KR101763908B1 - 금속 부품의 제조방법, 및 복합 성형체 - Google Patents

금속 부품의 제조방법, 및 복합 성형체 Download PDF

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Publication number
KR101763908B1
KR101763908B1 KR1020130133808A KR20130133808A KR101763908B1 KR 101763908 B1 KR101763908 B1 KR 101763908B1 KR 1020130133808 A KR1020130133808 A KR 1020130133808A KR 20130133808 A KR20130133808 A KR 20130133808A KR 101763908 B1 KR101763908 B1 KR 101763908B1
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KR
South Korea
Prior art keywords
metal
resin
metal part
thermoplastic resin
laser
Prior art date
Application number
KR1020130133808A
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English (en)
Korean (ko)
Other versions
KR20140090930A (ko
Inventor
히데미 콘도
다이스케 요리후지
마사유키 사토
Original Assignee
포리프라스틱 가부시키가이샤
야마세 일렉트릭 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 포리프라스틱 가부시키가이샤, 야마세 일렉트릭 컴퍼니 리미티드 filed Critical 포리프라스틱 가부시키가이샤
Publication of KR20140090930A publication Critical patent/KR20140090930A/ko
Application granted granted Critical
Publication of KR101763908B1 publication Critical patent/KR101763908B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, e.g. roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
KR1020130133808A 2012-12-14 2013-11-05 금속 부품의 제조방법, 및 복합 성형체 KR101763908B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012273996A JP5843750B2 (ja) 2012-12-14 2012-12-14 金属部品の製造方法、及び複合成形体
JPJP-P-2012-273996 2012-12-14

Publications (2)

Publication Number Publication Date
KR20140090930A KR20140090930A (ko) 2014-07-18
KR101763908B1 true KR101763908B1 (ko) 2017-08-01

Family

ID=50901507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130133808A KR101763908B1 (ko) 2012-12-14 2013-11-05 금속 부품의 제조방법, 및 복합 성형체

Country Status (4)

Country Link
JP (1) JP5843750B2 (ja)
KR (1) KR101763908B1 (ja)
CN (1) CN103862164B (ja)
TW (1) TWI513531B (ja)

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DE102014210486B4 (de) * 2014-06-03 2016-08-04 Lpkf Laser & Electronics Ag Verfahren zum Verschweißen zweier Fügepartner aus thermoplastischen Kunststoffen entlang einer Schweißnaht mittels Laser
US9764383B2 (en) * 2014-10-02 2017-09-19 Continental Automotive Systems, Inc. Laser trimming surface cleaning for adhesion to cast metals
JP6496536B2 (ja) * 2014-12-05 2019-04-03 ダイセルポリマー株式会社 軸一体型歯車とその製造方法
JP6485398B2 (ja) 2016-04-13 2019-03-20 株式会社デンソー 電子装置及びその製造方法
WO2018043637A1 (ja) * 2016-09-02 2018-03-08 ダイセルポリマー株式会社 金属成形体の粗面化方法
HUE055789T2 (hu) 2016-09-30 2021-12-28 Lg Chemical Ltd Heterogén anyagok összekötött szerkezete, és eljárás ennek gyártására
JPWO2018181526A1 (ja) * 2017-03-31 2020-02-06 ダイセルポリマー株式会社 医療器具とその製造方法
JP6902394B2 (ja) * 2017-05-15 2021-07-14 ポリプラスチックス株式会社 シール性を有する複合成形品
JP6902950B2 (ja) * 2017-07-20 2021-07-14 ポリプラスチックス株式会社 金属樹脂複合成形品およびその製造方法
KR102145356B1 (ko) * 2018-08-29 2020-08-19 한국생산기술연구원 선택적 레이저 용융 적층 성형을 이용한 다공성 부품 제조 방법 및 상기 방법에 의해 제작된 다공성 부품
CN110524116B (zh) * 2019-08-29 2024-05-07 辽宁中蓝光电科技有限公司 一种提升手机用镜头消杂光性能的激光毛化方法
CN110756997B (zh) * 2019-11-08 2022-09-13 核工业理化工程研究院 提高铝箔粘接强度的表面处理方法
JP7435510B2 (ja) * 2021-03-12 2024-02-21 トヨタ自動車株式会社 燃料電池セルの製造方法
JP2023059622A (ja) * 2021-10-15 2023-04-27 日本軽金属株式会社 金属部材及び金属樹脂接合体並びにそれらの製造方法
JP2023059627A (ja) * 2021-10-15 2023-04-27 日本軽金属株式会社 金属部材及び金属樹脂接合体並びにそれらの製造方法

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JP2007008077A (ja) 2005-07-01 2007-01-18 Denso Corp 樹脂接合体及びその接合方法
JP2010167475A (ja) * 2009-01-26 2010-08-05 Yamase Denki Kk 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料及びその製造方法

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TWI353303B (en) * 2004-09-07 2011-12-01 Toray Industries Sandwich structure and integrated molding using th
JP4020957B2 (ja) * 2005-12-19 2007-12-12 ヤマセ電気株式会社 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法
JP5292828B2 (ja) * 2007-01-30 2013-09-18 東レ株式会社 熱可塑性樹脂成形品と金属の複合体の製造方法
TWI369009B (en) * 2007-09-21 2012-07-21 Nat Univ Chung Hsing Light-emitting chip device with high thermal conductivity
JP5286046B2 (ja) * 2007-11-30 2013-09-11 株式会社半導体エネルギー研究所 光電変換装置の製造方法
JPWO2009151099A1 (ja) * 2008-06-12 2011-11-17 日本軽金属株式会社 アルミ・樹脂射出一体成形品及びその製造方法
TW201021995A (en) * 2008-12-05 2010-06-16 Chenming Mold Ind Corp Method for embedding plastics into porous structure and combining it with metal substrate
CN102026503B (zh) * 2009-09-17 2012-07-18 汉达精密电子(昆山)有限公司 结合制程方法
TWI398012B (zh) * 2009-11-04 2013-06-01 Nat Chung Cheng University Inv 用於太陽能電池之多雷射光束表面粗化方法以及具粗化表面的太陽能電池
JP5577707B2 (ja) * 2010-01-12 2014-08-27 日本軽金属株式会社 アルミニウム合金板と樹脂部材とのレーザー接合方法
JP2013052669A (ja) * 2010-12-28 2013-03-21 Daicel Corp 複合成形体の製造方法
TWI422068B (zh) * 2011-02-18 2014-01-01 Univ Nat Cheng Kung 粗化方法及具粗化表面之發光二極體製備方法
JP5629637B2 (ja) * 2011-04-28 2014-11-26 新神戸電機株式会社 樹脂成形品及びその製造方法
JP5848104B2 (ja) * 2011-11-21 2016-01-27 株式会社ダイセル 複合成形体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007008077A (ja) 2005-07-01 2007-01-18 Denso Corp 樹脂接合体及びその接合方法
JP2010167475A (ja) * 2009-01-26 2010-08-05 Yamase Denki Kk 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料及びその製造方法

Also Published As

Publication number Publication date
JP5843750B2 (ja) 2016-01-13
CN103862164A (zh) 2014-06-18
CN103862164B (zh) 2016-08-17
JP2014117724A (ja) 2014-06-30
TW201436916A (zh) 2014-10-01
TWI513531B (zh) 2015-12-21
KR20140090930A (ko) 2014-07-18

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