KR101769337B1 - 금속 분말 페이스트, 및 그 제조 방법 - Google Patents

금속 분말 페이스트, 및 그 제조 방법 Download PDF

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Publication number
KR101769337B1
KR101769337B1 KR1020147024611A KR20147024611A KR101769337B1 KR 101769337 B1 KR101769337 B1 KR 101769337B1 KR 1020147024611 A KR1020147024611 A KR 1020147024611A KR 20147024611 A KR20147024611 A KR 20147024611A KR 101769337 B1 KR101769337 B1 KR 101769337B1
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KR
South Korea
Prior art keywords
metal powder
acid
copper powder
paste
powder
Prior art date
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KR1020147024611A
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English (en)
Korean (ko)
Other versions
KR20140126731A (ko
Inventor
히데키 후루사와
Original Assignee
제이엑스금속주식회사
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Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20140126731A publication Critical patent/KR20140126731A/ko
Application granted granted Critical
Publication of KR101769337B1 publication Critical patent/KR101769337B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/15—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020147024611A 2012-02-21 2013-02-21 금속 분말 페이스트, 및 그 제조 방법 KR101769337B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012035634 2012-02-21
JPJP-P-2012-035634 2012-02-21
PCT/JP2013/054415 WO2013125659A1 (fr) 2012-02-21 2013-02-21 Pâte de poudre de métal et son procédé de production

Publications (2)

Publication Number Publication Date
KR20140126731A KR20140126731A (ko) 2014-10-31
KR101769337B1 true KR101769337B1 (ko) 2017-08-18

Family

ID=49005836

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147024611A KR101769337B1 (ko) 2012-02-21 2013-02-21 금속 분말 페이스트, 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP6212480B2 (fr)
KR (1) KR101769337B1 (fr)
CN (1) CN104115237B (fr)
TW (1) TWI527069B (fr)
WO (1) WO2013125659A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5843821B2 (ja) * 2013-08-13 2016-01-13 Jx日鉱日石金属株式会社 金属粉ペースト、及びその製造方法
JP6324253B2 (ja) * 2014-07-30 2018-05-16 Ｊｘ金属株式会社 導電性ペースト及びその製造方法
KR102410080B1 (ko) * 2014-07-31 2022-06-16 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 페이스트
CN105086419B (zh) * 2015-08-11 2017-08-01 东华大学 一种可电镀性含氟聚酰亚胺改性工程塑料合金及其制备方法
JP6630208B2 (ja) * 2016-03-28 2020-01-15 Ｊｘｔｇエネルギー株式会社 金属粉ペーストの製造方法、金属粉ペーストのスクリーン印刷方法、電極の製造方法、チップ積層セラミックコンデンサーの製造方法および金属粉ペースト
KR102379883B1 (ko) * 2016-04-28 2022-03-30 쇼와덴코머티리얼즈가부시끼가이샤 접합용 구리 페이스트, 접합체의 제조 방법 및 반도체 장치의 제조 방법
JP6526889B1 (ja) 2018-08-01 2019-06-05 Ｊｘ金属株式会社 セラミックス層と銅粉ペースト焼結体の積層体
JP6526888B1 (ja) 2018-08-01 2019-06-05 Ｊｘ金属株式会社 セラミックス層と銅粉ペースト焼結体の積層体
KR102217288B1 (ko) 2018-08-16 2021-02-19 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
JP6549298B1 (ja) 2018-09-21 2019-07-24 Ｊｘ金属株式会社 易解砕性銅粉及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002249803A (ja) * 2001-02-21 2002-09-06 Sumitomo Metal Mining Co Ltd 銅粉末の耐酸化処理方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118429B2 (ja) * 1988-06-02 1995-12-18 昭栄化学工業株式会社 積層コンデンサ内部電極用導電性塗料
JPH0428109A (ja) * 1990-05-24 1992-01-30 Asahi Chem Ind Co Ltd 銅系導電性ペースト並びに該ペーストを用いた導電体
JP3452033B2 (ja) * 2000-07-05 2003-09-29 株式会社村田製作所 導電性ペーストおよび積層セラミック電子部品
EP1637546B1 (fr) * 2003-06-26 2010-01-06 Sekisui Chemical Co., Ltd. Liant resine destine a une pate de revetement
JP4146823B2 (ja) * 2003-06-26 2008-09-10 積水化学工業株式会社 導電ペースト用バインダー樹脂及び導電ペースト
KR100709822B1 (ko) * 2004-12-15 2007-04-23 삼성전기주식회사 산 용액을 이용한 니켈 입자의 표면 처리 방법
KR100771773B1 (ko) * 2005-11-01 2007-10-30 삼성전기주식회사 복합니켈 입자 및 그 제조방법
JP5481811B2 (ja) * 2008-08-20 2014-04-23 株式会社村田製作所 無機粉末ペーストの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002249803A (ja) * 2001-02-21 2002-09-06 Sumitomo Metal Mining Co Ltd 銅粉末の耐酸化処理方法

Also Published As

Publication number Publication date
CN104115237B (zh) 2018-09-07
TWI527069B (zh) 2016-03-21
WO2013125659A1 (fr) 2013-08-29
JP6212480B2 (ja) 2017-10-11
CN104115237A (zh) 2014-10-22
JPWO2013125659A1 (ja) 2015-07-30
TW201344723A (zh) 2013-11-01
KR20140126731A (ko) 2014-10-31

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