waveform calculation processing). Here, the graph of Fig. 12 shows that the differential waveforms for the respective waveforms W12, W13, W14 and W15 are superimposed. The horizontal axis of Fig. 12 is the same as the horizontal axis of Fig. The vertical axis in Fig. 12 indicates the change in pressure, that is, the magnitude of the inclination of each of the waveforms W12, W13, W14 and W15 in Fig. 11, and the change in pressure becomes larger toward the upper side of the graph.

Therefore, the first peak PK10 in Fig. 12 corresponds to the first rising point TA10 of each of the waveforms W11, W12, W13, W14 and W15 in Fig. 11, The peaks PK11, PK12, PK13, PK14 and PK15 are the second peaks and the second rising points TA11, TA12, TA13, and TA13 of the waveforms W11, W12, W13, W14, TA14, TA15).

Next, the determination processing section 77 of the control section 70 calculates the elapsed time from the start of suction to the differential waveform calculated in S122 to the point of time when the second peak occurs regarding the magnitude of the negative pressure (S124, elapsed time An example of calculation processing). The elapsed time calculated in the process of S124 is the same as the time from the start of suction of the electronic component E1 by the suction nozzle 54 to the suction nozzle 54 until the electronic component E1 is adsorbed.

12 shows the elapsed time of each differential waveform and T11, T12, T13, T14 and T15 represent the elapsed time of each differential waveform. The second peak (PK11, PK12, PK13, PK14, PK15) And the like. In calculating the elapsed time from the differential waveform, it is difficult to accurately detect the second rising point because the second rising point gently rises in the waveform before differential operation. On the other hand, in the differential waveform, the second rising point is a peak This is because the second rising point can be detected with high precision.

Next, when a plurality of differentiated waveforms are overlapped, the determination processing section 77 of the control section 70 determines whether or not two differential waveforms (two differential waveforms in FIG. 12, And calculates the difference between elapsed times (S126, an example of a time difference calculation process). In the graph of FIG. 12, the difference in elapsed time with respect to each differential waveform is represented by T11-T12, T12-T13, T13-T14, and T14-T15.

Next, the determination processing unit 77 of the control unit 70 determines whether the difference between elapsed times calculated in S126 is a second predetermined value (S128). This second predetermined value is a value that can be regarded as a sufficiently small difference in the elapsed time, and is set in advance based on the evaluation test, for example, 5 milliseconds. Therefore, when the difference between the elapsed times calculated in S126 is the second predetermined value, it means that the two elapsed times calculated in the difference between the elapsed times are substantially equal. If the difference between the elapsed times is determined to be the second predetermined value (S128: YES), the determination processing unit 77 of the control unit 70 proceeds to S130. If the determination processing unit 77 of the control unit 70 determines in S128 that the difference in elapsed time is not the second predetermined value (S128: NO), the processing returns to S118.

The determination processing unit 77 of the control unit 70 determines in step S130 whether the difference between the elapsed time and the differential waveform is greater than the second predetermined value, It is determined whether the elapsed time is equal to or less than a third predetermined value. This third predetermined value is the same as that described in the first embodiment.

If it is determined in step S130 that the elapsed time is equal to the third predetermined value (S130: YES), the determination processing unit 77 of the control unit 70 determines whether or not the elapsed time equal to or less than the third predetermined value is a waveform corresponding to the calculated differential waveform The height position of the suction nozzle 54 when the waveform is observed is determined as the suction height position (S132), and the suction height position detection process is terminated. When the determination processing unit 77 of the control unit 70 determines in S130 that the elapsed time is not equal to or less than the third predetermined value (S130: NO), the processing returns to S118. The processing that the determination processing unit 77 of the control unit 70 executes in S120 to S132 is an example of the determination processing.

(Effect of Second Embodiment)

As described above, in the present embodiment, temporal change of the magnitude of the negative pressure is observed as a waveform, and the differential waveform is calculated from the observed waveform. Then, the difference between the elapsed times is calculated for the calculated differential waveform. Therefore, the influence of the waveform near the change point when the electronic component E1 is adsorbed to the adsorption nozzle 54 can be excluded. Further, as in Embodiment 1, the differential waveform is calculated without calculating the reference waveform, and the elapsed time until the second peak of the calculated differential waveform is generated is calculated. Here, as shown in Fig. 12, since the point at which the second peak occurs is set to one point, the elapsed time can be accurately detected by looking at the time when the second peak occurs. By calculating the difference between elapsed times from two adjacent differential waveforms, it is possible to detect the position of the suction height with a small number of times with respect to the observation of the waveform. In this manner, the time required for the suction height position detection processing can be shortened.

(Embodiment 3)

Next, the suction height position detecting process of the third embodiment will be described with reference to a flowchart shown in Fig. In the suction height position detection process of the present embodiment, the observation processing section 76 of the control section 70 firstly executes the processes of S210, S212, and S214 shown in Fig. 13 in order. The processes of S210, S212, and S214 are the same processes as the processes of S110, S112, and S114 (see FIG. 10) in the second embodiment, and therefore description thereof is omitted.

The observation processing unit 76 of the control unit 70 determines whether or not the approximate function can be calculated when the processing of S214 is finished (S216). The approximate function referred to here is calculated in a process to be described later, and is calculated based on at least three waveforms. Therefore, when at least three waveforms are stored in the storage unit 73, the observation processing unit 76 of the control unit 70 determines that the approximate function can be calculated (S216: YES), and the process proceeds to S220. On the other hand, when at least three waveforms are not stored in the storage unit 73, the observation processing unit 76 of the control unit 70 determines that the approximate function can not be calculated (S216: NO), and the process proceeds to S218.

The observation processing unit 76 of the control unit 70 further lowers the height position of the suction nozzle 54 in S218 and returns to S212. 7 (B), the observation processing unit 76 of the control unit 70 changes the height position of the suction nozzle from the position shown in Fig. 7 (B) to the position shown in Fig. 7 7 (C). Thereafter, the observation processing unit 76 of the control unit 70 sequentially executes the processes of S212 and S214 described above, and then the process proceeds to S216. The processing performed by the observation processing unit 76 of the control unit 70 at S210 and the processing executed at S212 to S216 are examples of observation processing.

Waveforms W21, W22 and W23 shown in Fig. 14 are examples of the waveforms stored in the storage unit 73 when the height position of the suction nozzle 54 is sequentially lowered and the temporal change in the magnitude of the negative pressure is observed three times . The form of the change of each waveform is the same as the form of change of the waveforms (W12, W13, W14, W15) described in the second embodiment. The signs TA21, TA22 and TA23 in Fig. 11 indicate the second rising point of each of the waveforms W21, W22 and W23.

Continuation of the flow chart shown in Fig. 13 will be described. When the determination processing unit 77 of the control unit 70 determines that the approximate function can be calculated, the determination processing unit 77 sequentially executes the processes of S220, S222, and S224, and then proceeds to S226. The processes in S220, S222, and S224 are the same as the processes in S120, S122, and S124 (see Fig. 10) in the second embodiment, and therefore description thereof will be omitted. The processing performed by the determination processing unit 77 of the control unit 70 in S220, S222, and S224 is an example of reading processing, an example of differential waveform calculating processing, and an example of the elapsed time calculating processing.

Here, the graph of Fig. 15 shows that the differential waveforms calculated from the waveforms W21, W22 and W23 shown in Fig. 14 are superimposed. The horizontal and vertical axes in FIG. 15 are the same as the horizontal and vertical axes in FIG. The first peak PK20 in Fig. 15 corresponds to the first rising point TA20 of each of the waveforms W21, W22 and W23 in Fig. 14, and the peaks PK21 and PK22 And PK23 correspond to the second rising points TA21, TA22, and TA23 of the waveforms W21, W22, and W23 in FIG. 14, respectively. T21, T22 and T23 in Fig. 15 respectively show the elapsed time calculated from the differential waveforms in the process of S224. When the second peak (PK21, PK22, PK23) is generated for each differential waveform .

Next, the determination processing unit 77 of the control unit 70 determines in S226 whether or not each of the elapsed time calculated in the process of S224 and the waveform corresponding to each of the differentiated waveforms whose elapsed time has been calculated, An approximate function is calculated from the height position of the nozzle 54 (an example of function calculation processing). 16, the abscissa axis indicates the height position, and the ordinate axis of the graph indicates the elapsed time, that is, the start of suction of the electronic component E1 by the suction nozzle 54, And the time until the electronic component E1 is adsorbed.

The curve W20 shown in Fig. 16 is an example of an approximate function calculated in the process of S226, and is calculated as follows. The determination processing unit 77 of the control unit 70 determines whether the three elapsed times T21, T22, and T23 and the three elapsed times T21, T22, and T23 are calculated The three points P21, P22 and P23 corresponding to the height positions of the three suctioning nozzles 54 corresponding to the three differentiated waveforms are detected and the approximate expression calculated from these three points P21, P22 and P23 is used as the approximate function do.

Next, the determination processing unit 77 of the control unit 70 determines the position of the suction height based on the height position of the suction nozzle 54 when the elapsed time becomes a predetermined threshold value with respect to the approximate function calculated in S226 ( S228), and ends the suction height position detection processing. In the example shown in Fig. 16, the threshold value is denoted by TH2. The threshold value TH2 is preset to a value near zero. In the example shown in Fig. 16, the height position H1 corresponding to the threshold value TH2 on the curve W20 is determined as the suction height position of the suction nozzle 54. [ The processing that the determination processing unit 77 of the control unit 70 executes in S220 to S228 is an example of the determination processing.

(Effect of Third Embodiment)

As described above, in the present embodiment, the determination processing unit 77 of the control unit 70 calculates the approximate function from the distance corresponding to the differentiated waveform calculated based on the elapsed time and the elapsed time, calculates the approximate function from the calculated approximate function, . This approximation function can be calculated by observing the waveform at least three times as shown in Fig. Therefore, the position of the suction height can be detected a smaller number of times for the observation of the waveform, and the time required for the suction height position detection process can be further shortened.

(Fourth Embodiment)

Next, the suction height position detecting process of the fourth embodiment will be described. 17, in the fourth embodiment, the fifth embodiment and the sixth embodiment, in the configuration for generating negative pressure in the suction nozzle 54, the flow rate sensor (the flow rate sensor) in place of the pressure sensor 60 360) are provided on the lower surface of the housing. The other configuration of the surface bearing organ 1 is the same as that of the first embodiment. The flow rate sensor 360 outputs the flow rate of the intake air flowing in the suction path 56 near the suction nozzle 54 to the control unit 70 as a flow rate value. The degree of vacuum in the suction path 56 is increased and the flow rate of the intake air flowing in the suction path 56 is reduced so that the flow rate in the suction path 56 is measured, It is possible to indirectly measure the magnitude of the negative pressure in the pipe.

The observation processing unit 76 and the determination processing unit 77 of the control unit 70 use the flow sensor 360 instead of the pressure sensor 60 to perform the same processing as the adsorption height position detection processing described in Embodiment 1 . Here, the graph of Fig. 18 is a graph corresponding to the graph of Fig. 8 in the first embodiment. The horizontal axis in FIG. 18 is the time axis, and the time point at which the suction of the electronic component E1 by the suction nozzle 54 is started, that is, the point at which the valve 62 is opened by the control unit 70 is zero. 18 shows the flow rate value output from the flow rate sensor 360, and the flow rate is small at the lower side of the graph, that is, the negative pressure is high (the degree of vacuum in the suction path 56 is high).

Waveforms W31, W32, W33, and W35 shown in Fig. 18 correspond to the reference waveforms W1 and W2 shown in Fig. 8, respectively, W2, W3, W5). That is, the reference waveform W30 is a waveform observed in the process of S12 (see Fig. 6) when the height position of the suction nozzle 54 is at the position of Fig. 7A, and the normal waveforms W31, W32, W33 and W35 (See Fig. 6) when the height positions of the suction nozzles 54 are at the positions of Figs. 7 (B), 7 (C), 7 .

As shown by the reference waveform W30 in Fig. 18, the flow rate measured in the process of S12 in the present embodiment is greatly increased at the same time when suction by the suction nozzle 54 is started, and after the flow rate once becomes the maximum flow rate , The flow rate is gently lowered and stabilized until the flow rate becomes equal to the flow rate of the negative pressure generated in the negative pressure generating part 64, and the flow rate is constant. On the other hand, after the suction of the reference waveform W31 is started and the flow rate reaches the maximum flow rate, while the electronic component E1 lifted from the mounting surface is adsorbed by the suction nozzle 54, So that the flow rate of the negative pressure generated in the portion 64 is reduced. The reference waveform W31 drops again at the point TA1 at which the electronic component E1 is attracted to the suction nozzle 54 (the second falling point) 8, and descends in a form converged to the flow rate value in the vacuum state.

The graph of Fig. 19 corresponds to the graph of Fig. 9 in the first embodiment. The horizontal axis of FIG. 19 is the same as the horizontal axis of FIG. The vertical axis in Fig. 19 represents the difference in the flow rate, and the difference in flow rate from the reference waveform W30 becomes larger toward the lower side of the graph. Waveforms D31, D32, D33, and D35 shown in Fig. 19 are normal waveforms corresponding to the differential waveforms D1, D2, D3, and D5 shown in Fig. The time (T31, T32, T33, T35) shown in Fig. 19 corresponds to the elapsed time (T1, T2, T3, T5 ) ≪ / RTI >

Therefore, in this embodiment, the suction height position is detected as follows. The difference between the elapsed times T31, T32, T33 and T35 is equal to or smaller than the first predetermined value and the difference between the elapsed times T31, T32, T33 and T35 is equal to or smaller than the first predetermined value, The height position of the suction nozzle 54 when the normal waveform corresponding to the calculated differential waveform is observed is determined as the suction height position.

(Effect of Fourth Embodiment)

As described above, in the present embodiment, even when the magnitude of the negative pressure is indirectly measured by measuring the flow rate, the time variation of the magnitude of the negative pressure can be observed as the reference waveform and the normal waveform, Can be calculated. Therefore, the suction height position can be determined with high precision for various electronic components E1 while using the flow rate sensor 360 instead of the pressure sensor 60. [

(Embodiment 5)

Next, the suction height position detecting process of the fifth embodiment will be described. The observation processing unit 76 and the crystal processing unit 77 of the control unit 70 use the flow sensor 360 instead of the pressure sensor 60 to perform the same processing as the adsorption height position detection processing described in Embodiment 2 . Here, the graphs of Figs. 20 and 21 correspond to the graphs of Figs. 11 and 12 in the second embodiment.

Waveforms W41, W42, W43 and W45 shown in Fig. 20 correspond to the waveforms W11, W12, W13 and W15 shown in Fig. 11, respectively. TA41, TA42, TA43, and TA45 in FIG. 20 represent the second falling points of the waveforms W41, W42, W43, and W45, respectively. Each of the peaks PK41, PK42, PK43 and PK45 in Fig. 21 represents the second peak relating to the differential waveforms calculated from the waveforms W41, W42, W43 and W45. In addition, T41, T42, T43 and T45 in Fig. 21 represent the elapsed time with respect to each differential waveform, and corresponds to the point in time at which the second peak (PK41, PK42, PK43, PK45) have.

Therefore, in this embodiment, the suction height position is detected as follows. The difference between the elapsed times T41, T42, T43 and T45 is less than or equal to the second predetermined value and the difference between the elapsed times T41, T42, T43 and T45 is equal to or less than the second predetermined value. When the elapsed time of the differential waveform of the differential waveform is less than or equal to the third predetermined value, the height position of the suction nozzle 54 when the waveform corresponding to the calculated differential waveform is observed is determined as the suction height position.

(Effect of Embodiment 5)

As described above, in the present embodiment, even when the magnitude of the negative pressure is indirectly measured by measuring the flow rate, the temporal change in the magnitude of the negative pressure can be observed as a waveform, and the differential waveform can be calculated from the observed waveform. Therefore, the position of the suction height can be determined with high accuracy while using the flow rate sensor 360 instead of the pressure sensor 60, and the time required for the suction height position detection process can be shortened.

(Embodiment 6)

Next, the suction height position detecting process of the sixth embodiment will be described. The observation processing unit 76 and the crystal processing unit 77 of the control unit 70 use the flow sensor 360 instead of the pressure sensor 60 to perform the same processing as the adsorption height position detection processing described in Embodiment 3 . Here, the graphs of Figs. 22, 23, and 24 are graphs corresponding to the graphs of Figs. 14, 15, and 16 in the third embodiment. In Fig. 24, the horizontal axis and the vertical axis are opposite to those in Fig.

Waveforms W51, W52 and W53 shown in Fig. 22 correspond to the waveforms W21, W22 and W23 shown in Fig. 14, respectively. TA51, TA52, and TA53 in Fig. 20 represent the second falling points of the waveforms W51, W52, and W53, respectively. Each of the peaks PK51, PK52, and PK53 in Fig. 23 represents the second peak related to each differential waveform that is calculated from each of the waveforms W51, W52, and W53. In addition, T51, T52, and T53 in FIG. 23 represent the elapsed time with respect to each differential waveform, and correspond to the point in time at which the second peak (PK51, PK52, and PK53) of the differential waveform is generated.

A straight line L50 shown in Fig. 24 is an example of the approximate function calculated in the process of S226, and is calculated as follows. The determination processing unit 77 of the control unit 70 determines that the three elapsed times T51, T52, and T53 and the three elapsed times T51, T52, and T53 are 3 Three points P51, P52, and P53 corresponding to the differentiated waveforms corresponding to the height positions of the three suction nozzles 54 are detected, and a linear approximation equation As the approximate function. In Fig. 24, a predetermined threshold value relating to the elapsed time is denoted by TH4. Therefore, in this embodiment, the suction height position is detected as follows. That is, the height position H2 corresponding to the threshold value TH4 on the approximate function (straight line L50) shown in Fig. 24 is determined as the adsorption height position.

(Effect of Embodiment 6)

As described above, in the present embodiment, even when the magnitude of the negative pressure is indirectly measured by measuring the flow rate, the temporal change of the magnitude of the negative pressure can be observed as a waveform, the differential waveform is calculated from the observed waveform, The approximate function can be calculated based on the waveform. Therefore, the position of the suction height can be determined with high accuracy while using the flow rate sensor 360 instead of the pressure sensor 60, and the time required for the suction height position detection process can be further shortened.

(Seventh Embodiment)

Next, the suction height position detecting process of the seventh embodiment will be described with reference to a flowchart shown in Fig. In the present embodiment, part of the suction height position detection processing is different from that of the first embodiment. In the suction height position detection processing of the present embodiment, the observation processing unit 76 of the control unit 70 sequentially executes the processing of S10, S12, S14, S16, S18, and S20 shown in Fig. Since these processes are the same as the processes in S10, S12, S14, S16, S18, and S20 (see Fig. 6) in the first embodiment, description thereof will be omitted.

When the processing of S214 ends, the observation processing unit 76 of the control unit 70 proceeds to S24 without executing the processing corresponding to S22 shown in Fig. Thereafter, the determination processing unit 77 of the control unit 70 sequentially executes the processes of S24, S26, and S28 shown in Fig. Since these processes are the same as the processes in S24, S26, and S28 (see Fig. 6) in the first embodiment, the description is omitted.

When the processing of S28 is executed, the determination processing unit 77 of the control unit 70 proceeds to S334 without executing the processing corresponding to S30 and S32 shown in Fig. In step S334, the determination processing unit 77 of the control unit 70 determines whether the elapsed time calculated in step S28 is equal to or less than the third predetermined value. The third predetermined value is the same as that described in Embodiment 1, and is set in advance on the basis of the evaluation test for each surface treatment organ 1.

If it is determined in S334 that the elapsed time is equal to the third predetermined value (S334: YES), the determination processing unit 77 of the control unit 70 determines whether or not the elapsed time equal to or less than the third predetermined value is equal to the calculated normal waveform corresponding to the calculated differential waveform The height position of the suction nozzle 54 when the normal waveform is observed is determined as the suction height position (S36), and the suction height position detection process is terminated. If the determination processing unit 77 of the control unit 70 determines in S334 that the elapsed time is not equal to or less than the third predetermined value (S334: NO), the process goes back to S16.

(Effect of Embodiment 7)

As described above, the present embodiment is different from the first embodiment in that the suction height position is determined only by the determination using the third predetermined value without performing the determination using the first predetermined value in the suction height position detection processing. For example, when the elapsed time calculated in S28 is sufficiently small, the suction nozzle 54 can be regarded as being close to the electronic component E1 without calculating the " difference in elapsed time " And the adsorption height position can be determined only by using the third predetermined value. Thus, in this embodiment, the position of the adsorption height can be determined by a simple determination method in comparison with the first embodiment.

(Other Embodiments)

The techniques disclosed in the present specification are not limited to the embodiments described with reference to the above description and drawings, and for example, the following embodiments are also included in the technical scope.

(1) In each of the above embodiments, the suction nozzle is vertically moved up and down. However, the suction nozzle may be fixed in the vertical direction, and the loading surface on which the electronic component is mounted may be moved up and down. In this case, by changing the height position of the mounting surface, the distance between the electronic component and the suction nozzle can be changed. In the suction height positioning process, the optimum height position of the mounting surface can be detected for each electronic component.

(2) In each of the above embodiments, a block-shaped electronic component is exemplified as an example of the electronic component, but the shape and size of the electronic component are not limited. The electronic component may have a concave portion or a convex portion. Further, the portion of the electronic component to be adsorbed by the adsorption nozzle is not limited to the upper surface of the electronic component, and a portion where the tip of the adsorption nozzle is hermetically sealed may be the adsorption portion. For example, when the component to be adsorbed is a component having a lens, a site avoiding the lens portion may be the adsorption site. The component to which the suction nozzle sucks is not limited to the electronic component.

(3) In each of the above-described embodiments, the detection of the suction height position is performed in the conveying state during the automatic operation, or the input is performed by accepting from outside the input for starting the detection of the suction height position during the stop of the automatic operation However, the present invention is not limited to this. For example, the suction height position may be detected when each feeder of the feeder-type feeder is replaced during the stop of the automatic operation.

(4) In each of the above-described embodiments, the feeder-type feeder is exemplified as an example of the component feeder, but the invention is not limited thereto. For example, a tray-type part feeding device in which a plurality of electronic parts are stacked on a tray.

(5) In each of the above-described embodiments, the pressure sensor and the flow rate sensor are exemplified as an example of the measurement section, but it is not limited to the pressure sensor and the flow rate sensor as long as it can directly or indirectly measure the magnitude of the negative pressure in the absorption section .

(6) In addition to the above-described embodiments, the configuration of the surface seal member can be appropriately changed.

(7) In the seventh embodiment, the suction height position is determined only by the determination using the third predetermined value without performing the determination using the first predetermined value in the suction height position detection processing of the first embodiment. However, The suction height position may be determined only by the determination using the third predetermined value without performing the determination using the second predetermined value in the suction height position detection processing of the second embodiment.

While the embodiments have been described in detail above, they are merely illustrative and do not limit the scope of the claims. The techniques described in the claims include various modifications and variations of the embodiments described above.

One… Surface seal
10 ... Expectation
20 ... Conveying conveyor (substrate conveying device)
30 ... Component mounting device
32 ... Head unit
38X ... X axis servo motor
38Y ... Y axis servo motor
38Z ... Z axis Servo motor (Up and down part)
38R ... R axis servo motor
40 ... Feeder type feeder (parts feeder)
42 ... Feeder
52 ... Mounting head
54 ... The adsorption nozzle (adsorption section)
56 ... By suction
60 ... Pressure sensor (measuring part)
62 ... valve
64 ... The negative-
70 ... The control unit
73 ... The storage unit
76 ... The observation processing section
77 ... The decision-
79 ... Input
360 ... Flow sensor (measuring part)
C1 ... Substrate recognition camera
C2 ... Part-recognition camera
D1 to D5, D31 to D35 ... Differential waveform
DS1 to DS5 ... (Between the electronic component and the suction nozzle)
E1 ... Electronic parts
P1 ... Printed board
PK 21 to 23, PK 41 to 43, PK 51 to 53 ... The second peak
T1 to T5, T11 to T15, T21 to T23, T31 to T35, T41 to T45, T51 to T53, Elapsed time
TH1, TH2, TH3, TH4 ... Threshold
W0, W30 ... Reference waveform
W1 to W5, W31 to W35 ... Typical waveform
W20, L50 ... Approximate function

Claims (20)

And a suction unit for sucking the component by suctioning the component from the upper side by a negative pressure, wherein the component sucked by the suction unit is mounted on a substrate,
A measurement unit for measuring a magnitude of the negative pressure in the adsorption unit;
And a control unit for controlling the adsorption unit and the measurement unit,
The control unit performs an observation process of observing a time change in the magnitude of the negative pressure measured by the measurement unit during the time from when the component is sucked by the adsorption unit to when the suction is terminated after the component starts to be sucked A determination process of determining an adsorption height position when the component is adsorbed by the adsorption section in order to mount the component on the substrate based on a temporal change in the magnitude of the negative pressure observed by the observation processing section; And a determination processing unit
Wherein the observation processing section changes the distance between the component and the adsorption section when the suction of the component starts, and executes the observation process a plurality of times. The method according to claim 1,
And a storage unit,
Wherein the observation processing unit terminates the suction after a lapse of a predetermined time from the start of the suction of the component by the suction unit in the observation process and changes the time variation of the magnitude of the negative pressure observed during the predetermined period of time as a waveform Remember,
Wherein the determination processing unit determines the suction height position based on a distance between the component corresponding to one of the plurality of waveforms stored in the storage unit and the suction unit in the determination process. 3. The method of claim 2,
Wherein the observation processing unit executes the observation process in a single observation process performed a plurality of times as a distance such that the component is not adsorbed to the adsorption unit during the predetermined time, And in the other observation observation process, the waveform is stored in the storage section as a normal waveform,
The determination processing unit, in the determination processing,
Read processing for reading the reference waveform and the normal waveform from the storage section,
A differential waveform calculating process for calculating a waveform having a difference from the reference waveform with respect to the normal waveform as a differential waveform;
An elapsed time calculating process for calculating the elapsed time from the start of the suction for the differential waveform until the difference in magnitude of the negative pressure becomes a predetermined threshold value,
And the suction height position is determined based on a distance between the part corresponding to the differential waveform calculated by the elapsed time and the suction part. The method of claim 3,
The determination processing unit, in the determination processing,
Calculating a difference between the elapsed times of two adjacent differential waveforms when a plurality of the differential waveforms are overlapped,
The absorption height position is determined on the basis of the distance between the part corresponding to one of the differential waveforms having the elapsed time and the suction part, out of the two differential waveforms in which the difference between the elapsed times is equal to or less than the first predetermined value Component mounting device. 3. The method of claim 2,
The determination processing unit, in the determination processing,
A reading process of reading a plurality of the waveforms from the storage unit,
A differential waveform calculating process for calculating a differential waveform that is differentiated from the waveform,
An elapsed time calculating process for calculating the elapsed time from the start of the suction to the point of occurrence of the second peak of the negative pressure with respect to the differential waveform,
And the suction height position is determined based on a distance between the part corresponding to the differential waveform calculated in the elapsed time and the suction part. 6. The method of claim 5,
The determination processing unit, in the determination processing,
Calculating a difference between the elapsed times of the two differentiated waveforms whose elapsed times are close to each other when a plurality of the differentiated waveforms are overlapped,
The adsorption height position is determined on the basis of the distance between the part corresponding to one differential waveform having the elapsed time of the two differentiated waveforms whose difference in elapsed time is equal to or less than the second predetermined value and the adsorption section Component mounting device. 5. The method of claim 4,
Wherein the determination processing unit determines the attraction height position when the elapsed time with respect to the one differential waveform is equal to or less than a third predetermined value in the determination processing. The method according to claim 6,
Wherein the determination processing unit determines the attraction height position when the elapsed time with respect to the one differentiated waveform is equal to or less than a third predetermined value in the determination process. The method according to claim 4 or 6,
Wherein the observation processing section executes the observation processing a plurality of times by changing the distance between the component and the adsorption section at equal intervals. 3. The method of claim 2,
The determination processing unit, in the determination processing,
A reading process of reading a plurality of the waveforms from the storage unit,
A differential waveform calculating process for calculating a differential waveform that is differentiated from the waveform,
An elapsed time calculating process of calculating an elapsed time from the start of the suction to the point of time when a second peak occurs with respect to the magnitude of the negative pressure with respect to the differential waveform,
A function calculating process for calculating an approximate function from the elapsed time and a distance between the part and the adsorption unit corresponding to the differential waveform that has been calculated,
Wherein the attraction height position is determined based on a distance between the part and the suction part when the elapsed time becomes a predetermined threshold value in the approximate function. 11. The method according to any one of claims 1 to 6 and 10,
And an input unit for receiving input from the outside,
Wherein the observation processing unit and the determination processing unit execute the observation processing and the determination processing by accepting the input of the input unit. 11. The method according to any one of claims 1 to 6 and 10,
And a lifting portion for lifting the adsorption portion up and down,
Wherein the observation processing section executes the observation processing a plurality of times by changing the height of the adsorption section when the suction of the component is started by controlling the elevation section. A component mounting apparatus according to any one of claims 1 to 6 and 10,
A component supply device for supplying the component to the component mounting apparatus,
And a substrate transfer device for transferring the substrate in a transfer direction. And a measuring unit for measuring the magnitude of the negative pressure in the adsorption unit, wherein the component adsorbed by the adsorption unit is mounted on a substrate A method for determining an attraction height position for determining a position of an attraction height when the component is attracted by the attraction section to mount the component on the substrate,
An observing step of observing a time change in the magnitude of the negative pressure measured by the measuring unit during a period from sucking the component from the adsorption unit to starting suction of the component from the start of the suction,
And a determining step of determining the position of the adsorption height,
In the observation step, the observation of the time variation of the magnitude of the negative pressure is performed a plurality of times by changing the distance between the component and the adsorption unit when the suction of the component is started,
Wherein the adsorption height position is determined based on a temporal change in the magnitude of the negative pressure observed in the observing step. 9. The method according to claim 7 or 8,
And an input unit for receiving input from the outside,
Wherein the observation processing unit and the determination processing unit execute the observation processing and the determination processing by accepting the input of the input unit. 10. The method of claim 9,
And an input unit for receiving input from the outside,
Wherein the observation processing unit and the determination processing unit execute the observation processing and the determination processing by accepting the input of the input unit. 9. The method according to claim 7 or 8,
And a lifting portion for lifting the adsorption portion up and down,
Wherein the observation processing section executes the observation processing a plurality of times by changing the height of the adsorption section when the suction of the component is started by controlling the elevation section. 10. The method of claim 9,
And a lifting portion for lifting the adsorption portion up and down,
Wherein the observation processing section executes the observation processing a plurality of times by changing the height of the adsorption section when the suction of the component is started by controlling the elevation section. A component mounting apparatus according to claim 7 or 8,
A component supply device for supplying the component to the component mounting apparatus,
And a substrate transfer device for transferring the substrate in a transfer direction. A component mounting apparatus according to claim 9,
A component supply device for supplying the component to the component mounting apparatus,
And a substrate transfer device for transferring the substrate in a transfer direction.

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