KR101818413B1 - 반응성 실리콘 조성물, 반응성 열가소성 용품, 경화 산물, 및 광학 반도체 디바이스 - Google Patents

반응성 실리콘 조성물, 반응성 열가소성 용품, 경화 산물, 및 광학 반도체 디바이스 Download PDF

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KR101818413B1
KR101818413B1 KR1020157002117A KR20157002117A KR101818413B1 KR 101818413 B1 KR101818413 B1 KR 101818413B1 KR 1020157002117 A KR1020157002117 A KR 1020157002117A KR 20157002117 A KR20157002117 A KR 20157002117A KR 101818413 B1 KR101818413 B1 KR 101818413B1
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료스케 야마자키
하루나 야마자키
마코토 요시타케
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
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    • C—CHEMISTRY; METALLURGY
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • H10H20/80—Constructional details
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    • H10H20/855—Optical field-shaping means, e.g. lenses
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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KR1020157002117A 2012-06-29 2013-06-18 반응성 실리콘 조성물, 반응성 열가소성 용품, 경화 산물, 및 광학 반도체 디바이스 Active KR101818413B1 (ko)

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JPJP-P-2012-148037 2012-06-29
JP2012148037A JP6046395B2 (ja) 2012-06-29 2012-06-29 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
PCT/JP2013/067163 WO2014002918A1 (en) 2012-06-29 2013-06-18 Reactive silicone composition, reactive thermoplastic article, cured product, and optical semiconductor device

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KR20150024429A KR20150024429A (ko) 2015-03-06
KR101818413B1 true KR101818413B1 (ko) 2018-01-17

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US (1) US20150183960A1 (enExample)
EP (1) EP2867302A1 (enExample)
JP (1) JP6046395B2 (enExample)
KR (1) KR101818413B1 (enExample)
CN (1) CN104379673A (enExample)
TW (1) TW201404832A (enExample)
WO (1) WO2014002918A1 (enExample)

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US9853193B2 (en) * 2014-06-04 2017-12-26 Dow Corning Corporation Imprinting process of hot-melt type curable silicone composition for optical devices
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JP5847918B1 (ja) * 2014-12-26 2016-01-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
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KR101980935B1 (ko) * 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
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JP6930817B2 (ja) 2016-08-08 2021-09-01 ダウ・東レ株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
US11136437B2 (en) 2016-08-08 2021-10-05 Dow Toray Co., Ltd. Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member
JP7100636B2 (ja) 2017-06-19 2022-07-13 ダウ・東レ株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
EP3699236A4 (en) 2017-10-20 2021-07-14 Dow Toray Co., Ltd. CURED GRANULAR SILICONE COMPOSITION, CURED PRODUCT MADE FROM IT AND MANUFACTURING METHOD FOR IT
TWI844552B (zh) 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
EP3875543A4 (en) 2018-10-30 2022-08-10 Dow Toray Co., Ltd. CURABLE REACTIVE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND USES OF COMPOSITION AND CURED PRODUCT
TWI844606B (zh) 2018-12-27 2024-06-11 日商陶氏東麗股份有限公司 具有熱熔性之固化性聚矽氧薄片之製造方法
CN113330071B (zh) 2018-12-27 2023-01-03 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
WO2020138410A1 (ja) 2018-12-27 2020-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
JP7509756B2 (ja) * 2019-03-29 2024-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
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JP7475135B2 (ja) 2019-12-25 2024-04-26 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性白色シリコーン組成物、光半導体装置用反射材、および光半導体装置
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KR20240053632A (ko) * 2021-10-06 2024-04-24 와커 헤미 아게 열전도성 실리콘 조성물 및 이를 생산하는 방법
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EP2867302A1 (en) 2015-05-06
JP6046395B2 (ja) 2016-12-14
CN104379673A (zh) 2015-02-25
JP2014009322A (ja) 2014-01-20
TW201404832A (zh) 2014-02-01
KR20150024429A (ko) 2015-03-06
WO2014002918A1 (en) 2014-01-03

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