KR101827579B1 - 기판 처리 장치 및 처리액 공급방법 - Google Patents
기판 처리 장치 및 처리액 공급방법 Download PDFInfo
- Publication number
- KR101827579B1 KR101827579B1 KR1020120021100A KR20120021100A KR101827579B1 KR 101827579 B1 KR101827579 B1 KR 101827579B1 KR 1020120021100 A KR1020120021100 A KR 1020120021100A KR 20120021100 A KR20120021100 A KR 20120021100A KR 101827579 B1 KR101827579 B1 KR 101827579B1
- Authority
- KR
- South Korea
- Prior art keywords
- valve
- nozzle
- processing
- priming
- pump
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
- B05C5/0237—Fluid actuated valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0245—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to a moving work of indefinite length, e.g. to a moving web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011055738A JP5269130B2 (ja) | 2011-03-14 | 2011-03-14 | 基板処理装置及び処理液供給方法 |
JPJP-P-2011-055738 | 2011-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120104935A KR20120104935A (ko) | 2012-09-24 |
KR101827579B1 true KR101827579B1 (ko) | 2018-03-22 |
Family
ID=47083943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120021100A KR101827579B1 (ko) | 2011-03-14 | 2012-02-29 | 기판 처리 장치 및 처리액 공급방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5269130B2 (ja) |
KR (1) | KR101827579B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6512894B2 (ja) * | 2015-03-27 | 2019-05-15 | 株式会社Screenホールディングス | 処理液供給装置および処理液供給装置の制御方法 |
JP6576217B2 (ja) * | 2015-11-10 | 2019-09-18 | 株式会社Screenホールディングス | 処理液供給装置および処理液供給装置の制御方法 |
CN111687003B (zh) * | 2020-06-29 | 2021-09-14 | 上海德沪涂膜设备有限公司 | 高粘度材料的涂膜装置和涂膜方法 |
CN112427236A (zh) * | 2020-11-13 | 2021-03-02 | 上海卫星装备研究所 | 适用于航天器柔性加热器的均匀涂胶设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003185053A (ja) | 2001-12-18 | 2003-07-03 | Dainippon Screen Mfg Co Ltd | ダイヤフラムバルブ、基板処理ユニットおよび基板処理装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3483461B2 (ja) * | 1997-04-01 | 2004-01-06 | 宮崎沖電気株式会社 | レジスト吐出システムとレジスト吐出方法 |
JP4422006B2 (ja) * | 2004-12-08 | 2010-02-24 | 東京エレクトロン株式会社 | 処理装置及び処理液供給方法及び処理液供給プログラム |
JP4578381B2 (ja) * | 2005-10-19 | 2010-11-10 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP4516034B2 (ja) * | 2006-02-03 | 2010-08-04 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置及び塗布処理プログラム |
JP2008038837A (ja) * | 2006-08-09 | 2008-02-21 | Saginomiya Seisakusho Inc | 定量送液ポンプおよびそれを用いた薬液塗布装置 |
JP4701257B2 (ja) * | 2008-03-03 | 2011-06-15 | 日本ピラー工業株式会社 | 液体ポンプシステム |
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2011
- 2011-03-14 JP JP2011055738A patent/JP5269130B2/ja active Active
-
2012
- 2012-02-29 KR KR1020120021100A patent/KR101827579B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003185053A (ja) | 2001-12-18 | 2003-07-03 | Dainippon Screen Mfg Co Ltd | ダイヤフラムバルブ、基板処理ユニットおよび基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2012191141A (ja) | 2012-10-04 |
JP5269130B2 (ja) | 2013-08-21 |
KR20120104935A (ko) | 2012-09-24 |
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