KR101837226B1 - 기판으로부터 질화물을 선택적으로 제거하는 방법 - Google Patents

기판으로부터 질화물을 선택적으로 제거하는 방법 Download PDF

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Publication number
KR101837226B1
KR101837226B1 KR1020137015044A KR20137015044A KR101837226B1 KR 101837226 B1 KR101837226 B1 KR 101837226B1 KR 1020137015044 A KR1020137015044 A KR 1020137015044A KR 20137015044 A KR20137015044 A KR 20137015044A KR 101837226 B1 KR101837226 B1 KR 101837226B1
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South Korea
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acid
mixed
sulfuric acid
liquid stream
substrate
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Korean (ko)
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KR20140063498A (ko
Inventor
안토니 에스 랏코비히
제프리 더블류 버터보프
데이빗 에스 베커
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티이엘 에프에스아이, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020137015044A 2010-12-10 2011-12-06 기판으로부터 질화물을 선택적으로 제거하는 방법 Expired - Fee Related KR101837226B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42180810P 2010-12-10 2010-12-10
US61/421,808 2010-12-10
PCT/US2011/063441 WO2012078580A1 (en) 2010-12-10 2011-12-06 Process for selectively removing nitride from substrates

Publications (2)

Publication Number Publication Date
KR20140063498A KR20140063498A (ko) 2014-05-27
KR101837226B1 true KR101837226B1 (ko) 2018-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015044A Expired - Fee Related KR101837226B1 (ko) 2010-12-10 2011-12-06 기판으로부터 질화물을 선택적으로 제거하는 방법

Country Status (6)

Country Link
US (1) US9059104B2 (enExample)
JP (1) JP6236320B2 (enExample)
KR (1) KR101837226B1 (enExample)
CN (2) CN110189995A (enExample)
TW (1) TWI528432B (enExample)
WO (1) WO2012078580A1 (enExample)

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JP2012074601A (ja) * 2010-09-29 2012-04-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US9257292B2 (en) * 2011-03-30 2016-02-09 Tokyo Electron Limited Etch system and method for single substrate processing
US20120248061A1 (en) * 2011-03-30 2012-10-04 Tokyo Electron Limited Increasing masking layer etch rate and selectivity
US9355874B2 (en) * 2011-09-24 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Silicon nitride etching in a single wafer apparatus
JP5854230B2 (ja) * 2012-12-13 2016-02-09 栗田工業株式会社 基板洗浄液および基板洗浄方法
US9017568B2 (en) 2013-01-22 2015-04-28 Tel Fsi, Inc. Process for increasing the hydrophilicity of silicon surfaces following HF treatment
US8871108B2 (en) * 2013-01-22 2014-10-28 Tel Fsi, Inc. Process for removing carbon material from substrates
JP6352385B2 (ja) * 2013-03-15 2018-07-04 ティーイーエル エフエスアイ，インコーポレイティド 加熱されたエッチング溶液を供する処理システム及び方法
CN105121040B (zh) * 2013-05-08 2018-04-10 东京毅力科创Fsi公司 用于雾度消除和残留物去除的包括水蒸气的方法
JP6225067B2 (ja) * 2013-06-21 2017-11-01 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
US10269591B2 (en) * 2013-10-23 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of selectively removing silicon nitride and single wafer etching apparatus thereof
TWI578396B (zh) * 2013-12-11 2017-04-11 斯克林集團公司 基板處理方法及基板處理裝置
JP6434367B2 (ja) * 2015-05-14 2018-12-05 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
TWI629720B (zh) * 2015-09-30 2018-07-11 東京威力科創股份有限公司 用於濕蝕刻製程之溫度的動態控制之方法及設備
GB201815163D0 (en) * 2018-09-18 2018-10-31 Lam Res Ag Wafer washing method and apparatus
JP7209556B2 (ja) * 2019-02-05 2023-01-20 東京エレクトロン株式会社 基板処理方法および基板処理装置
CN111829941A (zh) * 2020-05-27 2020-10-27 盐城工学院 一种用于检测氧化镓单晶加工表面损伤层的腐蚀液及检测方法
JP7779723B2 (ja) * 2021-12-17 2025-12-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US20230365863A1 (en) * 2022-05-13 2023-11-16 Entegris, Inc. Silicon nitride etching compositions and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087273A (en) 1997-01-22 2000-07-11 Micron Technology, Inc. Process for selectively etching silicon nitride in the presence of silicon oxide
JP2006278954A (ja) 2005-03-30 2006-10-12 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008028365A (ja) 2006-06-22 2008-02-07 Riverbell Kk 処理装置及び処理方法
US20080283090A1 (en) * 2007-05-18 2008-11-20 Dekraker David Process for treatment of substrates with water vapor or steam

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TW380284B (en) * 1998-09-09 2000-01-21 Promos Technologies Inc Method for improving etching uniformity during a wet etching process
US6406551B1 (en) 1999-05-14 2002-06-18 Fsi International, Inc. Method for treating a substrate with heat sensitive agents
US6488272B1 (en) 2000-06-07 2002-12-03 Simplus Systems Corporation Liquid delivery system emulsifier
US6835667B2 (en) 2002-06-14 2004-12-28 Fsi International, Inc. Method for etching high-k films in solutions comprising dilute fluoride species
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
CN1914710A (zh) * 2003-12-30 2007-02-14 艾奎昂有限责任公司 在基片处理过程中选择性蚀刻氮化硅的系统和方法
JP4439956B2 (ja) 2004-03-16 2010-03-24 ソニー株式会社 レジスト剥離方法およびレジスト剥離装置
KR100993311B1 (ko) 2005-04-01 2010-11-09 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체로 마이크로일렉트로닉 작업물을 처리하는 장치용 이동 및 중첩 가능한 배플들을 포함하는 소형 덕트 시스템
JP4986566B2 (ja) * 2005-10-14 2012-07-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP4728402B2 (ja) 2005-11-23 2011-07-20 エフエスアイ インターナショナル インコーポレーテッド 支持体から物質を除去する方法
CN101484974B (zh) 2006-07-07 2013-11-06 Fsi国际公司 用于处理微电子工件的设备和方法以及遮挡结构
JP4799332B2 (ja) * 2006-09-12 2011-10-26 株式会社東芝 エッチング液、エッチング方法および電子部品の製造方法
CN102683249B (zh) 2008-05-09 2015-06-17 泰尔Fsi公司 用于处理微电子工件的系统
US9355874B2 (en) 2011-09-24 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Silicon nitride etching in a single wafer apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087273A (en) 1997-01-22 2000-07-11 Micron Technology, Inc. Process for selectively etching silicon nitride in the presence of silicon oxide
JP2006278954A (ja) 2005-03-30 2006-10-12 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008028365A (ja) 2006-06-22 2008-02-07 Riverbell Kk 処理装置及び処理方法
US20080283090A1 (en) * 2007-05-18 2008-11-20 Dekraker David Process for treatment of substrates with water vapor or steam

Also Published As

Publication number Publication date
US9059104B2 (en) 2015-06-16
TW201246334A (en) 2012-11-16
CN110189995A (zh) 2019-08-30
TWI528432B (zh) 2016-04-01
JP2013545319A (ja) 2013-12-19
US20120145672A1 (en) 2012-06-14
JP6236320B2 (ja) 2017-11-22
CN103348452A (zh) 2013-10-09
WO2012078580A1 (en) 2012-06-14
KR20140063498A (ko) 2014-05-27

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