KR101811091B1 - 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스터 패턴의 형성 방법 및 도체 패턴의 형성 방법 - Google Patents

감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스터 패턴의 형성 방법 및 도체 패턴의 형성 방법 Download PDF

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Publication number
KR101811091B1
KR101811091B1 KR1020137026142A KR20137026142A KR101811091B1 KR 101811091 B1 KR101811091 B1 KR 101811091B1 KR 1020137026142 A KR1020137026142 A KR 1020137026142A KR 20137026142 A KR20137026142 A KR 20137026142A KR 101811091 B1 KR101811091 B1 KR 101811091B1
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KR
South Korea
Prior art keywords
photosensitive resin
resin composition
meth
group
acrylate
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KR1020137026142A
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English (en)
Korean (ko)
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KR20140010131A (ko
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히로키 토요타
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닛코-매터리얼즈 가부시키가이샤
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Publication of KR20140010131A publication Critical patent/KR20140010131A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020137026142A 2011-03-03 2012-02-27 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스터 패턴의 형성 방법 및 도체 패턴의 형성 방법 KR101811091B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011046373 2011-03-03
JPJP-P-2011-046373 2011-03-03
PCT/JP2012/054824 WO2012118031A1 (ja) 2011-03-03 2012-02-27 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及び導体パターンの形成方法

Publications (2)

Publication Number Publication Date
KR20140010131A KR20140010131A (ko) 2014-01-23
KR101811091B1 true KR101811091B1 (ko) 2017-12-20

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KR1020137026142A KR101811091B1 (ko) 2011-03-03 2012-02-27 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스터 패턴의 형성 방법 및 도체 패턴의 형성 방법

Country Status (5)

Country Link
JP (1) JP5878040B2 (ja)
KR (1) KR101811091B1 (ja)
CN (1) CN103430100B (ja)
TW (1) TWI608298B (ja)
WO (1) WO2012118031A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5990366B2 (ja) * 2011-03-31 2016-09-14 旭化成株式会社 積層体及びそれを用いたロール
JP5842077B1 (ja) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 キャリア付銅箔、銅張積層板及びプリント配線板
JP6567952B2 (ja) * 2015-10-26 2019-08-28 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
CN108628093A (zh) * 2017-03-23 2018-10-09 株式会社田村制作所 感光性树脂组合物
CN109388026A (zh) * 2017-08-11 2019-02-26 日兴材料株式会社 光致抗蚀膜、抗蚀图案的形成方法及导体图案的形成方法
WO2019088268A1 (ja) * 2017-11-06 2019-05-09 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011013486A (ja) * 2009-07-02 2011-01-20 Taiyo Holdings Co Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416660A1 (de) * 1993-05-14 1994-11-17 Du Pont Verfahren zum Abscheiden eines Metalls auf einem Substrat aus einem Galvanisierbad
US5741621A (en) * 1994-01-10 1998-04-21 E. I. Du Pont De Nemours And Company Process for using photoimageable films prepared for aqueous photoimageable liquid emulsions
DE69502741T2 (de) * 1994-01-10 1998-10-01 Du Pont Lichtempfindliche wässrige Emulsion, lichtempfindlicher Film und Verfahren zur Herstellung
US7078157B2 (en) * 2003-02-27 2006-07-18 Az Electronic Materials Usa Corp. Photosensitive composition and use thereof
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
JP4931533B2 (ja) * 2005-09-28 2012-05-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその積層体
JP4885243B2 (ja) * 2007-02-02 2012-02-29 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011013486A (ja) * 2009-07-02 2011-01-20 Taiyo Holdings Co Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
CN103430100A (zh) 2013-12-04
JP2012194552A (ja) 2012-10-11
WO2012118031A1 (ja) 2012-09-07
KR20140010131A (ko) 2014-01-23
JP5878040B2 (ja) 2016-03-08
TW201245870A (en) 2012-11-16
TWI608298B (zh) 2017-12-11
CN103430100B (zh) 2016-08-17

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