CN104379673A - 反应性有机硅组合物、反应性热塑性制品、固化产物和光学半导体装置 - Google Patents

反应性有机硅组合物、反应性热塑性制品、固化产物和光学半导体装置 Download PDF

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Publication number
CN104379673A
CN104379673A CN201380032112.9A CN201380032112A CN104379673A CN 104379673 A CN104379673 A CN 104379673A CN 201380032112 A CN201380032112 A CN 201380032112A CN 104379673 A CN104379673 A CN 104379673A
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cured product
mass
sio
group
parts
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山崎亮介
山崎春菜
吉武诚
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
CN201380032112.9A 2012-06-29 2013-06-18 反应性有机硅组合物、反应性热塑性制品、固化产物和光学半导体装置 Pending CN104379673A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012148037A JP6046395B2 (ja) 2012-06-29 2012-06-29 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP2012-148037 2012-06-29
PCT/JP2013/067163 WO2014002918A1 (en) 2012-06-29 2013-06-18 Reactive silicone composition, reactive thermoplastic article, cured product, and optical semiconductor device

Publications (1)

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CN104379673A true CN104379673A (zh) 2015-02-25

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CN201380032112.9A Pending CN104379673A (zh) 2012-06-29 2013-06-18 反应性有机硅组合物、反应性热塑性制品、固化产物和光学半导体装置

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Country Link
US (1) US20150183960A1 (enExample)
EP (1) EP2867302A1 (enExample)
JP (1) JP6046395B2 (enExample)
KR (1) KR101818413B1 (enExample)
CN (1) CN104379673A (enExample)
TW (1) TW201404832A (enExample)
WO (1) WO2014002918A1 (enExample)

Cited By (6)

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CN109476920A (zh) * 2016-07-19 2019-03-15 株式会社大赛璐 固化性树脂组合物、其固化物、及半导体装置
CN109844029A (zh) * 2016-08-08 2019-06-04 道康宁东丽株式会社 固化性粒状有机硅组合物、由其构成的光反射材料、以及其制造方法
CN112601988A (zh) * 2018-09-10 2021-04-02 美国陶氏有机硅公司 用于制备光学有机硅组件的方法以及由其制备的光学有机硅组件
CN113025055A (zh) * 2019-12-25 2021-06-25 杜邦东丽特殊材料株式会社 固化性白色有机硅组合物、光半导体装置用反射材料以及光半导体装置
CN113631660A (zh) * 2019-03-29 2021-11-09 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
CN114144476A (zh) * 2019-07-24 2022-03-04 脸谱科技有限责任公司 通过暂时的抑制实现有机硅的部分固化结合

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KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
KR20170016889A (ko) * 2014-06-04 2017-02-14 다우 코닝 코포레이션 광학 디바이스를 위한 핫-멜트형 경화성 실리콘 조성물의 임프린팅 공정
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
WO2016038836A1 (ja) * 2014-09-10 2016-03-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6286395B2 (ja) * 2015-08-05 2018-02-28 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5847918B1 (ja) * 2014-12-26 2016-01-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TW201940615A (zh) * 2014-12-26 2019-10-16 日商太陽油墨製造股份有限公司 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板
KR101980935B1 (ko) * 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
JP6536414B2 (ja) * 2016-01-06 2019-07-03 信越化学工業株式会社 付加硬化型熱可塑性シリコーン組成物、熱可塑性シリコーン硬化物及びその製造方法
WO2018030288A1 (ja) 2016-08-08 2018-02-15 東レ・ダウコーニング株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
US11136437B2 (en) 2016-08-08 2021-10-05 Dow Toray Co., Ltd. Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member
US11555119B2 (en) 2017-06-19 2023-01-17 Dow Toray Co., Ltd. Curable granular silicone composition, semiconductor member comprising same, and forming method thereof
US11479668B2 (en) 2017-10-20 2022-10-25 Dow Toray Co., Ltd. Curable granular silicone composition, cured object obtained therefrom, and production method therefor
US12215226B2 (en) 2018-10-30 2025-02-04 Dow Toray Co., Ltd. Curable reactive silicone composition, cured product thereof and uses of composition and cured product
JP7513365B2 (ja) 2018-12-27 2024-07-09 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
US12173157B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
JP7644605B2 (ja) 2018-12-27 2025-03-12 ダウ・東レ株式会社 トランスファー成型用硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2020138408A1 (ja) 2018-12-27 2020-07-02 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
EP3954739A4 (en) 2019-03-29 2022-12-28 Dow Toray Co., Ltd. CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND METHOD OF MAKING THEREOF
US12480027B2 (en) 2019-03-29 2025-11-25 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
KR20210148205A (ko) 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
WO2021132710A1 (ja) 2019-12-27 2021-07-01 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
JP2021161400A (ja) 2020-03-30 2021-10-11 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
KR20230122648A (ko) 2020-12-25 2023-08-22 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 적층체
WO2022138335A1 (ja) 2020-12-25 2022-06-30 ダウ・東レ株式会社 積層体の製造方法
WO2023017746A1 (ja) 2021-08-12 2023-02-16 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法
WO2023057347A1 (en) * 2021-10-06 2023-04-13 Wacker Chemie Ag Thermally conductive silicone composition and method for producing the same
TW202334318A (zh) * 2022-02-24 2023-09-01 美商陶氏有機矽公司 可固化聚矽氧組成物
WO2023164018A1 (en) * 2022-02-24 2023-08-31 Dow Silicones Corporation Curable silicone composition and cured product thereof

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109476920A (zh) * 2016-07-19 2019-03-15 株式会社大赛璐 固化性树脂组合物、其固化物、及半导体装置
CN109476920B (zh) * 2016-07-19 2022-04-12 日亚化学工业株式会社 固化性树脂组合物、其固化物、及半导体装置
CN109844029A (zh) * 2016-08-08 2019-06-04 道康宁东丽株式会社 固化性粒状有机硅组合物、由其构成的光反射材料、以及其制造方法
CN112601988A (zh) * 2018-09-10 2021-04-02 美国陶氏有机硅公司 用于制备光学有机硅组件的方法以及由其制备的光学有机硅组件
US12043771B2 (en) 2018-09-10 2024-07-23 Dow Silicones Corporation Method for producing optical silicone assembly, and optical silicone assembly produced thereby
CN113631660A (zh) * 2019-03-29 2021-11-09 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
CN114144476A (zh) * 2019-07-24 2022-03-04 脸谱科技有限责任公司 通过暂时的抑制实现有机硅的部分固化结合
US11780966B2 (en) 2019-07-24 2023-10-10 Meta Platforms Technologies, Llc Partial-cure bonding of silicones through temporary inhibition
CN113025055A (zh) * 2019-12-25 2021-06-25 杜邦东丽特殊材料株式会社 固化性白色有机硅组合物、光半导体装置用反射材料以及光半导体装置
CN113025055B (zh) * 2019-12-25 2024-01-23 杜邦东丽特殊材料株式会社 固化性白色有机硅组合物、光半导体装置用反射材料以及光半导体装置

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TW201404832A (zh) 2014-02-01
WO2014002918A1 (en) 2014-01-03
EP2867302A1 (en) 2015-05-06
KR101818413B1 (ko) 2018-01-17
JP2014009322A (ja) 2014-01-20
KR20150024429A (ko) 2015-03-06
US20150183960A1 (en) 2015-07-02
JP6046395B2 (ja) 2016-12-14

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