TWI513531B - A method of manufacturing a metal element, and a composite molded body - Google Patents

A method of manufacturing a metal element, and a composite molded body Download PDF

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Publication number
TWI513531B
TWI513531B TW102139910A TW102139910A TWI513531B TW I513531 B TWI513531 B TW I513531B TW 102139910 A TW102139910 A TW 102139910A TW 102139910 A TW102139910 A TW 102139910A TW I513531 B TWI513531 B TW I513531B
Authority
TW
Taiwan
Prior art keywords
resin
metal
rough
thermoplastic resin
rough surface
Prior art date
Application number
TW102139910A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436916A (zh
Inventor
Hidemi Kondo
Daisuke Yorifuji
Masayuki Satoh
Original Assignee
Polyplastics Co
Yamase Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co, Yamase Electric Co Ltd filed Critical Polyplastics Co
Publication of TW201436916A publication Critical patent/TW201436916A/zh
Application granted granted Critical
Publication of TWI513531B publication Critical patent/TWI513531B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, e.g. roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
TW102139910A 2012-12-14 2013-11-04 A method of manufacturing a metal element, and a composite molded body TWI513531B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012273996A JP5843750B2 (ja) 2012-12-14 2012-12-14 金属部品の製造方法、及び複合成形体

Publications (2)

Publication Number Publication Date
TW201436916A TW201436916A (zh) 2014-10-01
TWI513531B true TWI513531B (zh) 2015-12-21

Family

ID=50901507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102139910A TWI513531B (zh) 2012-12-14 2013-11-04 A method of manufacturing a metal element, and a composite molded body

Country Status (4)

Country Link
JP (1) JP5843750B2 (ja)
KR (1) KR101763908B1 (ja)
CN (1) CN103862164B (ja)
TW (1) TWI513531B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737802B (zh) * 2016-09-02 2021-09-01 日商大賽璐塑膠股份有限公司 金屬成形體的粗面化方法

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DE102014210486B4 (de) * 2014-06-03 2016-08-04 Lpkf Laser & Electronics Ag Verfahren zum Verschweißen zweier Fügepartner aus thermoplastischen Kunststoffen entlang einer Schweißnaht mittels Laser
US9764383B2 (en) * 2014-10-02 2017-09-19 Continental Automotive Systems, Inc. Laser trimming surface cleaning for adhesion to cast metals
JP6496536B2 (ja) * 2014-12-05 2019-04-03 ダイセルポリマー株式会社 軸一体型歯車とその製造方法
JP6485398B2 (ja) 2016-04-13 2019-03-20 株式会社デンソー 電子装置及びその製造方法
HUE055789T2 (hu) 2016-09-30 2021-12-28 Lg Chemical Ltd Heterogén anyagok összekötött szerkezete, és eljárás ennek gyártására
JPWO2018181526A1 (ja) * 2017-03-31 2020-02-06 ダイセルポリマー株式会社 医療器具とその製造方法
JP6902394B2 (ja) * 2017-05-15 2021-07-14 ポリプラスチックス株式会社 シール性を有する複合成形品
JP6902950B2 (ja) * 2017-07-20 2021-07-14 ポリプラスチックス株式会社 金属樹脂複合成形品およびその製造方法
KR102145356B1 (ko) * 2018-08-29 2020-08-19 한국생산기술연구원 선택적 레이저 용융 적층 성형을 이용한 다공성 부품 제조 방법 및 상기 방법에 의해 제작된 다공성 부품
CN110524116B (zh) * 2019-08-29 2024-05-07 辽宁中蓝光电科技有限公司 一种提升手机用镜头消杂光性能的激光毛化方法
CN110756997B (zh) * 2019-11-08 2022-09-13 核工业理化工程研究院 提高铝箔粘接强度的表面处理方法
JP7435510B2 (ja) * 2021-03-12 2024-02-21 トヨタ自動車株式会社 燃料電池セルの製造方法
JP2023059622A (ja) * 2021-10-15 2023-04-27 日本軽金属株式会社 金属部材及び金属樹脂接合体並びにそれらの製造方法
JP2023059627A (ja) * 2021-10-15 2023-04-27 日本軽金属株式会社 金属部材及び金属樹脂接合体並びにそれらの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007072603A1 (ja) * 2005-12-19 2007-06-28 Yamase Electric Co., Ltd. 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法
US20090127575A1 (en) * 2007-09-21 2009-05-21 Ray-Hua Horng Light-Emitting Diode Chip With High Light Extraction And Method For Manufacturing The Same
US7674647B2 (en) * 2007-11-30 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing photoelectric conversion device
TW201021995A (en) * 2008-12-05 2010-06-16 Chenming Mold Ind Corp Method for embedding plastics into porous structure and combining it with metal substrate
JP2010167475A (ja) * 2009-01-26 2010-08-05 Yamase Denki Kk 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料及びその製造方法
TW201117411A (en) * 2009-11-04 2011-05-16 Nat Chung Cheng University Inv Surface texturization of solar cell by using multiple-laser beams ablation and solar cell with surface texturization
TW201143951A (en) * 2010-01-12 2011-12-16 Nippon Light Metal Co Method for laser-joining of aluminum alloy plate and resin member together
WO2012090671A1 (ja) * 2010-12-28 2012-07-05 株式会社ダイセル 複合成形体の製造方法
TW201236199A (en) * 2011-02-18 2012-09-01 Univ Nat Cheng Kung Roughening method and method for manufacturing light emitting diode having roughened surface

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KR20000068004A (ko) * 1996-07-23 2000-11-25 시바 스폐셜티 케미칼스 홀딩 인코포레이티드 금속 표면 처리 방법
TWI353303B (en) * 2004-09-07 2011-12-01 Toray Industries Sandwich structure and integrated molding using th
JP2007008077A (ja) 2005-07-01 2007-01-18 Denso Corp 樹脂接合体及びその接合方法
JP5292828B2 (ja) * 2007-01-30 2013-09-18 東レ株式会社 熱可塑性樹脂成形品と金属の複合体の製造方法
JPWO2009151099A1 (ja) * 2008-06-12 2011-11-17 日本軽金属株式会社 アルミ・樹脂射出一体成形品及びその製造方法
CN102026503B (zh) * 2009-09-17 2012-07-18 汉达精密电子(昆山)有限公司 结合制程方法
JP5629637B2 (ja) * 2011-04-28 2014-11-26 新神戸電機株式会社 樹脂成形品及びその製造方法
JP5848104B2 (ja) * 2011-11-21 2016-01-27 株式会社ダイセル 複合成形体の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007072603A1 (ja) * 2005-12-19 2007-06-28 Yamase Electric Co., Ltd. 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法
US20090127575A1 (en) * 2007-09-21 2009-05-21 Ray-Hua Horng Light-Emitting Diode Chip With High Light Extraction And Method For Manufacturing The Same
US7674647B2 (en) * 2007-11-30 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing photoelectric conversion device
TW201021995A (en) * 2008-12-05 2010-06-16 Chenming Mold Ind Corp Method for embedding plastics into porous structure and combining it with metal substrate
JP2010167475A (ja) * 2009-01-26 2010-08-05 Yamase Denki Kk 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料及びその製造方法
TW201117411A (en) * 2009-11-04 2011-05-16 Nat Chung Cheng University Inv Surface texturization of solar cell by using multiple-laser beams ablation and solar cell with surface texturization
TW201143951A (en) * 2010-01-12 2011-12-16 Nippon Light Metal Co Method for laser-joining of aluminum alloy plate and resin member together
WO2012090671A1 (ja) * 2010-12-28 2012-07-05 株式会社ダイセル 複合成形体の製造方法
TW201236199A (en) * 2011-02-18 2012-09-01 Univ Nat Cheng Kung Roughening method and method for manufacturing light emitting diode having roughened surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737802B (zh) * 2016-09-02 2021-09-01 日商大賽璐塑膠股份有限公司 金屬成形體的粗面化方法

Also Published As

Publication number Publication date
JP5843750B2 (ja) 2016-01-13
CN103862164A (zh) 2014-06-18
KR101763908B1 (ko) 2017-08-01
CN103862164B (zh) 2016-08-17
JP2014117724A (ja) 2014-06-30
TW201436916A (zh) 2014-10-01
KR20140090930A (ko) 2014-07-18

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