KR101824945B1 - 적층체, 유기 반도체 제조용 키트 및 유기 반도체 제조용 레지스트 조성물 - Google Patents

적층체, 유기 반도체 제조용 키트 및 유기 반도체 제조용 레지스트 조성물 Download PDF

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KR101824945B1
KR101824945B1 KR1020167011112A KR20167011112A KR101824945B1 KR 101824945 B1 KR101824945 B1 KR 101824945B1 KR 1020167011112 A KR1020167011112 A KR 1020167011112A KR 20167011112 A KR20167011112 A KR 20167011112A KR 101824945 B1 KR101824945 B1 KR 101824945B1
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South Korea
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group
organic semiconductor
compound
film
protective film
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KR1020167011112A
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English (en)
Korean (ko)
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KR20160062121A (ko
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유 이와이
이치로 코야마
요시타카 카모치
카즈요시 미즈타니
마사후미 요시다
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후지필름 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G03F7/0085—Azides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
    • G03F7/0125—Macromolecular azides; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/0166—Diazonium salts or compounds characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
KR1020167011112A 2013-10-31 2014-10-29 적층체, 유기 반도체 제조용 키트 및 유기 반도체 제조용 레지스트 조성물 KR101824945B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-227039 2013-10-31
JP2013227039A JP6167018B2 (ja) 2013-10-31 2013-10-31 積層体、有機半導体製造用キットおよび有機半導体製造用レジスト組成物
PCT/JP2014/078700 WO2015064604A1 (ja) 2013-10-31 2014-10-29 積層体、有機半導体製造用キットおよび有機半導体製造用レジスト組成物

Publications (2)

Publication Number Publication Date
KR20160062121A KR20160062121A (ko) 2016-06-01
KR101824945B1 true KR101824945B1 (ko) 2018-02-02

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KR1020167011112A KR101824945B1 (ko) 2013-10-31 2014-10-29 적층체, 유기 반도체 제조용 키트 및 유기 반도체 제조용 레지스트 조성물

Country Status (4)

Country Link
JP (1) JP6167018B2 (ja)
KR (1) KR101824945B1 (ja)
TW (1) TWI626510B (ja)
WO (1) WO2015064604A1 (ja)

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WO2016208300A1 (ja) * 2015-06-24 2016-12-29 富士フイルム株式会社 パターン形成方法、積層体、及び、有機溶剤現像用レジスト組成物
WO2017002859A1 (ja) * 2015-06-30 2017-01-05 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
WO2017030050A1 (ja) * 2015-08-19 2017-02-23 株式会社ニコン 配線パターンの製造方法、導電膜の製造方法、及びトランジスタの製造方法
TWI634135B (zh) 2015-12-25 2018-09-01 日商富士軟片股份有限公司 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件
JP6667361B2 (ja) * 2016-05-06 2020-03-18 東京応化工業株式会社 化学増幅型ポジ型感光性樹脂組成物
TWI830588B (zh) 2016-08-01 2024-01-21 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、積層體的製造方法及半導體元件
TWI764929B (zh) * 2016-09-27 2022-05-21 德商巴地斯顏料化工廠 具有經增強的可交聯性之星形及三嵌段聚合物
CN110692018B (zh) 2017-05-31 2023-11-03 富士胶片株式会社 感光性树脂组合物、聚合物前体、固化膜、层叠体、固化膜的制造方法及半导体器件
KR102385654B1 (ko) * 2017-11-28 2022-04-12 동우 화인켐 주식회사 색변환층 형성용 감광성 수지 조성물, 이를 이용한 색변환층을 포함하는 컬러필터 및 화상표시장치
WO2019215848A1 (ja) * 2018-05-09 2019-11-14 日立化成株式会社 感光性エレメント、バリア層形成用樹脂組成物、レジストパターンの形成方法及びプリント配線板の製造方法
EP3859447A4 (en) 2018-09-28 2021-11-17 FUJIFILM Corporation LIGHT SENSITIVE RESIN COMPOSITION, HARDENED FILM, LAMINATE, METHOD FOR MANUFACTURING THE HARDENED FILM AND SEMICONDUCTIVE COMPONENT
EP3893053A4 (en) 2018-12-05 2022-02-23 FUJIFILM Corporation PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE
WO2020116238A1 (ja) 2018-12-05 2020-06-11 富士フイルム株式会社 パターン形成方法、感光性樹脂組成物、硬化膜、積層体、及び、デバイス
EP3940018A4 (en) 2019-03-15 2022-05-18 FUJIFILM Corporation CURING RESIN COMPOSITION, CURED FILM, LAMINATED BODY, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE AND POLYMER PRECURSOR
KR20210128463A (ko) * 2019-03-22 2021-10-26 후지필름 가부시키가이샤 적층체, 조성물, 및, 적층체 형성용 키트
JP7367053B2 (ja) 2019-11-21 2023-10-23 富士フイルム株式会社 パターン形成方法、光硬化性樹脂組成物、積層体の製造方法、及び、電子デバイスの製造方法
CN111204882A (zh) * 2020-01-21 2020-05-29 福建农林大学 一种有机质类化合物驱动的水体脱氮的方法
TW202248755A (zh) 2021-03-22 2022-12-16 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化物、積層體、硬化物的製造方法以及半導體元件
CN113429695B (zh) * 2021-06-09 2022-10-25 华南理工大学 一种偏光膜保护膜及其制备方法和应用
WO2023032545A1 (ja) 2021-08-31 2023-03-09 富士フイルム株式会社 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液
KR20240111777A (ko) 2021-12-23 2024-07-17 후지필름 가부시키가이샤 접합체의 제조 방법, 접합체, 적층체의 제조 방법, 적층체, 디바이스의 제조 방법, 및, 디바이스, 및, 폴리이미드 함유 전구체부 형성용 조성물
WO2023162687A1 (ja) 2022-02-24 2023-08-31 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス
WO2023190064A1 (ja) 2022-03-29 2023-10-05 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

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Publication number Publication date
WO2015064604A1 (ja) 2015-05-07
KR20160062121A (ko) 2016-06-01
TW201523152A (zh) 2015-06-16
TWI626510B (zh) 2018-06-11
JP6167018B2 (ja) 2017-07-19
JP2015087611A (ja) 2015-05-07

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