KR101841775B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

Info

Publication number
KR101841775B1
KR101841775B1 KR1020120070460A KR20120070460A KR101841775B1 KR 101841775 B1 KR101841775 B1 KR 101841775B1 KR 1020120070460 A KR1020120070460 A KR 1020120070460A KR 20120070460 A KR20120070460 A KR 20120070460A KR 101841775 B1 KR101841775 B1 KR 101841775B1
Authority
KR
South Korea
Prior art keywords
temperature
substrate
adjusting
regulating
detecting
Prior art date
Application number
KR1020120070460A
Other languages
English (en)
Korean (ko)
Other versions
KR20130007476A (ko
Inventor
신이찌 하야시
고오조오 가나가와
스구루 에노끼다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20130007476A publication Critical patent/KR20130007476A/ko
Application granted granted Critical
Publication of KR101841775B1 publication Critical patent/KR101841775B1/ko

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020120070460A 2011-07-01 2012-06-29 기판 처리 장치 및 기판 처리 방법 KR101841775B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-147601 2011-07-01
JP2011147601A JP5708310B2 (ja) 2011-07-01 2011-07-01 基板処理装置

Publications (2)

Publication Number Publication Date
KR20130007476A KR20130007476A (ko) 2013-01-18
KR101841775B1 true KR101841775B1 (ko) 2018-03-23

Family

ID=47688994

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120070460A KR101841775B1 (ko) 2011-07-01 2012-06-29 기판 처리 장치 및 기판 처리 방법

Country Status (2)

Country Link
JP (1) JP5708310B2 (ja)
KR (1) KR101841775B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6442339B2 (ja) 2015-03-26 2018-12-19 株式会社Screenホールディングス 熱処理装置および熱処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118557A (ja) * 2008-11-13 2010-05-27 Canon Inc 露光装置、基板処理装置、リソグラフィーシステムおよびデバイス製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143440A (ja) * 1988-11-24 1990-06-01 Fuji Electric Co Ltd 半導体ウエハ処理装置のウエハチャック
JP2816756B2 (ja) * 1990-08-10 1998-10-27 東京エレクトロン株式会社 レジスト処理装置
JPH0689840A (ja) * 1992-09-09 1994-03-29 Nikon Corp 露光装置
JPH07142549A (ja) * 1993-11-22 1995-06-02 Hitachi Ltd 半導体製造装置
JPH10116772A (ja) * 1996-10-14 1998-05-06 Fujitsu Ltd 露光装置及び露光方法
JP2000208404A (ja) * 1999-01-18 2000-07-28 Canon Inc 露光装置およびデバイス製造方法
JP2005175187A (ja) * 2003-12-11 2005-06-30 Canon Inc 光学部材、冷却方法、冷却装置、露光装置、デバイス製造方法、及びデバイス
JP2006295146A (ja) * 2005-03-18 2006-10-26 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
JP2006344986A (ja) * 2006-07-18 2006-12-21 Tokyo Electron Ltd 塗布、現像装置及びパターン形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118557A (ja) * 2008-11-13 2010-05-27 Canon Inc 露光装置、基板処理装置、リソグラフィーシステムおよびデバイス製造方法

Also Published As

Publication number Publication date
JP5708310B2 (ja) 2015-04-30
JP2013016595A (ja) 2013-01-24
KR20130007476A (ko) 2013-01-18

Similar Documents

Publication Publication Date Title
KR101021396B1 (ko) 기판 열처리장치
US9508573B2 (en) Substrate processing apparatus and substrate processing method
JP4444154B2 (ja) 基板処理装置
JP4614455B2 (ja) 基板搬送処理装置
JP6553611B2 (ja) 半導体ウェハ処理方法および装置
JP4781832B2 (ja) 基板処理システム、基板処理装置、プログラム及び記録媒体
US20200110343A1 (en) Coating and developing apparatus and coating and developing method
KR101054196B1 (ko) 도포 처리 방법 및 도포 처리 장치와, 컴퓨터 판독 가능한 기록 매체
KR20150125593A (ko) 기판 처리 장치 및 기판 처리 방법
JP4687682B2 (ja) 塗布、現像装置及びその方法並びに記憶媒体
JP4765750B2 (ja) 熱処理装置、熱処理方法、記憶媒体
JP5003523B2 (ja) 熱処理装置、熱処理方法、塗布、現像装置及び記憶媒体
JP4129215B2 (ja) 基板処理装置
KR101841775B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2009032898A (ja) 回転式基板処理装置
JP2005093920A (ja) 基板処理装置
JP4722684B2 (ja) 基板処理装置
JP4202220B2 (ja) 検査装置、基板処理装置および基板処理方法
JP5270108B2 (ja) 基板処理装置
JP4255791B2 (ja) 基板処理装置
JP2001168004A (ja) 基板処理装置
JP4722231B2 (ja) 基板処理装置
JP2005093769A (ja) 基板処理装置および気圧調節方法
JP4558293B2 (ja) 基板処理装置
JP4323905B2 (ja) 基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant