KR101814270B1 - 본딩 장치 및 본딩 방법 - Google Patents

본딩 장치 및 본딩 방법 Download PDF

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KR101814270B1
KR101814270B1 KR1020160024615A KR20160024615A KR101814270B1 KR 101814270 B1 KR101814270 B1 KR 101814270B1 KR 1020160024615 A KR1020160024615 A KR 1020160024615A KR 20160024615 A KR20160024615 A KR 20160024615A KR 101814270 B1 KR101814270 B1 KR 101814270B1
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South Korea
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die
reference mark
image
imaging
pick
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KR20160118925A (ko
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게이따 야마모또
유끼오 다니
히로시 마끼
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파스포드 테크놀로지 주식회사
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H01L21/52—
    • H01L21/67712—
    • H01L21/681—
    • H01L22/12—
    • H01L23/488—
    • H01L23/544—
    • H01L24/02—
    • H01L24/26—
    • H01L24/74—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
KR1020160024615A 2015-04-02 2016-02-29 본딩 장치 및 본딩 방법 Active KR101814270B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015076049A JP6470088B2 (ja) 2015-04-02 2015-04-02 ボンディング装置及びボンディング方法
JPJP-P-2015-076049 2015-04-02

Publications (2)

Publication Number Publication Date
KR20160118925A KR20160118925A (ko) 2016-10-12
KR101814270B1 true KR101814270B1 (ko) 2018-01-02

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KR1020160024615A Active KR101814270B1 (ko) 2015-04-02 2016-02-29 본딩 장치 및 본딩 방법

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JP (1) JP6470088B2 (enExample)
KR (1) KR101814270B1 (enExample)
CN (1) CN106057704B (enExample)
TW (1) TWI598967B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230039542A (ko) * 2021-09-14 2023-03-21 파스포드 테크놀로지 주식회사 실장 장치 및 반도체 장치의 제조 방법

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JP6316340B2 (ja) * 2016-06-02 2018-04-25 株式会社カイジョー ボンディング装置、ボンディング方法及びボンディング制御プログラム
JP6643197B2 (ja) * 2016-07-13 2020-02-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
JP6820189B2 (ja) * 2016-12-01 2021-01-27 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6818608B2 (ja) * 2017-03-28 2021-01-20 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP6868471B2 (ja) * 2017-05-31 2021-05-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI684235B (zh) * 2017-07-12 2020-02-01 日商新川股份有限公司 相對於第二物體來定位第一物體的裝置和方法
TWI782169B (zh) * 2018-01-23 2022-11-01 日商東京威力科創股份有限公司 接合系統及接合方法
JP7018341B2 (ja) 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
WO2020090957A1 (ja) 2018-11-01 2020-05-07 ヤマハモーターロボティクスホールディングス株式会社 電子部品実装装置
TWI744849B (zh) * 2019-04-15 2021-11-01 日商新川股份有限公司 接合裝置以及接合頭的移動量補正方法
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
CN112435955B (zh) * 2019-08-26 2024-04-16 合肥晶合集成电路股份有限公司 一种晶圆裂片的支撑装置及其固定方法
TWI727853B (zh) * 2020-07-15 2021-05-11 歆熾電氣技術股份有限公司 晶片移轉系統與晶片移轉方法
CN114388418B (zh) * 2021-12-28 2022-12-13 凌波微步半导体设备(常熟)有限公司 一种半导体焊线机的闭环位置补偿方法及系统
KR102914563B1 (ko) * 2021-12-30 2026-01-19 세메스 주식회사 다이 본딩 설비 및 다이 본딩 설비의 구동 편차 보정 방법
JP7292463B1 (ja) 2022-03-29 2023-06-16 キヤノンマシナリー株式会社 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法
JP2023150494A (ja) * 2022-03-31 2023-10-16 芝浦メカトロニクス株式会社 実装装置及び実装方法
CN117238834B (zh) * 2023-10-25 2024-08-02 天芯电子科技(江阴)有限公司 一种用于芯片质量检测的抓取设备
KR20250076287A (ko) * 2023-11-22 2025-05-29 한화세미텍 주식회사 픽앤플레이스 장치 및 픽앤플레이스 장치의 헤드 위치 확인 방법

Citations (2)

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JP2000252303A (ja) 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

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JP4232511B2 (ja) 2003-04-03 2009-03-04 日本電気株式会社 半導体製造装置
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
US7851346B2 (en) * 2008-07-21 2010-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding metallurgy for three-dimensional interconnect
JP5344145B2 (ja) * 2008-12-25 2013-11-20 澁谷工業株式会社 ボンディング装置における電子部品と基板の位置合わせ方法
CN102623299A (zh) * 2011-01-31 2012-08-01 洲磊科技股份有限公司 一种晶圆接合的晶粒制程方法
JP5989313B2 (ja) * 2011-09-15 2016-09-07 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6502846B2 (ja) * 2012-06-06 2019-04-17 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法
JP6166069B2 (ja) * 2013-03-15 2017-07-19 ファスフォードテクノロジ株式会社 ダイボンダ及びコレット位置調整方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230039542A (ko) * 2021-09-14 2023-03-21 파스포드 테크놀로지 주식회사 실장 장치 및 반도체 장치의 제조 방법
KR102808948B1 (ko) * 2021-09-14 2025-05-20 파스포드 테크놀로지 주식회사 실장 장치 및 반도체 장치의 제조 방법

Also Published As

Publication number Publication date
JP2016197630A (ja) 2016-11-24
KR20160118925A (ko) 2016-10-12
TW201642363A (zh) 2016-12-01
CN106057704A (zh) 2016-10-26
JP6470088B2 (ja) 2019-02-13
TWI598967B (zh) 2017-09-11
CN106057704B (zh) 2019-01-18

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